Patents by Inventor Phillip Adamson

Phillip Adamson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device packages with substrates for redistributing semiconductor device electrodes
    Patent number: 7745930
    Abstract: A semiconductor device package includes a substrate with one or more pads and at least one semiconductor device that has one or more of its electrodes electrically connected to the substrate pads. The package also includes one or more terminals in electrical connection with the substrate pads and that provide for external connection to the device.
    Type: Grant
    Filed: April 24, 2006
    Date of Patent: June 29, 2010
    Assignee: International Rectifier Corporation
    Inventors: Norman Glyn Connah, Mark Pavier, Phillip Adamson, Hazel D Schofield
  • Semiconductor device packages with substrates for redistributing semiconductor device electrodes
    Publication number: 20060261473
    Abstract: A semiconductor device package includes a substrate with one or more pads and at least one semiconductor device that has one or more of its electrodes electrically connected to the substrate pads. The package also includes one or more terminals in electrical connection with the substrate pads and that provide for external connection to the device.
    Type: Application
    Filed: April 24, 2006
    Publication date: November 23, 2006
    Inventors: Norman Connah, Mark Pavier, Phillip Adamson, Hazel Schofield