Abstract: The present description concerns an electronic die manufacturing method comprising: a) the deposition of an electrically-insulating resin layer on the side of a first surface of a semiconductor substrate, inside and on top of which have been previously formed a plurality of integrated circuits, the semiconductor substrate supporting on a second surface, opposite to the first surface, contacting pads; and b) the forming, on the side of the second surface of the semiconductor substrate, of first trenches, electrically separating the integrated circuits from one another, the first trenches vertically extending in the semiconductor substrate and emerging into or on top of the resin layer.

Abstract: In some embodiments, a device includes, in series: a bidirectional diode having a breakdown voltage that is higher than or equal to the supply voltage; and a unidirectional diode having a breakdown voltage that is higher than or equal to the supply voltage. One of the diodes is an avalanche diode and the other is a Shockley diode.

Abstract: A method for regulating the power in a load connected to the mains through a controlled switch and a device for implementing the method. The method includes the following steps: detecting a mains synchronization pulse, which determines the start of a cycle, within a fixed time interval of the preceding cycle; as soon as the pulse has been detected, waiting for the end of the fixed interval, then counting down a first time interval that substantially corresponds to a selected time interval; at the end of the first time interval, triggering the switch on and counting down a second time interval that ends before the normal arrival of the next synchronization pulse; and at the end of the second time interval, counting down the fixed time interval within which the next synchronization pulse must be detected.