Abstract: There is described a wafer receiver for use in an electrochemical porosification process. The wafer receiver generally has an electrode body having a first flat surface, a second flat surface opposite the first flat surface, a groove recessed from the first flat surface and running within a central region of the electrode body, a seat extending annularly around the central region of the electrode body and recessed from the first flat surface, a conduit in fluid communication with the groove and connectable to a vacuum pump; and an annular sealing element received in the seat, the annular sealing element being made of a resilient material resistant to said electrochemical porosification process, the annular sealing element having a wafer receiving surface protruding from the first flat surface when received in the scat.

Abstract: A patient transfer device (10) and a method of controlling the patient transfer device is provided. The patient transfer device (10) comprises a chassis (100) having a plurality of wheels (110) and a vertically extending support structure (200). The patient transfer device (10) further comprises one motorized wheel (210).

Abstract: A lumbar spine mechanism for a mannequin may include three or more joint units serially connected to provide joints for three or more rotational degrees of freedom (DOF). A rotational axis of a first DOF is configured to be aligned with a lateral axis of the mannequin. A rotational axis of a second DOF is configured to be aligned with an anterior-posterior axis of the mannequin. A rotational axis of a third DOF is configured to be aligned with a cranial-caudal axis of the mannequin. Sensors measure movements at each of the joint units to detect lumbar spine orientation changes. A bottom one of the joint units is adapted to be connected to a pelvis of the mannequin, and a top one of the joint units is adapted to be connected to a torso section of the mannequin.

Abstract: An optical power transfer device with an embedded active cooling chip is disclosed. The device includes a cooling chip made of a semiconductor material, and a first subassembly and a second subassembly mounted on the cooling chip. The cooling chip comprises at least one metallization layer on a portion of a first surface of the cooling chip, at least one inlet through a second surface of the cooling chip, wherein the second surface is opposite to the first surface, at least one outlet through the second surface and one or more micro-channels extending between and fluidly coupled to the at least one inlet and the at least one outlet. A cooling fluid flows through the one or more micro-channels. The first subassembly is mounted on the at least one metallization layer and comprises a laser. The second subassembly comprises a phototransducer configured to receive a laser beam from the laser.

Abstract: An optical power transfer device with an embedded active cooling chip is disclosed. The device includes a cooling chip made of a semiconductor material, and a first subassembly and a second subassembly mounted on the cooling chip. The cooling chip comprises at least one metallization layer on a portion of a first surface of the cooling chip, at least one inlet through a second surface of the cooling chip, wherein the second surface is opposite to the first surface, at least one outlet through the second surface and one or more micro-channels extending between and fluidly coupled to the at least one inlet and the at least one outlet. A cooling fluid flows through the one or more micro-channels. The first subassembly is mounted on the at least one metallization layer and comprises a laser. The second subassembly comprises a phototransducer configured to receive a laser beam from the laser.