Abstract: Apparatus and methods for calibrating a height-adjustable edge ring are described herein. In one example, a calibration jig for positioning an edge ring relative to a reference surface is provided that includes a transparent plate, a plurality of sensors coupled to a first side of the transparent plate, and a plurality of contact pads coupled to an opposing second side of the transparent plate.

Abstract: Temperature measurement is described for a substrate carrier using a heater element array. In one example a method includes measuring a first combined current load of each of a plurality of heating elements in the electrostatic chuck, changing a power status of a first heating element of the plurality of heating elements, measuring a second combined current load of each of the plurality of heating elements after changing the power status of the first heating element, determining the difference between the first and second combined current loads, determining a temperature of the first heating element using the difference, and reverting the power status of the first heating element to that before the change and repeating changing power, measuring a current load, determining a difference, and determining a temperature for each of the other heating elements of the plurality to determine a temperature at each of the heating elements of the plurality.

Abstract: A diagnostic disc includes a disc-shaped body having raised walls that encircle the interior of the disc-shaped body and at least one protrusion extending outwardly from the disc-shaped body. The raised walls of the disc-shaped body define a cavity of the disc-shaped body. A non-contact sensor is attached to each of the at least one protrusion. A a printed circuit board (PCB) is positioned within the cavity formed on the disc-shaped body. A vacuum and high temperature tolerant power source is disposed on the PCB along with a wireless charger and circuitry that is coupled to each non-contact sensor and includes at least a wireless communication circuit and a memory. A cover is positioned over the cavity of the disc-shaped body and shields at least a portion of the PCB, circuitry, power source, and wireless charger within the cavity from an external environment.

Abstract: A diagnostic disc includes a disc body having a sidewall around a circumference of the disc body and at least one protrusion extending outwardly from a top of the sidewall. A non-contact sensor is attached to an underside of each of the at least one protrusion. A a printed circuit board (PCB) is positioned within an interior formed by the disc body. Circuitry is disposed on the PCB and coupled to each non-contact sensor, the circuitry including at least a wireless communication circuit, a memory, and a battery. A cover is positioned over the circuitry inside of the sidewall, wherein the cover seals the circuitry within the interior formed by the disc body from an environment outside of the disc body.

Abstract: An advanced temperature control system and method are described for a wafer carrier in a plasma processing chamber. In one example a heat exchanger provides a temperature controlled thermal fluid to a fluid channel of a workpiece carrier and receives the thermal fluid from the fluid channel. A proportional valve is between the heat exchanger and the fluid channel to control the rate of flow of thermal fluid from the heat exchanger to the fluid channel. A pneumatic valve is also between the heat exchanger and the fluid channel also to control the rate of flow of thermal fluid from the heat exchanger and the fluid channel. A temperature controller receives a measured temperature from a thermal sensor of the carrier and controls the proportional valve and the pneumatic valve in response to the measured temperature to adjust the rate of flow of the thermal fluid.

Abstract: A method includes establishing, by a diagnostic disc, a secure wireless connection with a computing system using a wireless communication circuit of the diagnostic disc before or after the diagnostic disc is placed into a processing chamber. The method further includes generating, by at least one non-contact sensor of the diagnostic disc, sensor data of a component disposed within the processing chamber. The method further includes storing the sensor data in a memory of the diagnostic disc. The method further includes wirelessly transmitting the sensor data to the computing system, using the wireless communication circuit. The method further includes terminating the secure wireless connection with the computing system and clearing the sensor data from the memory of the diagnostic disc.

Abstract: A method includes generating, external to a radio frequency (RF) environment and based on a process recipe, a first signal and a second signal. The method further includes converting the first signal into an alternative signal and transmitting, over a non-conductive communication link, the alternative signal to a converter within the RF environment within a processing chamber of a substrate processing system. The method further includes converting the alternative signal into a third signal by the converter inside the RF environment within the processing chamber. The method further includes controlling a first plurality of elements disposed within the RF environment within the processing chamber via one or more first devices disposed within the RF environment within the processing chamber using the third signal and controlling a second plurality of elements of the substrate processing system via one or more second devices of the substrate processing system using the second signal.

Abstract: A method includes causing, by a computing system comprising at least one processing device, a diagnostic disc placed within a processing chamber to generate sensor data of at least one component of the processing chamber using a set of non-contact sensors of the diagnostic disc, receiving, by the computing system, the sensor data from the diagnostic disc via a wireless connection established between the computing system and the diagnostic disc, determining, by the computing system based on the sensor data, whether at least one of alignment concentricity is skewed with respect to the at least one component, and in response to determining that at least one of alignment or concentricity is skewed with respect to the at least one component, initiating, by the computing system, correction of at least one of alignment or concentricity of the at least one component.

Abstract: An advanced temperature control system and method are described for a wafer carrier in a plasma processing chamber. In one example a heat exchanger provides a temperature controlled thermal fluid to a fluid channel of a workpiece carrier and receives the thermal fluid from the fluid channel. A proportional valve is between the heat exchanger and the fluid channel to control the rate of flow of thermal fluid from the heat exchanger to the fluid channel. A pneumatic valve is also between the heat exchanger and the fluid channel also to control the rate of flow of thermal fluid from the heat exchanger and the fluid channel. A temperature controller receives a measured temperature from a thermal sensor of the carrier and controls the proportional valve and the pneumatic valve in response to the measured temperature to adjust the rate of flow of the thermal fluid.

Abstract: Examples disclosed herein are directed to a method and apparatus for determining a position of a ring within a process kit. In one example, a sensor assembly for a substrate processing chamber is provided. The sensor assembly includes a housing having a top surface, a bottom surface opposite the top surface, and a plurality of sidewalls connecting the top surface to the bottom surface. The housing also has a recess in the top surface, the recess forming an interior volume within the housing. The sensory assembly includes a bias member, and a contact member disposed on the bias member. The bias member and contact member are disposed within the recess. A sensor is configured to detect a displacement of the contact member. The displacement of the contact member corresponds to a relative position of an edge ring.

Abstract: A method includes establishing, by a diagnostic disc, a secure wireless connection with a computing system using a wireless communication circuit of the diagnostic disc before or after the diagnostic disc is placed into a processing chamber. The method further includes generating, at a vacuum of about 0.1 mTorr to about 50 mTorr and a temperature of about ?20° C. to about 120° C., by at least one non-contact sensor of the diagnostic disc, sensor data of a component disposed within the processing chamber. The method further includes wirelessly transmitting the sensor data to the computing system via the secure wireless connection using the wireless communication circuit. The diagnostic disc includes a disc-shaped body, a printed circuit board (PCB), a power source coupled to the PCB, a casing that encapsulates the power source, and a cover positioned over the PCB and the power source.

Abstract: Implementations described herein provide a method for processing a substrate on a substrate support assembly which enables both lateral and azimuthal tuning of the heat transfer between an electrostatic chuck and a substrate. The method includes processing a first substrate using a first temperature profile on a substrate support assembly having primary heaters and spatially tunable heaters. A deviation profile is determined from a result of processing the first substrate. The spatially tunable heaters are controlled in response to the deviation profile to enable discrete lateral and azimuthal tuning of local hot or cold spots on the substrate support assembly in forming a second temperature profile. A second substrate is then processed using the second temperature profile.

Abstract: A substrate carrier is described that uses a proportional thermal fluid delivery system. In one example the apparatus includes a heat exchanger to provide a thermal fluid to a fluid channel of a substrate carrier and to receive the thermal fluid from the fluid channel, the thermal fluid in the fluid channel to control the temperature of the carrier during substrate processing. A proportional valve controls the rate of flow of thermal fluid from the heat exchanger to the fluid channel. A temperature controller receives a measured temperature from a thermal sensor of the carrier and controls the proportional valve in response to the measured temperature to adjust the rate of flow.

Abstract: An electronic device manufacturing system includes a transfer chamber, a tool station situated within the transfer chamber, a process chamber coupled to the transfer chamber, and a transfer chamber robot. The transfer chamber robot is configured to transfer substrates to and from the process chamber. The transfer chamber robot is further configured to be coupled to a sensor tool comprising one or more sensors configured to take measurements inside the process chamber. The sensor tool is retrievable from the tool station by an end effector of the transfer chamber robot.

Abstract: A diagnostic disc includes a disc-shaped body having raised walls that encircle the interior of the disc-shaped body and at least one protrusion extending outwardly from the disc-shaped body. The raised walls of the disc-shaped body define a cavity of the disc-shaped body. A non-contact sensor is attached to each of the at least one protrusion. A printed circuit board (PCB) is positioned within the cavity formed on the disc-shaped body. A vacuum and high temperature tolerant power source is disposed on the PCB along with a wireless charger and circuitry that is coupled to each non-contact sensor and includes at least a wireless communication circuit and a memory. A cover is positioned over the cavity of the disc-shaped body and shields at least a portion of the PCB, circuitry, power source, and wireless charger within the cavity from an external environment.

Abstract: Examples disclosed herein are directed to a method and apparatus for determining a position of a ring within a process kit. In one example, a sensor assembly for a substrate processing chamber is provided. The sensor assembly includes a housing having a top surface, a bottom surface opposite the top surface, and a plurality of sidewalls connecting the top surface to the bottom surface. The housing also has a recess in the top surface, the recess forming an interior volume within the housing. The sensory assembly includes a bias member, and a contact member disposed on the bias member. The bias member and contact member are disposed within the recess. A sensor is configured to detect a displacement of the contact member. The displacement of the contact member corresponds to a relative position of an edge ring.

Abstract: Implementations described herein provide a method for calibrating a temperature of a substrate support assembly which enables discrete tuning of the temperature profile of a substrate support assembly. In one embodiment, a system, comprises a memory, wherein the memory includes an application program configured to perform an operation on a substrate support assembly, a control board disposed in a substrate support assembly, wherein the control board comprises a processor having an wireless interface, a pulse width modification (PWM) heater controller, wherein the processor is connected with the memory to read and access the application program from the memory when in operation, and a heating element coupled to the pulse width modification (PWM) heater controller, wherein the heating element comprises a plurality of spatially tunable heaters that are individually tunable by the pulse width modification (PWM) heater controller.

Abstract: Temperature measurement is described for a substrate carrier using a heater element array. In one example a method includes measuring a first combined current load of each of a plurality of heating elements in the electrostatic chuck, changing a power status of a first heating element of the plurality of heating elements, measuring a second combined current load of each of the plurality of heating elements after changing the power status of the first heating element, determining the difference between the first and second combined current loads, determining a temperature of the first heating element using the difference, and reverting the power status of the first heating element to that before the change and repeating changing power, measuring a current load, determining a difference, and determining a temperature for each of the other heating elements of the plurality to determine a temperature at each of the heating elements of the plurality.

Abstract: Implementations described herein provide a method for calibrating a temperature of a substrate support assembly which enables discrete tuning of the temperature profile of a substrate support assembly. In one embodiment, a system, comprises a memory, wherein the memory includes an application program configured to perform an operation on a substrate support assembly, a control board disposed in a substrate support assembly, wherein the control board comprises a processor having an wireless interface, a pulse width modification (PWM) heater controller, wherein the processor is connected with the memory to read and access the application program from the memory when in operation, and a heating element coupled to the pulse width modification (PWM) heater controller, wherein the heating element comprises a plurality of spatially tunable heaters that are individually tunable by the pulse width modification (PWM) heater controller.

Abstract: Temperature measurement is described for a substrate carrier using a heater element array. In one example a method includes measuring a first combined current load of each of a plurality of heating elements in the electrostatic chuck, changing a power status of a first heating element of the plurality of heating elements, measuring a second combined current load of each of the plurality of heating elements after changing the power status of the first heating element, determining the difference between the first and second combined current loads, determining a temperature of the first heating element using the difference, and reverting the power status of the first heating element to that before the change and repeating changing power, measuring a current load, determining a difference, and determining a temperature for each of the other heating elements of the plurality to determine a temperature at each of the heating elements of the plurality.