Abstract: A flux vapor management system for a reflow oven includes temperature control units disposed in heating and cooling regions of the oven. A fan within each of the temperature control units provides suction to an intake port. Intake ports of selected temperature control units in the heating region of the oven are connected with a barrier vent disposed between the heating and cooling regions of the oven. Gas drawn into the barrier vent by the suction from the intake ports prevents flux laden gas from migrating into the cooling region. The flux vapor management system also includes a filter for removing flux vapors from a reflow oven. The filter condenses flux vapors by converging a jet of hot gas from the oven with a cooled gas jet causing the flux vapors to condense while suspended in the gas stream. The flux laden gas does not contact any solid surface below the flux condensation temperature so there is no build-up of flux within the apparatus.

Abstract: Apparatus for soldering surface mounted devices to printed circuit boards utilizing a combination of forced convection and infrared radiation. Fans are disposed in each heating zone which force gas through a heating plate which heats the air, emits infrared radiation for heating of printed circuit boards, and establishes a flow pattern for the gas. Flows are controlled in each zone by selectively introducing unheated gas into each zone, and by selectively exhausting gas from each zone. The volume of gas introduced and exhausted from each zone can be controlled. Closures are provided in the return channels to the low pressure side of the fan for controlling the volume of gas recirculated from the conveyor. Flow is controlled such that cooler air is always introduced into the zones which have a lower temperature and is exhausted from zones which have higher temperatures.

Abstract: Apparatus for soldering surface mounted devices to printed circuit boards utilizing a combination of forced convection and infrared radiation. Fans are disposed in each heating zone which force gas through a heating plate which heats the air, emits infrared radiation for heating of printed circuit boards, and establishes a flow pattern for the gas. Flows are controlled in each zone by selectively introducing unheated gas into each zone, and by selectively exhausting gas from each zone. The volume of gas introduced and exhausted from each zone can be controlled. Closures are provided in the return channels to the low pressure side of the fan for controlling the volume of gas recirculated from the conveyor. Flow is controlled such that cooler air is always introduced into the zones which have a lower temperature and is exhausted from zones which have higher temperatures.