Patents by Inventor Phillip A. Lutz

Phillip A. Lutz has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Surface mountable integrated circuit package equipped with sockets
    Patent number: 4747017
    Abstract: A surface mount package formed by nesting an encapsulated tape automated bonding integrated circuit module in between two plastic rings snapped together, the inner surface of the outer ring contains recessed sockets for receiving socket pins upstanding on a circuit board.
    Type: Grant
    Filed: May 27, 1986
    Date of Patent: May 24, 1988
    Assignee: General Motors Corporation
    Inventors: Mark A. Koors, Phillip A. Lutz
  • Surface mount package for encapsulated tape automated bonding integrated circuit modules
    Patent number: 4706811
    Abstract: A surface mount package formed by nesting an encapsulated tape automated bonding integrated circuit module in between two plastic rings snapped together.
    Type: Grant
    Filed: March 3, 1986
    Date of Patent: November 17, 1987
    Assignee: General Motors Corporation
    Inventors: James E. Jung, Mark A. Koors, Phillip A. Lutz
  • Lead frame for molded integrated circuit package
    Patent number: 4490902
    Abstract: A lead frame for a molded semiconductor device package. The lead frame has a pattern of finger leads with convergent free inner ends and dam bars between adjacent finger leads. The dam bars are partially severed from their contiguous finger leads due to cuts on their edges intended to face a body member molded over the finger lead inner ends. The partially severed dam bar edge is preferably positioned to be substantially at the periphery of the molded body member. The resultant molded body member can thus have a finished surface even between the finger leads as molded and dam bar cutting die wear reduced.
    Type: Grant
    Filed: September 3, 1982
    Date of Patent: January 1, 1985
    Assignee: General Motors Corporation
    Inventors: Charles T. Eytcheson, Phillip A. Lutz, Harold L. Fields
  • Vertical integrated circuit package integration
    Patent number: 4398235
    Abstract: A compact assembly of similar type integrated circuit packages having a functionally similar terminal lead in non-corresponding lead positions. Two interconnection packages, of a type similar to the integrated circuit packages, are nested between the integrated circuit packages to re-route an electrical path from a terminal lead location on one integrated circuit package to a functionally similar but differently located lead position on the other integrated circuit package.
    Type: Grant
    Filed: September 11, 1980
    Date of Patent: August 9, 1983
    Assignee: General Motors Corporation
    Inventors: Phillip A. Lutz, Phillip R. Motz, Eugene H. Sayers