Abstract: This aeronautical equipment for an aircraft, comprising a part configured to be positioned at the level of a skin of the aircraft and means for reheating this part comprising a closed-circuit thermodynamic loop in which a phase-change heat transfer fluid circulates, is wherein it includes means for monitoring the fluid pressure in the loop in order to detect and report a malfunction of the equipment.

Abstract: This aeronautical equipment for an aircraft, comprising a part configured to be positioned at the level of a skin of the aircraft and means for reheating this part comprising a closed-circuit thermodynamic loop in which a phase-change heat transfer fluid circulates, is wherein it includes means for monitoring the fluid pressure in the loop in order to detect and report a malfunction of the equipment.

Abstract: A rack for an aeronautical platform comprising two parallel shelves positioned between a front face and a rear face of the platform, the rack being inserted into the platform by translation from the front face to the rear face the rack containing electronic equipment extending primarily in a plane, the electronic equipment being positioned in a useful compartment of the rack and cooled by forced convection. The electronic equipment is positioned in such a way that its main plane is parallel to the shelves. The rack comprises means for guiding an air flow used for the cooling of the electronic equipment item, the air flow penetrating into the useful compartment parallel to the plane of the electronic equipment item and at right angles to the direction of insertion of the rack into the platform.

Abstract: Heat regulation system (1) for at least one equipment item (2) embedded onboard an aircraft, includes a thermal regulation circuit (5) connected to the equipment item(s) (2). The thermal regulation circuit (5) includes a modular thermal regulation device (6) adapted to receive a modifiable number of thermal regulation modules (8).

Abstract: The invention relates to a rack intended to equip an aeronautical platform (10) comprising two parallel shelves (11, 12) positioned between a front face (13) and a rear face (14) of the platform (10), the rack (15) being intended to be inserted into the platform (10) by translation (16) from the front face (13) to the rear face (14), the rack (15) containing at least one electronic equipment item (18) extending primarily in a plane, the electronic equipment item (18) being positioned in a useful compartment (17) of the rack (15), the electronic equipment item (18) being cooled by forced convection. According to the invention, the electronic equipment item (18) is positioned in the useful compartment (15) in such a way that its main plane is parallel to the shelves (11, 12). The electronic equipment item (18) can be plugged into the rack (15) in the same direction as the direction (16) of insertion of the rack (15) into the platform (10).

Abstract: In a device for cooling an electronic circuit board comprising at least one component covered with an exchanger cover, the device includes a heat sink covering all or some of the electronic circuit board, and at least one heat pipe per component, each heat pipe being capable of carrying away the heat from the component with which it is associated to at least one end of the electronic circuit board via a zone of the heat pipe called the condensing zone. The device further includes at least one heat-exchange part located on the end of the electronic circuit board and mounted freely on the heat sink, each heat pipe being attached to the heat-exchange part by means of its condensing zone.

Abstract: In a device for cooling an electronic circuit board comprising at least one component covered with an exchanger cover, the device includes a heat sink covering all or some of the electronic circuit board, and at least one heat pipe per component, each heat pipe being capable of carrying away the heat from the component with which it is associated to at least one end of the electronic circuit board via a zone of the heat pipe called the condensing zone. The device further includes at least one heat-exchange part located on the end of the electronic circuit board and mounted freely on the heat sink, each heat pipe being attached to the heat-exchange part by means of its condensing zone.

Abstract: The present invention relates to a device for preheating a component cooled by conduction and/or by convection. The component is in contact with a heat conductor and the device includes a heater to heat the part, the device further including at least one heat pipe having fluid within, to connect a heat dissipater with the heat conductor, the dissipater and the part furthermore being thermally insulated from one another. Freezing of fluid in the heat pipe facilitates preheating of the component at low temperature. The invention applies notably to the starting of components subjected to low temperatures, for example, components installed in systems on board aircraft.