Abstract: Systems and methods for testing, evaluating, and scoring IT products (e.g., software) and product updates from a technology provider are disclosed herein. More specifically, organizational assessment may be performed to evaluate the provider's development lifecycle processes and generate organization maturity scores. Architecture assessment may be performed to evaluate the system-level and software-level architectures associated with the application and generate architecture maturity scores. Product verification may be performed via automated testing and penetration testing to generate verification maturity scores. The organization maturity scores, architecture maturity scores, and verification maturity scores may be used to provide recommendations to the provider and also combined into an overall maturity score, which may serve as a comprehensive summary of the evaluation. These generated scores inform and expedite testing of future iterations of the product.

Abstract: A method and a device for detecting defects in a packaging laminate having at least one conductive layer are provided. The method comprises the steps of grounding the conductive layer of the packaging laminate, arranging an electrode adjacent to the packaging laminate, applying a high voltage to the electrode by ramping the voltage from an initial value towards an upper predetermined value, and detecting a defect in the packaging material by registering dielectric breakdown between the electrode and the conductive layer of the packaging laminate.

Abstract: A method and a device for detecting defects in a packaging laminate having at least one conductive layer are provided. The method comprises the steps of grounding the conductive layer of the packaging laminate, arranging an electrode adjacent to the packaging laminate, applying a high voltage to the electrode by ramping the voltage from an initial value towards an upper predetermined value, and detecting a defect in the packaging material by registering dielectric breakdown between the electrode and the conductive layer of the packaging laminate.