Abstract: A high-frequency circuit (11) having at least a semiconductor circuit element (12) which is arranged on a first surface (13) of an insulating substrate (14). At least one (19a, 19b) of the output terminals (17, 18a, 18b, 19a, 19b) of the semiconductor circuit element (12) is electrically coupled to a ground plane (16) through a capacitive element (20) and metallized holes (21, 22). According to the invention, the circuit element (12) is secured a plate (24) of a dielectric material provided with conductive elements (27, 28a, 28b, 29a, 29b) to which the output terminals are soldered. The conductive elements to which the terminals (19a, 19b) are secured are conductively connected to a metallic layer (30a, 30b) constituting a first plate of the capacitive element (20). A conductive layer (31) formed between the plate (24) and the substrate (14) constitutes a second plate of the capacitive element.

Abstract: A method for the simultaneous manufacture of multiple electrical connections, in particular for the electrical connection of semiconductor elements. In the method a conductive paste is used. Because the conductive paste would otherwise provide a poor electrical connection with the contact pads which are manufactured of certain metals, the paste is first polymerized and thermo-compression of the paste is then carried out on the contact pad by the simultaneous application of pressure and a rise in temperature so that the paste forms a readily conductive and reliable connection.