Patents by Inventor Philippe Amstislavski

Philippe Amstislavski has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Thermal Insulation Material from Mycelium and Forestry Byproducts
    Publication number: 20230365916
    Abstract: Disclosed are biodegradable insulation materials comprising a structural scaffold; and at least one temperature resilient fungus. Also disclosed are methods of making and using biodegradable insulation materials comprising a structural scaffold; and at least one temperature resilient fungus. For example, disclosed are methods of insulating an infrastructure comprising administering the disclosed biodegradable insulation materials to an infrastructure.
    Type: Application
    Filed: May 17, 2023
    Publication date: November 16, 2023
    Inventors: Philippe Amstislavski, Zhaohui Yang, Maria D. White
  • Thermal Insulation Material from Mycelium and Forestry Byproducts
    Publication number: 20200255794
    Abstract: Disclosed are biodegradable insulation materials comprising a structural scaffold; and at least one temperature resilient fungus. Also disclosed are methods of making and using biodegradable insulation materials comprising a structural scaffold; and at least one temperature resilient fungus. For example, disclosed are methods of insulating an infrastructure comprising administering the disclosed biodegradable insulation materials to an infrastructure.
    Type: Application
    Filed: February 19, 2020
    Publication date: August 13, 2020
    Inventors: Philippe Amstislavski, Zhaohui Yang, Maria D. White
  • Thermal insulation material from mycelium and forestry byproducts
    Patent number: 10604734
    Abstract: Disclosed are biodegradable insulation materials comprising a structural scaffold; and at least one temperature resilient fungus. Also disclosed are methods of making and using biodegradable insulation materials comprising a structural scaffold; and at least one temperature resilient fungus. For example, disclosed are methods of insulating an infrastructure comprising administering the disclosed biodegradable insulation materials to an infrastructure.
    Type: Grant
    Filed: January 27, 2017
    Date of Patent: March 31, 2020
    Assignee: UNIVERSITY OF ALASKA ANCHORAGE
    Inventors: Philippe Amstislavski, Zhaohui Yang, Maria D. White
  • Thermal Insulation Material from Mycelium and Forestry Byproducts
    Publication number: 20170218327
    Abstract: Disclosed are biodegradable insulation materials comprising a structural scaffold; and at least one temperature resilient fungus. Also disclosed are methods of making and using biodegradable insulation materials comprising a structural scaffold; and at least one temperature resilient fungus. For example, disclosed are methods of insulating an infrastructure comprising administering the disclosed biodegradable insulation materials to an infrastructure.
    Type: Application
    Filed: January 27, 2017
    Publication date: August 3, 2017
    Inventors: Philippe Amstislavski, Zhaohui Yang, Maria D. White