Abstract: The invention concerns an electronic module comprising: a printed circuit (10) including a flexible or semirigid substrate (12) provided with an array of strip conductors (14) deposited on each of its sides and with a plurality of contact pads (16) deposited on its upper side and connected to its array of conductor strips; at least an electronic chip (18), provided on its active surface with conductive bumps (20) respectively pressed on the contact pads; and a non-conductive adhesive layer (22) assembling the substrate and the chip. To avoid deformation of the module when the chip is being fixed by application of temperature and pressure, the substrate (12) is provided, on its lower side, with a plurality of reinforcing regions (24) arranged each opposite the contact pads (16).

Abstract: A control method for detonators (1) fitted with an electronic ignition module (15). Each module (15) is associated with specific parameters including at least one identification parameter and one explosion delay time, and includes a firing capacitor and a rudimentary internal clock. The modules (15) are capable of establishing a dialogue with a firing control unit (17) fitted with a reference time basis. The identification parameters are stored in the modules using a programming unit (18); the specific parameters are stored in the firing control unit (17); for each successive module, its internal clock is calibrated using the firing control unit and the associated delay time is sent to the module; the modules are ordered to load the firing capacitors; and a firing order is sent to the modules using the firing control unit, triggering off eventual resetting of the internal clocks as well as a firing sequence.

Abstract: An electronic watch module and method of manufacturing the module. The module is formed from a flexible film by forming a set of appropriately located, sized and shaped component openings in the film, forming a second set of terminal lead bonding openings for the components, securing a metallic foil to said film, removing portions of said foil to form a pattern of interconnection leads for said components leaving portions over said bonding openings, locating the components in the respective openings with the component leads in registry with their respective interconnection leads, and bonding the foil leads to the component leads through the bonding openings.