Abstract: The process comprises the following steps: a) a first element (3) or a plurality of said first elements (3) is/are machined in a first silicon wafer (1) keeping said elements (3) joined together via material bridges (5); b) step a) is repeated with a second silicon wafer (2) in order to machine a second element (4), differing in shape from that of the first element (3), or a plurality of said second elements (4); c) the first and second elements (3, 4) or the first and second wafers (1, 2) are applied, face to face, with the aid of positioning means (6, 7); d) the assembly formed in step c) undergoes oxidation; and e) the parts (10) are separated form the wafers (1, 2). Micromechanical timepiece parts obtained according to the process.

Abstract: A micro-mechanical part made of insulating material, such as a silicon balance spring (1) for a timepiece movement, tends to adhere to a neighboring part when it is in movement, such as the balance cock (9). This drawback is removed by carrying out, over all or part of the surface, a thin deposition of a layer of conductive material, such as a metal, which is preferably non-oxidizing and non-magnetic, such as gold, platinum, rhodium or silicon.

Abstract: The mobile element includes a central rigid zone (2) provided with arms (6) extending radially from the central zone (2) towards a peripheral zone including teeth (8). The arms (6) are flexible to allow a small tangential and/or radial movement of the teeth (8) in order to absorb shocks. The invention is characterized in that the arms (6) are curved and bend gradually towards an orientation tangential to the rotation of the mobile element, in that the thickness of the arms gradually decreases, and finally, in that the ends of the arms form the teeth.

Abstract: The process comprises the following steps: a) a first element (3) or a plurality of said first elements (3) is/are machined in a first silicon wafer (1) keeping said elements (3) joined together via material bridges (5); b) step a) is repeated with a second silicon wafer (2) in order to machine a second element (4), differing in shape from that of the first element (3), or a plurality of said second elements (4); c) the first and second elements (3, 4) or the first and second wafers (1, 2) are applied, face to face, with the aid of positioning means (6, 7); d) the assembly formed in step c) undergoes oxidation; and e) the parts (10) are separated form the wafers (1, 2). Micromechanical timepiece parts obtained according to the process.

Abstract: A micro-mechanical part made of insulating material, such as a silicon balance spring (1) for a timepiece movement, tends to adhere to a neighbouring part when it is in movement, such as the balance cock (9) as shown in the left part of the Figure. This drawback is removed, as shown in the right part of the Figure, by carrying out, over all or part of the surface, a thin deposition of a layer of conductive material, such as a metal, which is preferably non-oxidising and non-magnetic, such as gold, platinum, rhodium or silicon.

Abstract: The mobile element includes a central rigid zone (2) provided with arms (6) extending radially from the central zone (2) towards a peripheral zone including teeth (8). The arms (6) are flexible to allow a small tangential and/or radial movement of the teeth (8) in order to absorb shocks. The invention is characterized in that the arms (6) are curved and bend gradually towards an orientation tangential to the rotation of the mobile element, in that the thickness of the arms gradually decreases, and finally, in that the ends of the arms form the teeth.

Abstract: A method for manufacturing a balance-spring for a clockwork movement wherein a spring is formed by winding, from a wire or metal strip, said spring including an inner end intended to be fixed to a balance and a outer end zone intended to be fixed to the balance-spring stud and wherein the whole spring is subjected to a first heat treatment subsequent to the winding step of said wire. The method of the invention is characterized in that it further includes an additional step consisting in subjecting at least said outer end zone to a second heat treatment.This method improves in particular the shock resistance of the balance-spring.