Abstract: Angular sensor with vibrating resonator includes a supporting structure, a first mass and a second mass which are concentric, and mechanical springs arranged symmetrically in pairs, the pairs themselves being arranged symmetrically with respect to one another. Each spring comprises a first elastic leaf and a second elastic leaf which are connected to one another by one end, the first elastic leaf of one of the springs of each pair being parallel to the second elastic leaf of the other of the springs of the same pair. The four elastic leaves of at least one pair comprise two adjacent pairs of leaves making an angle of approximately 45° between them. The sensor is not provided with electrostatic springs.

Abstract: Angular sensor with vibrating resonator includes a supporting structure, a first mass and a second mass which are concentric, and mechanical springs arranged symmetrically in pairs, the pairs themselves being arranged symmetrically with respect to one another. Each spring comprises a first elastic leaf and a second elastic leaf which are connected to one another by one end, the first elastic leaf of one of the springs of each pair being parallel to the second elastic leaf of the other of the springs of the same pair. The four elastic leaves of at least one pair comprise two adjacent pairs of leaves making an angle of approximately 45° between them. The sensor is not provided with electrostatic springs.

Abstract: A microdevice (100) comprising a movable element (111) capable of moving relative to a fixed part (115), produced in first and second layers of material (104, 106) arranged one above the other such that the movable element comprises a portion (112) of the first layer and a portion (118) of the second layer secured to each other, and wherein the movable element is suspended from the fixed part by a suspension structure (121) formed in the first and/or second layer of material.

Abstract: The invention concerns a resonator 1 configured to be integrated into an inertial angular sensor, said resonator 1 comprising at least one mass suspended by mechanical springs 5, a number N of pairs Pi (2?i?N) of electrostatic springs 50, said resonator 1 defining at least four axes of symmetry S1, S2, S3 and S4, characterized in that: each pair Pi consists of two electrostatic springs 50 each having a privileged axis of action, these electrostatic springs 50 being positioned so that their respective axes form a right angle; for at least one spring of one of the pairs and one spring of another pair, the angle formed by these two springs is equal to a predefined angle.

Abstract: A microdevice (100) comprising a movable element (111) capable of moving relative to a fixed part (115), produced in first and second layers of material (104, 106) arranged one above the other such that the movable element comprises a portion (112) of the first layer and a portion (118) of the second layer secured to each other, and wherein the movable element is suspended from the fixed part by a suspension structure (121) formed in the first and/or second layer of material.

Abstract: A MEMS type inertial sensor comprising a support structure having at least a first seismic body and a second seismic body connected thereto by resilient means in order to be movable in a suspension plane, transducers for maintaining the seismic bodies in vibration and for determining movements of the seismic bodies in the suspension plane, and a control unit connected to the transducers by electrical conductor means. The transducers comprise at least one electrode secured to the first seismic body and at least one electrode secured to the second seismic body, the two electrodes being arranged to enable relative movements of the seismic bodies relative to each other in the suspension plane to be measured directly.

Abstract: The invention relates to a vibrating MEMS inertial angular sensor including a substrate for supporting at least two mass bodies mounted to bear mobile relative to the substrate and associated with at least one electrostatic actuator and at least one electrostatic detector. The sensor includes first means for suspending the mass bodies relative to the substrate and means for coupling the mass bodies together. The substrate is connected to a stationary rack by second suspension means.

Abstract: A method for controlling a piezoelectric device including a piezoelectric element attached to a substrate, with the substrate and the piezoelectric element being made of materials having different coefficients of thermal expansion includes the step of subjecting the piezoelectric element to a predetermined electric voltage in order to cause a predetermined set deformation of the piezoelectric element. The predetermined electric voltage comprises a compensation portion determined according to ambient temperature to cancel a stress generated on the piezoelectric element due to a differential thermal expansion between the piezoelectric element and the substrate.

Abstract: An inertial sensor comprising a frame to which at least two seismic bodies are connected by resilient means so as to be movable in a suspension plane, and transducers to keep the seismic bodies vibrating and to determine a relative movement of the seismic bodies relative to one another, characterized in that the seismic bodies have a single shape and a single mass, and in that the seismic bodies comprise interlocking parts such that the seismic bodies are nested inside one another while being movable in the suspension plane relative to the other of the seismic bodies, with the seismic bodies having centers of gravity that coincide with one another. A method for manufacturing such a sensor.

Abstract: A MEMS type inertial sensor comprising a support structure having at least a first seismic body and a second seismic body connected thereto by resilient means in order to be movable in a suspension plane, transducers for maintaining the seismic bodies in vibration and for determining movements of the seismic bodies in the suspension plane, and a control unit connected to the transducers by electrical conductor means. The transducers comprise at least one electrode secured to the first seismic body and at least one electrode secured to the second seismic body, the two electrodes being arranged to enable relative movements of the seismic bodies relative to each other in the suspension plane to be measured directly.

Abstract: An inertial sensor comprising a frame to which at least two seismic bodies are connected by resilient means so as to be movable in a suspension plane, and transducers to keep the seismic bodies vibrating and to determine a relative movement of the seismic bodies relative to one another, characterized in that the seismic bodies have a single shape and a single mass, and in that the seismic bodies comprise interlocking parts such that the seismic bodies are nested inside one another while being movable in the suspension plane relative to the other of the seismic bodies, with the seismic bodies having centres of gravity that coincide with one another. A method for manufacturing such a sensor.

Abstract: The invention relates to a vibrating MEMS inertial angular sensor including a substrate for supporting at least two mass bodies mounted to bear mobile relative to the substrate and associated with at least one electrostatic actuator and at least one electrostatic detector. The sensor includes first means for suspending the mass bodies relative to the substrate and means for coupling the mass bodies together. The substrate is connected to a stationary rack by second suspension means.

Abstract: A method for controlling a piezoelectric device comprising a piezoelectric element (1) attached to a substrate (2), with the substrate (2) and the piezoelectric element (1) being made of materials having different coefficients of thermal expansion, with the method comprising the step of subjecting the piezoelectric element (1) to a predetermined electric voltage in order to cause a set deformation of the piezoelectric element (1). The determined electric voltage comprises a compensation portion determined according to ambient temperature to cancel a stress generated on the vibrating element (1) due to a differential thermal expansion between the vibrating element (1) and the substrate (2). A piezoelectric device for implementing said method.

Abstract: The vibrating sensor includes a cell fixed in a housing, the cell including a support member and a vibrating member connected to the support member, together with a thermal masking element extending between the vibrating member and a wall of the housing.

Abstract: The vibrating sensor comprises a cell fixed in a housing, the cell comprising a support member and a vibrating member connected to the support member, together with a thermal masking element extending between the vibrating member and a wall of the housing.