Patents by Inventor Philippe Peres

Philippe Peres has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic component support for memory card and product obtained thereby
    Patent number: 4943464
    Abstract: The disclosure relates to memory cards having an electronic component housed in a cavity. The electronic support has a first base made of silicon, with a small thickness (between 50 and 100 microns) and a thicker (between 200 and 300 microns) second base, which is deposited on the first base and is formed by a material which is harder than silicon, such as cobalt, vanadium, titanium or ceramic.
    Type: Grant
    Filed: December 1, 1988
    Date of Patent: July 24, 1990
    Assignee: SGS-Thomson Microelectronics SA
    Inventors: Jean-Pierre Gloton, Philippe Peres
  • Electrostatic protection device for electronic cards
    Patent number: 4942495
    Abstract: In an electrostatic protection device for electronic cards, the electronic card has a module bearing, on one of its faces, a network of conducting tracks to which at least one integrated circuit is connected. Each contact is close to a contact at a reference potential. The contact bears, on its periphery, metal sharp-pointed proturberances placed so as to face other metal protuberances borne by the contacts so as to favor the formation of electric arcs between two facing protuberances.
    Type: Grant
    Filed: October 21, 1988
    Date of Patent: July 17, 1990
    Assignee: Gemplus Card International
    Inventors: Philippe Peres, Vincent Deveaud
  • Method of fabrication of a chip carrier package, a flush-contact chip carrier package and an application to cards containing components
    Patent number: 4864383
    Abstract: A micromodule or chip carrier package for chip containing components has an insulating support base for carrying a series of flush-mounted contact areas. A semiconductor circuit or chip is placed on one of the contact areas and the chip is connected to the other contact areas by means of wires. A hollow case is mounted over the assembly and has a bore for receiving a drop of resin which has the function of protecting the semiconductor circuit or chip.
    Type: Grant
    Filed: October 2, 1986
    Date of Patent: September 5, 1989
    Assignee: Eurotechnique
    Inventors: Jean P. Gloton, Philippe Peres
  • Method for recycling a card having an incorporated component, and a card designed to permit recycling
    Patent number: 4810865
    Abstract: An electronic card which can be reused a large number of times incorporates a semiconductor circuit provided with an area which is erasable by means of electromagnetic radiation within the ultraviolet range of wavelengths. The externally-emitted ultraviolet radiation applied to the semiconductor circuit via a card recess passes through a quartz window and impinges on the erasable area.
    Type: Grant
    Filed: November 5, 1986
    Date of Patent: March 7, 1989
    Assignee: Eurotechnique
    Inventors: Jean P. Gloton, Philippe Peres
  • Electronic component support for memory card and product obtained thereby
    Patent number: RE36356
    Abstract: The disclosure relates to memory cards having an electronic component housed in a cavity. The electronic support has a first base made of silicon, with a small thickness (between 50 and 100 microns) and a thicker (between 200 and 300 microns) second base, which is deposited on the first base and is formed by a material which is harder than silicon, such as cobalt, vanadium, titanium or ceramic.
    Type: Grant
    Filed: June 1, 1994
    Date of Patent: October 26, 1999
    Assignee: SGS-Thomson Microelectronics S.A.
    Inventors: Jean-Pierre Gloton, Philippe Peres