Patents by Inventor Philippe De Gasquet

Philippe De Gasquet has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9647151
    Abstract: The invention relates to manufacturing a I-III-VI compound in the form of a thin film for use in photovoltaics, including the steps of: a) electrodepositing a thin-film structure, consisting of I and/or III elements, onto the surface of an electrode that forms a substrate (SUB); and b) incorporating at least one VI element into the structure so as to obtain the I-III-VI compound. According to the invention, the electrodeposition step comprises checking that the uniformity of the thickness of the thin film varies by no more than 3% over the entire surface of the substrate receiving the deposition.
    Type: Grant
    Filed: October 10, 2011
    Date of Patent: May 9, 2017
    Assignee: NEXCIS
    Inventors: Pierre-Philippe Grand, Salvador Jaime, Philippe De Gasquet, Hariklia Deligianni, Lubomyr T. Romankiw, Raman Vaidyanathan, Qiang Huang, Shafaat Ahmed
  • Publication number: 20130206233
    Abstract: The invention relates to manufacturing a I-III-VI compound in the form of a thin film for use in photovoltaics, including the steps of: a) electrodepositing a thin-film structure, consisting of I and/or III elements, onto the surface of an electrode that forms a substrate (SUB); and b) incorporating at least one VI element into the structure so as to obtain the I-III-VI compound. According to the invention, the electrodeposition step comprises checking that the uniformity of the thickness of the thin film varies by no more than 3% over the entire surface of the substrate receiving the deposition.
    Type: Application
    Filed: October 10, 2011
    Publication date: August 15, 2013
    Applicant: NECIS
    Inventors: Pierre-Philippe Grand, Salvador Jaime, Philippe De Gasquet, Hariklia Deligianni, Lubomyr T. Romankiw, Raman Vaidyantahan, Qiang Huang, Shafaat Ahmed