Abstract: A portable computer includes a base having a heat producing electronic component mounted therein. A heat sink, also referred to as a remote heat exchanger, is positioned in the base adjacent to the heat producing component. A heat pipe has a first end permanently bonded to the heat sink and extends to a second end thermally engaged with the heat producing component. The heat sink and heat pipe assembly is rotatable about an axis of the heat sink so as to move the second end of the heat pipe into and out of thermal engagement with the heat producing component.

Abstract: An electronic apparatus including a semiconductor device mounted on a substrate. A support member is disposed between the semiconductor device and the substrate. A heat dissipating body has a cavity formed therein. The heat dissipating body is positioned adjacent to the support member with the heat generating device received within the cavity. The cavity is sized to define a gap between the heat dissipating body and the semiconductor device. A flowable thermally conductive material is disposed within a portion of the gap. A sealing member is disposed between the heat dissipating body and the support member. A principal advantage is that the flowable material can be used in mass produced devices such as electronic packages for computers. Preferred interface materials are phase change materials and thermally conductive greases.