Patents by Inventor Philippe Grosse
Philippe Grosse has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11680870Abstract: An optical testing circuit on a wafer includes an optical input configured to receive an optical test signal and photodetectors configured to generate corresponding electrical signals in response to optical processing of the optical test signal through the optical testing circuit. The electrical signals are simultaneously sensed by a probe circuit and then processed. In one process, test data from the electrical signals is simultaneously generated at each step of a sweep in wavelength of the optical test signal and output in response to a step change. In another process, the electrical signals are sequentially selected and the sweep in wavelength of the optical test signal is performed for each selected electrical signal to generate the test data.Type: GrantFiled: November 1, 2021Date of Patent: June 20, 2023Assignee: STMicroelectronics (Crolles 2) SASInventors: Philippe Grosse, Patrick Le Maitre, Jean-Francois Carpentier
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Publication number: 20220050010Abstract: An optical testing circuit on a wafer includes an optical input configured to receive an optical test signal and photodetectors configured to generate corresponding electrical signals in response to optical processing of the optical test signal through the optical testing circuit. The electrical signals are simultaneously sensed by a probe circuit and then processed. In one process, test data from the electrical signals is simultaneously generated at each step of a sweep in wavelength of the optical test signal and output in response to a step change. In another process, the electrical signals are sequentially selected and the sweep in wavelength of the optical test signal is performed for each selected electrical signal to generate the test data.Type: ApplicationFiled: November 1, 2021Publication date: February 17, 2022Applicant: STMicroelectronics (Crolles 2) SASInventors: Philippe GROSSE, Patrick LE MAITRE, Jean-Francois CARPENTIER
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Patent number: 11187613Abstract: An optical testing circuit on a wafer includes an optical input configured to receive an optical test signal and photodetectors configured to generate corresponding electrical signals in response to optical processing of the optical test signal through the optical testing circuit. The electrical signals are simultaneously sensed by a probe circuit and then processed. In one process, test data from the electrical signals is simultaneously generated at each step of a sweep in wavelength of the optical test signal and output in response to a step change. In another process, the electrical signals are sequentially selected and the sweep in wavelength of the optical test signal is performed for each selected electrical signal to generate the test data.Type: GrantFiled: April 30, 2020Date of Patent: November 30, 2021Assignee: STMicroelectronics (Crolles 2) SASInventors: Philippe Grosse, Patrick Le Maitre, Jean-Francois Carpentier
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Patent number: 11131710Abstract: A photonic circuit testing device, including a photonic test chip including, on the side of a first surface of the chip: micropillars, each intended to be placed in contact with a corresponding electric connection pad of the photonic circuit; and first optical input/output ports, each intended to be optically coupled to a second corresponding optical input/output port of the photonic circuit.Type: GrantFiled: November 21, 2019Date of Patent: September 28, 2021Assignee: Commissariat à l'Énergie Atomique et aux Énergies AlternativesInventors: Stéphane Bernabe, Philippe Grosse
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Publication number: 20200256759Abstract: An optical testing circuit on a wafer includes an optical input configured to receive an optical test signal and photodetectors configured to generate corresponding electrical signals in response to optical processing of the optical test signal through the optical testing circuit. The electrical signals are simultaneously sensed by a probe circuit and then processed. In one process, test data from the electrical signals is simultaneously generated at each step of a sweep in wavelength of the optical test signal and output in response to a step change. In another process, the electrical signals are sequentially selected and the sweep in wavelength of the optical test signal is performed for each selected electrical signal to generate the test data.Type: ApplicationFiled: April 30, 2020Publication date: August 13, 2020Applicant: STMicroelectronics (Crolles 2) SASInventors: Philippe GROSSE, Patrick LE MAITRE, Jean-Francois CARPENTIER
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Patent number: 10677684Abstract: An optical testing circuit on a wafer includes an optical input configured to receive an optical test signal and photodetectors configured to generate corresponding electrical signals in response to optical processing of the optical test signal through the optical testing circuit. The electrical signals are simultaneously sensed by a probe circuit and then processed. In one process, test data from the electrical signals is simultaneously generated at each step of a sweep in wavelength of the optical test signal and output in response to a step change. In another process, the electrical signals are sequentially selected and the sweep in wavelength of the optical test signal is performed for each selected electrical signal to generate the test data.Type: GrantFiled: December 6, 2018Date of Patent: June 9, 2020Assignee: STMicroelectronics (Crolles 2) SASInventors: Philippe Grosse, Patrick Le Maitre, Jean-Francois Carpentier
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Publication number: 20200174067Abstract: A photonic circuit testing device, including a photonic test chip including, on the side of a first surface of the chip: micropillars, each intended to be placed in contact with a corresponding electric connection pad of the photonic circuit; and first optical input/output ports, each intended to be optically coupled to a second corresponding optical input/output port of the photonic circuit.Type: ApplicationFiled: November 21, 2019Publication date: June 4, 2020Applicant: Commissariat à l'Énergie Atomique et aux Énergies AlternativesInventors: Stéphane Bernabe, Philippe Grosse
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Patent number: 10330865Abstract: A method of arranging a network of optical fiber ends opposite a corresponding network of waveguide ends of a semiconductor wafer displaceable with respect to each other in orthogonal directions X and Y, the method including: arranging the fibers so that the network ends have the same orientation and that the projection of the axis of each fiber on the wafer is parallel to direction Y; injecting, into one of the fibers, a light beam having a wavelength such that light is scattered from the fiber walls, locating the fiber axis, and displacing the fibers or the wafer in direction X to align a characteristic point in line with the projection of the fiber axis on the wafer.Type: GrantFiled: March 19, 2018Date of Patent: June 25, 2019Assignee: COMMISSARIAT À L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVESInventors: Philippe Grosse, Jean-François Carpentier, Patrick Le Maitre
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Publication number: 20190113415Abstract: An optical testing circuit on a wafer includes an optical input configured to receive an optical test signal and photodetectors configured to generate corresponding electrical signals in response to optical processing of the optical test signal through the optical testing circuit. The electrical signals are simultaneously sensed by a probe circuit and then processed. In one process, test data from the electrical signals is simultaneously generated at each step of a sweep in wavelength of the optical test signal and output in response to a step change. In another process, the electrical signals are sequentially selected and the sweep in wavelength of the optical test signal is performed for each selected electrical signal to generate the test data.Type: ApplicationFiled: December 6, 2018Publication date: April 18, 2019Applicant: STMicroelectronics (Crolles 2) SASInventors: Philippe GROSSE, Patrick LE MAITRE, Jean-Francois CARPENTIER
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Patent number: 10247890Abstract: A method of adjusting the parallelism of a surface of a block of optical fibers with a surface of a semiconductor chip or wafer laid on an XY table, including the steps of: a) providing a sensor rigidly attached to the XY table and a handling arm supporting the block, said surface facing the XY table; b) for each of three non-aligned points of the surface of the block, displacing with respect to each other the XY table and the block in the X and/or Y directions to place the sensor opposite the point, and estimating, with the sensor, the distance along the Z direction between the point and the sensor; and c) modifying the orientation of the block by means of the handling arm to provide the desired parallelism.Type: GrantFiled: March 9, 2018Date of Patent: April 2, 2019Assignee: Commissariat à l'Energie Atomique et aux Energies AlternativesInventor: Philippe Grosse
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Patent number: 10209442Abstract: Optical coupling of a photonic chip to an external device by use of a system with two lenses. The photonic chip comprises a light guide layer supported by a substrate and covered by an encapsulation layer, and a lens integrated into either the front face or the back face. The light guide layer includes a wave guide coupled to a surface grating coupler. An arrangement of one or several reflecting structures each on either the front face or the back face, is provided. This arrangement comprises a reflecting structure on the back face and is made so as to assure propagation of light between the surface grating coupler, and the lens along an optical path having at least one fold. The invention also covers the fabrication method of such a photonic chip.Type: GrantFiled: May 14, 2018Date of Patent: February 19, 2019Assignee: COMMISARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVESInventors: Sylvie Menezo, Stéphane Bernabe, Philippe Grosse
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Patent number: 10180373Abstract: An optical testing circuit on a wafer includes an optical input configured to receive an optical test signal and photodetectors configured to generate corresponding electrical signals in response to optical processing of the optical test signal through the optical testing circuit. The electrical signals are simultaneously sensed by a probe circuit and then processed. In one process, test data from the electrical signals is simultaneously generated at each step of a sweep in wavelength of the optical test signal and output in response to a step change. In another process, the electrical signals are sequentially selected and the sweep in wavelength of the optical test signal is performed for each selected electrical signal to generate the test data.Type: GrantFiled: April 17, 2017Date of Patent: January 15, 2019Assignee: STMicroelectronics (Crolles 2) SASInventors: Philippe Grosse, Patrick Le Maitre, Jean-Francois Carpentier
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Publication number: 20180335566Abstract: Optical coupling of a photonic chip to an external device by use of a system with two lenses. The photonic chip comprises a light guide layer supported by a substrate and covered by an encapsulation layer, and a lens integrated into either the front face or the back face. The light guide layer includes a wave guide coupled to a surface grating coupler. An arrangement of one or several reflecting structures each on either the front face or the back face, is provided. This arrangement comprises a reflecting structure on the back face and is made so as to assure propagation of light between the surface grating coupler, and the lens along an optical path having at least one fold. The invention also covers the fabrication method of such a photonic chip.Type: ApplicationFiled: May 14, 2018Publication date: November 22, 2018Inventors: Sylvie Menezo, Stéphane Bernabe, Philippe Grosse
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Publication number: 20180267244Abstract: A method of arranging a network of optical fiber ends opposite a corresponding network of waveguide ends of a semiconductor wafer displaceable with respect to each other in orthogonal directions X and Y, the method including: arranging the fibers so that the network ends have the same orientation and that the projection of the axis of each fiber on the wafer is parallel to direction Y; injecting, into one of the fibers, a light beam having a wavelength such that light is scattered from the fiber walls, locating the fiber axis, and displacing the fibers or the wafer in direction X to align a characteristic point in line with the projection of the fiber axis on the wafer.Type: ApplicationFiled: March 19, 2018Publication date: September 20, 2018Inventors: Philippe GROSSE, Jean-François CARPENTIER, Patrick LE MAITRE
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Publication number: 20180259727Abstract: A method of adjusting the parallelism of a surface of a block of optical fibers with a surface of a semiconductor chip or wafer laid on an XY table, including the steps of: a) providing a sensor rigidly attached to the XY table and a handling arm supporting the block, said surface facing the XY table; b) for each of three non-aligned points of the surface of the block, displacing with respect to each other the XY table and the block in the X and/or Y directions to place the sensor opposite the point, and estimating, with the sensor, the distance along the Z direction between the point and the sensor; and c) modifying the orientation of the block by means of the handling arm to provide the desired parallelism.Type: ApplicationFiled: March 9, 2018Publication date: September 13, 2018Inventor: Philippe Grosse
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Publication number: 20170307687Abstract: An optical testing circuit on a wafer includes an optical input configured to receive an optical test signal and photodetectors configured to generate corresponding electrical signals in response to optical processing of the optical test signal through the optical testing circuit. The electrical signals are simultaneously sensed by a probe circuit and then processed. In one process, test data from the electrical signals is simultaneously generated at each step of a sweep in wavelength of the optical test signal and output in response to a step change. In another process, the electrical signals are sequentially selected and the sweep in wavelength of the optical test signal is performed for each selected electrical signal to generate the test data.Type: ApplicationFiled: April 17, 2017Publication date: October 26, 2017Applicant: STMicroelectronics (Crolles 2) SASInventors: Philippe Grosse, Patrick Le Maitre, Jean-Francois Carpentier
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Patent number: 8693816Abstract: An optical duplexer intended to receive light at a first optical wavelength and to transmit back light at a second optical wavelength, including, on a substrate, successive layers forming a photoreceptor of the first optical wavelength, a selective filter letting through the first optical wavelength, and a waveguide having a surface including a grating which is transparent for the first optical wavelength and diffracting for the second optical wavelength.Type: GrantFiled: October 11, 2011Date of Patent: April 8, 2014Assignee: Commissariat a l'Energie Atomique et aux Energies AlternativesInventors: Christophe Kopp, Stéphane Bernabe, Philippe Grosse
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Publication number: 20120087621Abstract: An optical duplexer intended to receive light at a first optical wavelength and to transmit back light at a second optical wavelength, including, on a substrate, successive layers forming a photoreceptor of the first optical wavelength, a selective filter letting through the first optical wavelength, and a waveguide having a surface including a grating which is transparent for the first optical wavelength and diffracting for the second optical wavelength.Type: ApplicationFiled: October 11, 2011Publication date: April 12, 2012Applicant: Commissariat a L'Energie Atomique et aux Energies AlternativesInventors: Christophe KOPP, Stéphane Bernabe, Philippe Grosse
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Patent number: 7948615Abstract: A non-destructive method for characterizing a surface-illuminated integrated optical coupler associated with an optical waveguide, comprising the steps of measuring the reflection coefficient on a first region of the coupler at a distance from the optical waveguide and constructing a first curve, determining a first model of the reflection coefficient on the first region, performing a first parameter fitting between the first curve and the first model to determine first parameters, measuring the reflection coefficient on a second region of the coupler close to the guide, and constructing a second curve, determining a second model of the reflection coefficient on the second region, performing a second parameter fitting between the second curve and the second model to determine second parameters, and constructing the characteristic of the coupling efficiency of the coupler using the first and second parameters.Type: GrantFiled: April 14, 2009Date of Patent: May 24, 2011Assignees: Commissariat a l'Energie Atomique, Institut National des Sciences Appliquees de LyonInventors: Christophe Kopp, Philippe Grosse, Regis Orobtchouk
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Publication number: 20090262336Abstract: A non-destructive method for characterizing a surface-illuminated integrated optical coupler associated with an optical waveguide, comprising the steps of measuring the reflection coefficient on a first region of the coupler at a distance from the optical waveguide and constructing a first curve, determining a first model of the reflection coefficient on the first region, performing a first parameter fitting between the first curve and the first model to determine first parameters, measuring the reflection coefficient on a second region of the coupler close to the guide, and constructing a second curve, determining a second model of the reflection coefficient on the second region, performing a second parameter fitting between the second curve and the second model to determine second parameters, and constructing the characteristic of the coupling efficiency of the coupler using the first and second parameters.Type: ApplicationFiled: April 14, 2009Publication date: October 22, 2009Applicants: COMMISSARIAT A L-ENERGIE ATOMIQUE, INSTITUT NATIONAL DES SCIENCES APPLIQUEES DE LYONInventors: Christophe Kopp, Philippe Grosse, Regis Orobtchouk