Patents by Inventor Philippe Brun
Philippe Brun has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12243895Abstract: The present disclosure relates to a method for manufacturing a pixel by: depositing an insulating layer on an exposed face of an interconnect structure of an integrated circuit, the interconnect structure having a conductive element flush with said exposed face; etching an opening passing through the insulating layer to the conductive element; depositing an electrode layer on and in contact with the conductive element and the insulating layer; defining an electrode by removing, by etching, part of the electrode layer resting on the insulating layer; and depositing a film configured to convert photons into electron-hole pairs when a ray at an operating wavelength of the pixel reaches the pixel.Type: GrantFiled: March 24, 2021Date of Patent: March 4, 2025Assignee: STMicroelectronics (Crolles 2) SASInventors: Thierry Berger, Marc Neyens, Audrey Vandelle Berthoud, Marc Guillermet, Philippe Brun
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Patent number: 12232435Abstract: An integrated circuit includes a substrate with an active area, a first insulating layer, a second insulating layer, and a phase-change material. The integrated circuit further includes a heating element in an L-shape, with a long side in direct physical contact with the phase-change material and a short side in direct physical contact with a via. The heating element is surrounded by first, second, and third insulating spacers, with the first insulating spacer having a planar first sidewall in contact with the long side of the heating element, a convex second sidewall, and a planar bottom face in contact with the short side of the heating element. The second and third insulating spacers are in direct contact with the first insulating spacer and the long side of the heating element.Type: GrantFiled: April 3, 2023Date of Patent: February 18, 2025Assignees: STMicroelectronics (Crolles 2) SAS, STMicroelectronics (Grenoble 2) SAS, STMicroelectronics (Rousset) SASInventors: Franck Arnaud, David Galpin, Stephane Zoll, Olivier Hinsinger, Laurent Favennec, Jean-Pierre Oddou, Lucile Broussous, Philippe Boivin, Olivier Weber, Philippe Brun, Pierre Morin
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Patent number: 12210062Abstract: A monitored switch gear device that includes a switch gear, a plurality of magnets, a magnetic field sensor and a processing circuitry. The switch gear includes an opening/closing mechanism adapted to selectively open and close an electrical circuit. The opening/closing mechanism includes a pivotally mounted shaft configured to rotate about a pivot axis as the opening/closing mechanism moves between an open and a closed state. The magnets of the plurality of magnets are spaced from each other and fixedly attached to the shaft. The magnetic field sensor senses a magnetic field generated by each magnet of the plurality of magnets as the shaft pivots. Each magnet of the plurality of magnets defines a different angular position of the shaft detected by the magnetic field sensor in which the magnetic field sensor senses a respective magnet of the plurality of magnets.Type: GrantFiled: January 10, 2023Date of Patent: January 28, 2025Assignee: Schneider Electric Industries SASInventors: Philippe Brun, Vladislav Kraynov, Farid Allab
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Patent number: 12051553Abstract: A method for determining an operational status of a switching device for switching an electrical unit including a first circuit and a second circuit, each circuit respectively including: a vacuum breaker including a fixed electrode and a mobile electrode; and a control device connected to the mobile electrode via an elastic device. The method including: for each of the first and second circuits, determining a transition instant at which the mobile electrode comes into contact with the fixed electrode; determining a difference between the transition instant of the first vacuum breaker and the transition instant of the second vacuum breaker; determining that the operational status is a first status known as “nominal synchronization” if the difference is less than a threshold; and determining that the operational status is a second status known as “abnormal synchronization” if the difference is greater than the threshold.Type: GrantFiled: July 21, 2022Date of Patent: July 30, 2024Assignee: Schneider Electric Industries SASInventors: Diego Alberto, Philippe Brun
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Patent number: 12048257Abstract: A method for manufacturing an interconnection structure for an integrated circuit is provided. The integrated circuit includes a first insulating layer, a second insulating layer, and a third insulating layer. Electrical contacts pass through the first insulating layer, and a component having an electrical contact region is located in the second insulating layer. The method includes etching a first opening in the third layer, vertically aligned with the contact region. A fourth insulating layer is deposited to fill in the opening, and a second opening is etched to the contact region by passing through the opening in the third insulating layer. A metal level is formed by filling in the second opening with a metal.Type: GrantFiled: April 5, 2023Date of Patent: July 23, 2024Assignee: STMicroelectronics (Crolles 2) SASInventors: Jean-Philippe Reynard, Sylvie Del Medico, Philippe Brun
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Publication number: 20230349787Abstract: A method for determining a quantity of a gas contained in a tank of an insulated switchgear. The method includes: (i) acquiring a first temperature and a second temperature measured by a gas temperature sensor respectively at a first instant and at a second instant during a calibration phase; (ii) acquiring a first pressure and a second pressure measured by a gas pressure sensor at the first instant and at the second instant; (iii) determining a steady-state model of the tank thermal exchanges from the first and second acquired temperature and from the first and second acquired pressure; (iv) acquiring a gas temperature, a gas pressure and an ambient temperature during a measurement phase and (v) calculating the quantity of the gas contained in the tank from the acquired gas temperature, the acquired gas pressure, the acquired ambient temperature and from the determined steady state model.Type: ApplicationFiled: April 18, 2023Publication date: November 2, 2023Applicant: Schneider Electric Industries SASInventors: Diego Alberto, Philippe Brun, Raimund Summer
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Publication number: 20230263082Abstract: An integrated circuit includes a substrate with an active area, a first insulating layer, a second insulating layer, and a phase-change material. The integrated circuit further includes a heating element in an L-shape, with a long side in direct physical contact with the phase-change material and a short side in direct physical contact with a via. The heating element is surrounded by first, second, and third insulating spacers, with the first insulating spacer having a planar first sidewall in contact with the long side of the heating element, a convex second sidewall, and a planar bottom face in contact with the short side of the heating element. The second and third insulating spacers are in direct contact with the first insulating spacer and the long side of the heating element.Type: ApplicationFiled: April 3, 2023Publication date: August 17, 2023Applicants: STMicroelectronics (Crolles 2) SAS, STMicroelectronics (Grenoble 2) SAS, STMicroelectronics (Rousset) SASInventors: Franck ARNAUD, David GALPIN, Stephane ZOLL, Olivier HINSINGER, Laurent FAVENNEC, Jean-Pierre ODDOU, Lucile BROUSSOUS, Philippe BOIVIN, Olivier WEBER, Philippe BRUN, Pierre MORIN
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Publication number: 20230247919Abstract: A method for manufacturing an interconnection structure for an integrated circuit is provided. The integrated circuit includes a first insulating layer, a second insulating layer, and a third insulating layer. Electrical contacts pass through the first insulating layer, and a component having an electrical contact region is located in the second insulating layer. The method includes etching a first opening in the third layer, vertically aligned with the contact region. A fourth insulating layer is deposited to fill in the opening, and a second opening is etched to the contact region by passing through the opening in the third insulating layer. A metal level is formed by filling in the second opening with a metal.Type: ApplicationFiled: April 5, 2023Publication date: August 3, 2023Applicants: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES, STMicroelectronics (Crolles 2) SASInventors: Jean-Philippe REYNARD, Sylvie DEL MEDICO, Philippe Brun
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Publication number: 20230228816Abstract: A monitored switch gear device that includes a switch gear, a plurality of magnets, a magnetic field sensor and a processing circuitry. The switch gear includes an opening/closing mechanism adapted to selectively open and close an electrical circuit. The opening/closing mechanism includes a pivotally mounted shaft configured to rotate about a pivot axis as the opening/closing mechanism moves between an open and a closed state. The magnets of the plurality of magnets are spaced from each other and fixedly attached to the shaft. The magnetic field sensor senses a magnetic field generated by each magnet of the plurality of magnets as the shaft pivots. Each magnet of the plurality of magnets defines a different angular position of the shaft detected by the magnetic field sensor in which the magnetic field sensor senses a respective magnet of the plurality of magnets.Type: ApplicationFiled: January 10, 2023Publication date: July 20, 2023Applicant: Schneider Electric Industries SASInventors: Philippe Brun, Vladislav Kraynov, Farid Allab
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Patent number: 11654033Abstract: A distractible intervertebral implant configured to be inserted in an insertion direction into an intervertebral space that is defined between a first vertebral body and a second vertebral body is disclosed. The implant may include a first body and a second body. The first body may define an outer surface that is configured to engage the first vertebral body, and an opposing inner surface that defines a rail. The second body may define an outer surface that is configured to engage the second vertebral body, and an inner surface that defines a recess configured to receive the rail of the first body. The second body moves in a vertical direction toward the second vertebral body as the second body is slid over the first body and the rail is received in the recess.Type: GrantFiled: December 27, 2019Date of Patent: May 23, 2023Assignee: DePuy Synthes Products, Inc.Inventors: Jann-Paul Suedkamp, Sean Saidha, Philipp Brun
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Patent number: 11653582Abstract: An electronic chip includes memory cells made of a phase-change material and a transistor. First and second vias extend from the transistor through an intermediate insulating layer to a same height. A first metal level including a first interconnection track in contact with the first via is located over the intermediate insulating layer. A heating element for heating the phase-change material is located on the second via, and the phase-change material is located on the heating element. A second metal level including a second interconnection track is located above the phase-change material. A third via extends from the phase-change material to the second interconnection track.Type: GrantFiled: November 8, 2018Date of Patent: May 16, 2023Assignees: STMicroelectronics (Crolles 2) SAS, STMicroelectronics (Grenoble 2) SAS, STMicroelectronics (Rousset) SASInventors: Franck Arnaud, David Galpin, Stephane Zoll, Olivier Hinsinger, Laurent Favennec, Jean-Pierre Oddou, Lucile Broussous, Philippe Boivin, Olivier Weber, Philippe Brun, Pierre Morin
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Patent number: 11653577Abstract: A method for manufacturing an interconnection structure for an integrated circuit is provided. The integrated circuit includes a first insulating layer, a second insulating layer, and a third insulating layer. Electrical contacts pass through the first insulating layer, and a component having an electrical contact region is located in the second insulating layer. The method includes etching a first opening in the third layer, vertically aligned with the contact region. A fourth insulating layer is deposited to fill in the opening, and a second opening is etched to the contact region by passing through the opening in the third insulating layer. A metal level is formed by filling in the second opening with a metal.Type: GrantFiled: December 4, 2020Date of Patent: May 16, 2023Assignee: STMICROELECTRONICS (CROLLES 2) SASInventors: Jean-Philippe Reynard, Sylvie Del Medico, Philippe Brun
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Publication number: 20230025832Abstract: A method for determining an operational status of a switching device for switching an electrical unit including a first circuit and a second circuit, each circuit respectively including: a vacuum breaker including a fixed electrode and a mobile electrode; and a control device connected to the mobile electrode via an elastic device. The method including: for each of the first and second circuits, determining a transition instant at which the mobile electrode comes into contact with the fixed electrode; determining a difference between the transition instant of the first vacuum breaker and the transition instant of the second vacuum breaker; determining that the operational status is a first status known as “nominal synchronization” if the difference is less than a threshold; and determining that the operational status is a second status known as “abnormal synchronization” if the difference is greater than the threshold.Type: ApplicationFiled: July 21, 2022Publication date: January 26, 2023Applicant: Schneider Electric Industries SASInventors: Diego Alberto, Philippe Brun
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Patent number: 11177090Abstract: Method for detecting a state of a switching unit, the switching unit comprising an element that is movable between a first position and a second position.Type: GrantFiled: September 22, 2020Date of Patent: November 16, 2021Assignee: Schneider Electric Industries SASInventors: Nicolas Rossi, Diego Alberto, Philippe Brun
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Publication number: 20210305306Abstract: The present disclosure relates to a method for manufacturing a pixel by: depositing an insulating layer on an exposed face of an interconnect structure of an integrated circuit, the interconnect structure having a conductive element flush with said exposed face; etching an opening passing through the insulating layer to the conductive element; depositing an electrode layer on and in contact with the conductive element and the insulating layer; defining an electrode by removing, by etching, part of the electrode layer resting on the insulating layer; and depositing a film configured to convert photons into electron-hole pairs when a ray at an operating wavelength of the pixel reaches the pixel.Type: ApplicationFiled: March 24, 2021Publication date: September 30, 2021Applicant: STMICROELECTRONICS (CROLLES 2) SASInventors: Thierry BERGER, Marc NEYENS, Audrey Vandelle BERTHOUD, Marc GUILLERMET, Philippe BRUN
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Publication number: 20210175422Abstract: A method for manufacturing an interconnection structure for an integrated circuit is provided. The integrated circuit includes a first insulating layer, a second insulating layer, and a third insulating layer. Electrical contacts pass through the first insulating layer, and a component having an electrical contact region is located in the second insulating layer. The method includes etching a first opening in the third layer, vertically aligned with the contact region. A fourth insulating layer is deposited to fill in the opening, and a second opening is etched to the contact region by passing through the opening in the third insulating layer. A metal level is formed by filling in the second opening with a metal.Type: ApplicationFiled: December 4, 2020Publication date: June 10, 2021Inventors: Jean-Philippe REYNARD, Sylvie DEL MEDICO, Philippe Brun
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Publication number: 20210090823Abstract: Method for detecting a state of a switching unit, the switching unit comprising an element that is movable between a first position and a second position.Type: ApplicationFiled: September 22, 2020Publication date: March 25, 2021Applicant: Schneider Electric Industries SASInventors: Nicolas ROSSI, Diego ALBERTO, Philippe BRUN
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Patent number: 10864063Abstract: The present invention relates to a dental implant replica (10) for a physical dental model (36), the dental implant replica including: a coronal end (14); an apical end (18); a coronal portion (12) extending to the coronal end; an cylindrical apical portion (16) extending to the apical end and including a circumventing indentation (20); an anti-rotation portion (26) located between the coronal portion and the apical portion and including at least one external convex element (28; 28a-c) extending in a longitudinal direction of the dental implant replica; and a prosthetic connection interface (34) located at the coronal end. The present invention also relates to a system including a dental implant replica and a physical dental model, a 3D printed or milled dental model, and a method of installing a dental implant replica in a dental model.Type: GrantFiled: October 10, 2014Date of Patent: December 15, 2020Assignee: Nobel Biocare Services AGInventor: Philipp Brun
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Publication number: 20200129308Abstract: A distractible intervertebral implant configured to be inserted in an insertion direction into an intervertebral space that is defined between a first vertebral body and a second vertebral body is disclosed. The implant may include a first body and a second body. The first body may define an outer surface that is configured to engage the first vertebral body, and an opposing inner surface that defines a rail. The second body may define an outer surface that is configured to engage the second vertebral body, and an inner surface that defines a recess configured to receive the rail of the first body. The second body moves in a vertical direction toward the second vertebral body as the second body is slid over the first body and the rail is received in the recess.Type: ApplicationFiled: December 27, 2019Publication date: April 30, 2020Inventors: Jann-Paul Suedkamp, Sean Saidha, Philipp Brun
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Patent number: 10548741Abstract: A distractible intervertebral implant configured to be inserted in an insertion direction into an intervertebral space that is defined between a first vertebral body and a second vertebral body is disclosed. The implant may include a first body and a second body. The first body may define an outer surface that is configured to engage the first vertebral body, and an opposing inner surface that defines a rail. The second body may define an outer surface that is configured to engage the second vertebral body, and an inner surface that defines a recess configured to receive the rail of the first body. The second body moves in a vertical direction toward the second vertebral body as the second body is slid over the first body and the rail is received in the recess.Type: GrantFiled: January 20, 2017Date of Patent: February 4, 2020Assignee: DePuy Synthes Products, Inc.Inventors: Jann-Paul Suedkamp, Sean Saidha, Philipp Brun