Abstract: A method for producing contact-free chip card includes embedding metallized bumps of the chip into an antenna as the chip is mounted on the antenna.

Abstract: An adapter for a portable integrated circuit device of the chip card variety has a reduced format in comparison with the standard mini-card format. The device with a reduced format includes a body on which a microcircuit defining contact pads is disposed. A support which has a standard mini-card format is provided with a cavity having the dimensions of the device with a reduced format. The device is detachably fixed in the cavity. The cavity is located in the support in such a way that the location of the contact pads of the microcircuit of the device with a reduced format coincides with the standardization location of the contact pads of a microcircuit having a standard format mini-card.

Abstract: An adapter electrically connects an integrated circuit mini-card in a main electronic integrated circuit memory card connector having greater space requirement than the mini-card. The mini-card has surface contact strips and the adapter includes a main body capable of being connected to the main connector and a housing for receiving the mini-card at the surface of the main body. The housing includes inside bond pads for connection to the electric contacts of the mini-card. A mobile cover is capable of taking up a position wherein it closes at least partly the housing while maintaining the mini-card in electrically connecting position in the housing and stiffening the structure of the adapter.

Abstract: A method for producing contact-free chip card includes embedding metallized bumps of the chip into an antenna as the chip is mounted on the antenna.

Abstract: A method for producing contact-free chip card includes embedding metallized bumps of the chip into an antenna as the chip is mounted on the antenna.

Abstract: The invention concerns an electronic device such as a smart card which includes at least a microcircuit embedded in a carrier medium and which includes exit hubs linked to interface elements composed of a terminal block and/or an antenna. The connections between the exit hubs and the interface elements are made by depositing a low-viscosity conducting substance which remains flexible after its application, using a syringe or similar device. Preferably, a polymer resin charged with conducting or intrinsically conducting particles is used for the connections.

Abstract: The invention concerns an electronic module that is designed to be fixed in an electronic device in the form of a card. The module includes a medium having at least a surface provided with contact pads and a microcircuit which is fixed on the medium and has exit hubs each connected to a medium contact pad. The connections between the exit hubs and the contact pads consist of a cord made of an adhesive conductive substance which conforms to the profile of the medium. Preferably, the conductive substance is a conductive isotropic adhesive.

Abstract: A method for making an electronic device having an integrated circuit chip connected to an antenna. A chip is transferred into an impression provided in a substrate made of insulating material. The chip is connected to an antenna by hot lamination of an insulating support-sheet bearing the antenna. The method ensures a high quality electrical connection between the chip and the antenna, and enables the connection of a chip matrix with a plurality of antennae in a large-size circuit to be produced in one single step.

Abstract: A method for mounting, on a support, at least a microcircuit in the form of a chip produced on a very thin semiconductor substrate. An interconnection point is provided at the chip in the form of a bump contact in weldable material. The bump contact has a welding surface in the same plane as at least one of the chip faces. An interconnection pad is provided on the support that is designed to be welded with a corresponding bump contact of the chip. The welding face of each bump contact of the chip is placed opposite each corresponding interconnection pad of the support. Each bump contact of the chip is welded with each corresponding interconnection pad of the support. The method can be applied to a device such as a chip card.

Abstract: A portable integrated circuit device has a supporting body and a detachable mini-card bearing an integrated circuit. The mini-card is disposed on one end of the supporting body which has an elongated shape. The invention can be used for SIM cards in new generation mobile telephones.

Abstract: The invention concerns an electronic device such as a smart card which includes at least a microcircuit embedded in a carrier medium and which includes exit hubs linked to interface elements composed of a terminal block and/or an antenna. The connections between the exit hubs and the interface elements are made by depositing a low-viscosity conducting substance which remains flexible after its application, using a syringe or similar device. Preferably, a polymer resin charged with conducting or intrinsically conducting particles is used for the connections.

Abstract: The invention concerns a method for making an electronic device such as a smart card which includes at least a microcircuit embedded in a carrier medium and which includes exit hubs linked to interface elements composed of a terminal block and/or an antenna. The connections between the exit hubs and the interface elements are made by depositing a low-viscosity conducting substance which remains flexible after its application, using a syringe or similar device. Preferably, a polymer resin charged with conducting or intrinsically conducting particles is used for the connections.

Abstract: The invention concerns an electronic module that is designed to be fixed in an electronic device in the form of a card. The module includes a medium having at least a surface provided with contact pads and a microcircuit which is fixed on the medium and has exit hubs each connected to a medium contact pad. The connections between the exit hubs and the contact pads consist of a cord made of an adhesive conductive substance which conforms to the profile of the medium. Preferably, the conductive substance is a conductive isotropic adhesive.

Abstract: The invention concerns an electronic module that is designed to be fixed in an electronic device in the form of a card. The module includes a medium having at least a surface provided with contact pads and a microcircuit which is fixed on the medium and has exit hubs each connected to a medium contact pad. The connections between the exit hubs and the contact pads consist of a cord made of an adhesive conductive substance which conforms to the profile of the medium. Preferably, the conductive substance is a conductive isotropic adhesive.

Abstract: The invention aims at the manufacturing of a device having a support associated with at least one microcircuit in the form of a chip, and comprises the replacement of at least one chip having a defect either within it or at its connection to the communication interface; provision is made for:

Abstract: A contactless smart card includes a card body, an antenna and an integrated circuit chip connected to the antenna's connecting terminals. The connecting terminals of the antenna are further connected to conductive via holes emerging at the card surface. A junction based on an electrically conductive substance is flush with the card surface and connects the conductive via holes. The electrically conductive substance is designed to be removed by scraping, and prevents the card from being used until it is removed.

Abstract: The invention concerns a method for protecting integrated circuit chips of a silicon wafer. The silicon wafer is cut so as to disengage the chips from the integrated circuit; and a fluid insulating material is applied on the rear surface of the wafer so as to coat the flanks of each chip of the integrated circuit with a thin insulating layer. The insulating material may be applied by spraying, screen printing, dip coating, casting or any other means. The invention further concerns integrated circuit chips where the flanks are protected by an insulating material to prevent electrical malfunction caused by contact of a conductive material on the flanks of the chips.

Abstract: A contactless smart card has a sheet-like body containing an integrated circuit and an antenna via which the integrated circuit communicates with a terminal. The antenna lies in the plane of the card body and is constituted by several turns of a conductor that form a winding. A conductive bridge connects at least two turns of the winding to reduce its inductance. The card body includes a rupture zone that is designed to be broken when the card is first used. A portion of the connecting bridge lies within the rupture zone, so that it is broken when the rupture zone is broken during use.