Patents by Inventor Philippe Mark Vereecken

Philippe Mark Vereecken has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Formation of aligned capped metal lines and interconnections in multilevel semiconductor structures
    Patent number: 7825516
    Abstract: In integrated circuit technology; an electromigration and diffusion sensitive conductor of a metal such as copper and processing procedure therefore is provided, wherein, at a planarized chemical mechanical processed interfacing surface, the conductor metal is positioned in a region of a selectable low K eff dielectric material surrounded by a material selected to be protection from outdiffusion and a source of a film thickness cap that is to form over the conductor metal and/or serve as a catalytic layer for electroless selective deposition of a CoWP capping .
    Type: Grant
    Filed: December 11, 2002
    Date of Patent: November 2, 2010
    Assignee: International Business Machines Corporation
    Inventors: Stefanie Ruth Chiras, Michael Wayne Lane, Sandra Guy Malhotra, Fenton Reed Mc Feely, Robert Rosenberg, Carlos Juan Sambucetti, Philippe Mark Vereecken
  • Formation of aligned capped metal lines and interconnections in multilevel semiconductor structures
    Publication number: 20040113277
    Abstract: In integrated circuit technology; an electromigration and diffusion sensitive conductor of a metal such as copper and processing procedure therefore is provided, wherein, at a planarized chemical mechanical processed interfacing surface, the conductor metal is positioned in a region of a selectable low K eff dielectric material surrounded by a material selected to be protection from outdiffusion and a source of a film thickness cap that is to form over the conductor metal and/or serve as a catalytic layer for electroless selective deposition of a CoWP capping layer.
    Type: Application
    Filed: December 11, 2002
    Publication date: June 17, 2004
    Inventors: Stefanie Ruth Chiras, Michael Wayne Lane, Sandra Guy Malhotra, Fenton Reed Mc Feely, Robert Rosenberg, Carlos Juan Sambucetti, Philippe Mark Vereecken
  • Method of forming planar Cu interconnects without chemical mechanical polishing
    Publication number: 20040094511
    Abstract: A method for controlling the shape of copper features, having the following steps:
    Type: Application
    Filed: November 20, 2002
    Publication date: May 20, 2004
    Applicant: International Business Machines Corporation
    Inventors: Soon-Cheon Seo, Wei-Tsu Tseng, Darryl D. Restaino, James E. Fluegel, Richard O. Henry, John M. Cotte, Mahadevaiyer Krishnan, Hariklia Deligianni, Philippe Mark Vereecken, Stephen E. Greco