Patents by Inventor Phillip C. L. Wu

Phillip C. L. Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6759114
    Abstract: An extruded hollow thermoplastic board, which includes a pair of flat and parallel sheets spaced apart and interconnected by extending ribs, generally has a plurality of depression bands in the areas where the flat sheets and extending ribs are joined. The bands, which negatively affect the surface flatness, are especially apparent for crystalline thermoplastic materials. A hollow thermoplastic board, which effectively reduces the depth of the depression bands by inclusion of locationally fixed gas pockets in the rib area during production, is disclosed in the present invention. The hollow thermoplastic board of the present invention substantially enhances the surface smoothness and is highly beneficial to applications such as printing, lamination and graphic art. The present invention also provides a method for production of the hollow thermoplastic boards of smooth surfaces.
    Type: Grant
    Filed: October 27, 2001
    Date of Patent: July 6, 2004
    Assignee: Inteplast Group, LTD
    Inventors: Phillip C. L. Wu, Yao Cheng, Haur Horng Yang, Jyh-yao Raphael Li
  • Publication number: 20030082346
    Abstract: An extruded hollow thermoplastic board, which includes a pair of flat and parallel sheets spaced apart and interconnected by extending ribs, generally has a plurality of depression bands in the areas where the flat sheets and extending ribs are joined. The bands, which negatively affect the surface flatness, are especially apparent for crystalline thermoplastic materials. A hollow thermoplastic board, which effectively reduces the depth of the depression bands by inclusion of locationally fixed gas pockets in the rib area during production, is disclosed in the present invention. The hollow thermoplastic board of the present invention substantially enhances the surface smoothness and is highly beneficial to applications such as printing, lamination and graphic art. The present invention also provides a method for production of the hollow thermoplastic boards of smooth surfaces.
    Type: Application
    Filed: October 27, 2001
    Publication date: May 1, 2003
    Applicant: Inteplast Group, Ltd.
    Inventors: Phillip C. L. Wu, Yao Cheng, Haur Horng Yang, Jyh-Yao Raphael Li