Patents by Inventor Phillip Alfred Criminale

Phillip Alfred Criminale has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240145291
    Abstract: Methods and system for lifting a substrate are provided. In some embodiments a system includes a processing chamber having a chamber body defining an interior space; and a linear motor comprising: a housing disposed outside of the interior space and sealed to the chamber body, the housing having a cavity in fluid communication with the interior space; and a slider disposed at least partially in the cavity, the slider configured to slide relative to the housing in the cavity.
    Type: Application
    Filed: December 22, 2022
    Publication date: May 2, 2024
    Inventors: Alexander SULYMAN, Phillip Alfred CRIMINALE, Cory BOWDACH
  • Publication number: 20240022083
    Abstract: A system includes an enclosure configured to couple to an equipment front end module (EFEM) of a substrate processing system, a charging assembly, and one or more support structures within the enclosure. The one or more support structures are configured to support a validation wafer in a charging position to charge the validation wafer via the charging assembly.
    Type: Application
    Filed: September 27, 2023
    Publication date: January 18, 2024
    Inventors: Phillip Alfred Criminale, Zhiqiang Guo, Andrew S.C. Ho, Rachel Sara Stolzman, Michael Carl Hankes
  • Patent number: 11817724
    Abstract: An enclosure system includes multiple walls forming an interior volume. The enclosure system is configured to couple to an equipment front end module (EFEM) of a substrate processing system. The enclosure system further includes a charging assembly including a first charging coil. The enclosure system further includes one or more first support structures disposed within the interior volume under the first charging coil. The one or more first support structures are configured to support a first validation wafer within a threshold distance of the first charging coil to charge the first validation wafer via the charging assembly.
    Type: Grant
    Filed: March 2, 2022
    Date of Patent: November 14, 2023
    Assignee: Applied Materials, Inc.
    Inventors: Phillip Alfred Criminale, Zhiqiang Guo, Andrew S. C. Ho, Rachel Sara Stolzman, Michael Carl Hankes
  • Publication number: 20230283086
    Abstract: An enclosure system includes multiple walls forming an interior volume. The enclosure system is configured to couple to an equipment front end module (EFEM) of a substrate processing system. The enclosure system further includes a charging assembly including a first charging coil. The enclosure system further includes one or more first support structures disposed within the interior volume under the first charging coil. The one or more first support structures are configured to support a first validation wafer within a threshold distance of the first charging coil to charge the first validation wafer via the charging assembly.
    Type: Application
    Filed: March 2, 2022
    Publication date: September 7, 2023
    Inventors: Phillip Alfred Criminale, Zhiqiang Guo, Andrew S.C. Ho, Rachel Sara Stolzman, Michael Carl Hankes