Patents by Inventor Philippe Guaino

Philippe Guaino has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for the production of an optoelectronic module including a support comprising a metal substrate, a dielectric coating and a conductive layer
    Patent number: 10283420
    Abstract: The invention is directed to a method for the production of an optoelectronic module including a support (5) and an additional layer, said support being formed by an assembly (25) which has no optoelectronic properties and which comprises, successively, a metal substrate (27), a dielectric coating (29) disposed on the metal substrate, and an electrically conductive layer (31) disposed on the dielectric coating. The production method comprises: a step of providing the support and performing a method in which the support is checked, or providing the support after it has already been checked; and a step of depositing at least one additional layer on the electrically conductive layer.
    Type: Grant
    Filed: December 23, 2015
    Date of Patent: May 7, 2019
    Assignee: ArcelorMittal
    Inventor: Philippe Guaino
  • METHOD FOR THE PRODUCTION OF AN OPTOELECTRONIC MODULE INCLUDING A SUPPORT COMPRISING A METAL SUBSTRATE, A DIELECTRIC COATING AND A CONDUCTIVE LAYER
    Publication number: 20180005905
    Abstract: The invention is directed to a method for the production of an optoelectronic module including a support (5) and an additional layer, said support being formed by an assembly (25) which has no optoelectronic properties and which comprises, successively, a metal substrate (27), a dielectric coating (29) disposed on the metal substrate, and an electrically conductive layer (31) disposed on the dielectric coating. The production method comprises: a step of providing the support and performing a method in which the support is checked, or providing the support after it has already been checked; and a step of depositing at least one additional layer on the electrically conductive layer.
    Type: Application
    Filed: December 23, 2015
    Publication date: January 4, 2018
    Inventor: Philippe Guaino