Abstract: A device interconnects two circuit boards each comprising electrical connection pads, and which are respectively placed in two cavities. The device includes intercavity microwave screening means. The device also comprises several electrical conductors that pass through the device from end to end and that are not soldered, the two ends of which conductors are respectively intended to make direct contact with the connection pads of the two circuit boards; and mechanical means for holding the two circuit boards against the device, at either end of the latter. The screening means are provided by a microwave absorber in contact with each conductor and surrounding it over all or some of its length.

Abstract: A device interconnects two circuit boards each comprising electrical connection pads, and which are respectively placed in two cavities. The device includes intercavity microwave screening means. The device also comprises several electrical conductors that pass through the device from end to end and that are not soldered, the two ends of which conductors are respectively intended to make direct contact with the connection pads of the two circuit boards; and mechanical means for holding the two circuit boards against the device, at either end of the latter. The screening means are provided by a microwave absorber in contact with each conductor and surrounding it over all or some of its length.

Abstract: The invention relates to a microwave module having an outer face with a connection device. In the module the connection device presents, on the outer face, a central conductive zone and a peripheral conductive zone, and inside the volume of the module, connective zone, and inside the volume of the module, connection to the device takes place by means of coplanar conductors comprising a central signal conductor connected to the central conductive zone, and lateral ground conductors connected to the peripheral conductive zone. The connection is favorable to miniaturization and is suitable for operating over a broad band.

Abstract: The invention provides a microwave module including a plurality of stacked elementary structures forming a unit, each elementary structure comprising a bottom dielectric layer on a top surface of which an integrated circuit (20, 21) is disposed, and a top dielectric layer covering the circuit (20, 21). The module is characterized by a connection line (20a, 30, 21a) between two respective circuits belonging to first and second elementary structures, the connection line being constituted by an input coplanar line (21a) disposed on the top surface of the bottom dielectric layer of the first structure, by an output coplanar line (20a) disposed on the top surface of the bottom dielectric layer of the second structure, and a by link coplanar line (30) connecting one end of the input coplanar line to one end of the output coplanar line.