Patents by Inventor Philippe L. L. Cauvet

Philippe L. L. Cauvet has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7960189
    Abstract: A system in package (10) has a, preferably wireless, test controller (20) for testing each die (30) after it has been mounted onto the substrate of the system in package (10), and a faulty die (30) is repaired before a next die (30) is mounted onto the substrate (15). This way, the system in package (10) can be tested during the intermediate stages of its manufacturing, thus ensuring that all dies (30) function correctly before sealing the dies in the single package. Consequently, a method for manufacturing a system in package (10) is obtained that has an improved yield compared to known manufacturing methods.
    Type: Grant
    Filed: July 18, 2006
    Date of Patent: June 14, 2011
    Assignee: NXP B.V.
    Inventors: Philippe L. L. Cauvet, Herve Fleury, Fabrice Verjus
  • Publication number: 20090148966
    Abstract: A system in package (10) has a, preferably wireless, test controller (20) for testing each die (30) after it has bee mounted onto the substrate of the system in package (10), and a faulty die (30) is repaired before a next die (30) is mounted onto the substrate (15). This way, the system in package (10) can be tested during the intermediate stages of its manufacturing, thus ensuring that all dies (30) function correctly before sealing the dies in the single package. Consequently, a method for manufacturing a system in package (10) is obtained that has an improved yield compared to known manufacturing methods.
    Type: Application
    Filed: July 18, 2006
    Publication date: June 11, 2009
    Applicant: NXP B.V.
    Inventors: Philippe L. L. Cauvet, Herve Fleury, Fabrice Verjus