Patents by Inventor Philippe Nasch

Philippe Nasch has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8256408
    Abstract: The device (1) for wire sawing of a piece (10) to be sawed that is mounted on a support table (20) comprises fastening means (15, 26, 40) for fastening said piece (10) to be sawed to a carriage (18) apt to cooperate with a guide rail of said support table (20), said fastening means (15, 26, 40) consisting of a mounting plate (15) apt to be manufactured to which said piece (10) to be sawed is bonded, and of anchoring means (26, 40) for anchoring said mounting plate (15) directly on said carriage (18).
    Type: Grant
    Filed: February 23, 2009
    Date of Patent: September 4, 2012
    Assignee: Applied Materials Switzerland SA
    Inventors: Niklaus Johann Bucher, David Baranes, Philippe Nasch
  • Patent number: 8230847
    Abstract: The device (1) for wire sawing of a piece (10) to be sawed that is mounted on a support table (20) comprises fastening means (15, 26, 40) for fastening said piece (10) to be sawed to a carriage (18) apt to cooperate with a guide rail of said support table (20), said fastening means (15, 26, 40) consisting of a mounting plate (15) apt to be manufactured to which said piece (10) to be sawed is bonded, and of anchoring means (26, 40) for anchoring said mounting plate (15) directly on said carriage (18).
    Type: Grant
    Filed: January 6, 2011
    Date of Patent: July 31, 2012
    Assignee: Applied Materials Switzerland SA
    Inventors: Niklaus Johann Bucher, David Baranes, Philippe Nasch
  • Publication number: 20110132345
    Abstract: A wire saw device for sawing semiconductor material is provided, the wire saw device comprising a wire guide device (110) adapted to guide a wire for forming at least one wire web (200) for sawing the semiconductor material, and at least one wire management unit (130) for providing a wire to the wire guide device, wherein the wire guide device (110) and the at least one wire management unit (130) are adapted to provide the at least one wire web such that an effective cutting area rate of 12 m2/h or more is provided.
    Type: Application
    Filed: April 9, 2009
    Publication date: June 9, 2011
    Applicant: Applied Materials, Inc.
    Inventors: Stefan Schneeberger, Philippe Nasch, Cedric Thommen
  • Publication number: 20110100348
    Abstract: The device (1) for wire sawing of a piece (10) to be sawed that is mounted on a support table (20) comprises fastening means (15, 26, 40) for fastening said piece (10) to be sawed to a carriage (18) apt to cooperate with a guide rail of said support table (20), said fastening means (15, 26, 40) consisting of a mounting plate (15) apt to be manufactured to which said piece (10) to be sawed is bonded, and of anchoring means (26, 40) for anchoring said mounting plate (15) directly on said carriage (18).
    Type: Application
    Filed: January 6, 2011
    Publication date: May 5, 2011
    Applicant: Applied Materials, Inc.
    Inventors: Niklaus Johann BUCHER, David Baranes, Philippe Nasch
  • Publication number: 20110083655
    Abstract: The device (1) for wire sawing of a piece (10) to be sawed that is mounted on a support table (20) comprises fastening means (15, 26, 40) for fastening said piece (10) to be sawed to a carriage (18) apt to cooperate with a guide rail of said support table (20), said fastening means (15, 26, 40) consisting of a mounting plate (15) apt to be manufactured to which said piece (10) to be sawed is bonded, and of anchoring means (26, 40) for anchoring said mounting plate (15) directly on said carriage (18).
    Type: Application
    Filed: April 23, 2008
    Publication date: April 14, 2011
    Applicants: APPLIED MATERIALS SWITZERLAND SA
    Inventors: Niklaus Johann Bucher, David Baranes, Philippe Nasch