Abstract: Disclosed is a computer containing electronic components incorporating a liquid-tight and gas-permeable ventilator, including, on a part of the computer, a unit for protecting the ventilator against liquid spraying, which is created by stamping sheet metal making up the part receiving the ventilator, the protection unit being placed on one of the edges of the sheet metal part and then being folded onto the ventilator in order to make up, for the latter, a shield against liquid spraying. Also disclosed is the associated method.

Abstract: Disclosed is a computer containing electronic components incorporating a liquid-tight and gas-permeable ventilator, including, on a part of the computer, a unit for protecting the ventilator against liquid spraying, which is created by stamping sheet metal making up the part receiving the ventilator, the protection unit being placed on one of the edges of the sheet metal part and then being folded onto the ventilator in order to make up, for the latter, a shield against liquid spraying. Also disclosed is the associated method.

Abstract: A heat conduction bus, particularly for a microprocessor-based computation unit, includes a single starting end, a heat-conducting strip (1) provided with a plurality of tabs (7-12) for solder-connecting to the connection terminals of electronic components likely to become hot, and a collector (4) joined to the strip (1) and arranged so as to channel and evacuate the thermal energy drained by the tabs (7-12) and passing through the strip (1). The heat conduction bus includes, at least in line with each of the tabs (11, 12) geometrically the closest to the collector (4), an opening (13, 14) provided in the strip (1) near to the tab (11, 12), so as to be located interposed between the tab and the collector (4) and to form an obstacle opposing the direct routing of the thermal energy between this tab (11, 12) and the collector.

Abstract: A heat conduction bus, particularly for a microprocessor-based computation unit, includes a single starting end, a heat-conducting strip (1) provided with a plurality of tabs (7-12) for solder-connecting to the connection terminals of electronic components likely to become hot, and a collector (4) joined to the strip (1) and arranged so as to channel and evacuate the thermal energy drained by the tabs (7-12) and passing through the strip (1). The heat conduction bus includes, at least in line with each of the tabs (11, 12) geometrically the closest to the collector (4), an opening (13, 14) provided in the strip (1) near to the tab (11, 12), so as to be located interposed between the tab and the collector (4) and to form an obstacle opposing the direct routing of the thermal energy between this tab (11, 12) and the collector.