Abstract: This disclosure describes a power semiconductor module with at least one controlled power semiconductor bare die on an isolation substrate. The power semiconductor bare die includes a gate and a return control connection associated with pins that extend perpendicularly from the top of the power semiconductor bare die. One or more power terminals are connected to the isolation substrate.

Abstract: The temporary fastening system for joining upper and lower shell casings of a turbine to one another for maintenance purposes includes a stud/nut tensioning system employed in lieu of the conventional studs and nuts. Once the turbine is opened up and the inner shell and rotor removed, the upper and lower shell casings are temporarily secured to one another using studs received in registering openings in the horizontal flanges of the upper and lower shell casings and retainer plates serving as a stop for the stud/nut tensioning system. The tensioning system is hydraulically operated and avoids torsional force on the temporary studs. Once measurements are made, the turbine is again reopened and reassembled using the initially removed bolts or a third set of bolts to secure the upper and lower shell casings to one another.