Patents by Inventor Philippe Raout

Philippe Raout has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of fabricating an electronic interconnection
    Patent number: 5324892
    Abstract: Disclosed is a method of fabricating an electronic interconnection structure comprising at least one solder column Joined to an I/O pad of a substrate, the method including the steps of:(a) applying a quantity of solder to the solder column or I/O pad;(b) aligning the solder column with the I/O pad such that there is a quantity of solder between them;(c) heating the structure to cause the solder to melt and bond the column to the I/O pad; and(d) planarizing the solder column to a predetermined height.Also disclosed is the electronic interconnection structure made by the method according to the invention.
    Type: Grant
    Filed: August 7, 1992
    Date of Patent: June 28, 1994
    Assignee: International Business Machines Corporation
    Inventors: Francois J. Granier, Jean-Jacques M. Rieu, Philippe Raout, Andre Sanchez