Patents by Inventor Phillip D. Isaacs
Phillip D. Isaacs has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11404287Abstract: A fixture to facilitate fabrication of a heat sink includes a base plate to support a lower section of the heat sink, and multiple registration pins extending from the base plate. A platen is provided over a heat transfer element (HTE) of the heat sink, with the platen including slip fit regions to slip fit around respective registration pins, and with the lower section and HTE disposed between the base plate and the platen, and forming a fixture stack segment aligned with an active region of the cold plate. A load plate is provided which includes slip fit regions configured to slip fit around corresponding registration pins with the load plate disposed over the fixture stack segment. The load plate includes a single load pin centrally disposed to apply a load to the fixture stack segment and facilitate bonding the lower section and HTE together.Type: GrantFiled: December 22, 2020Date of Patent: August 2, 2022Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Phillip D. Isaacs, Christopher M. Marroquin, Daren Simmons, Frank L. Pompeo, Jason R. Eagle, Mark K. Hoffmeyer, Michael J. Ellsworth, Jr., Prabjit Singh, Steve Ostrander
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Patent number: 11238726Abstract: An apparatus for traffic control is disclosed. A method and a system also perform the functions of the apparatus. The apparatus includes an alert module that broadcasts an alert signal to a vehicle on a roadway. The alert indicates a presence of an alert zone along the roadway. The apparatus includes an alert zone module that broadcasts a location of the alert zone, where the alert signal has a signal strength sufficient for an autonomous vehicle control system of the vehicle to receive the alert signal a predefined distance before entering the alert zone as the vehicle approaches the alert zone. The apparatus includes an instruction module that broadcasts one or more instructions regarding driving within the alert zone.Type: GrantFiled: December 2, 2016Date of Patent: February 1, 2022Assignee: International Business Machines CorporationInventors: Phillip D. Isaacs, Eric V. Kline, Sarbajit K. Rakshit
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Publication number: 20210111037Abstract: A fixture to facilitate fabrication of a heat sink includes a base plate to support a lower section of the heat sink, and multiple registration pins extending from the base plate. A platen is provided over a heat transfer element (HTE) of the heat sink, with the platen including slip fit regions to slip fit around respective registration pins, and with the lower section and HTE disposed between the base plate and the platen, and forming a fixture stack segment aligned with an active region of the cold plate. A load plate is provided which includes slip fit regions configured to slip fit around corresponding registration pins with the load plate disposed over the fixture stack segment. The load plate includes a single load pin centrally disposed to apply a load to the fixture stack segment and facilitate bonding the lower section and HTE together.Type: ApplicationFiled: December 22, 2020Publication date: April 15, 2021Inventors: Phillip D. ISAACS, Christopher M. MARROQUIN, Daren SIMMONS, Frank L. POMPEO, Jason R. EAGLE, Mark K. HOFFMEYER, Michael J. ELLSWORTH, JR., Prabjit SINGH, Steve OSTRANDER
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Patent number: 10978313Abstract: A fixture to facilitate fabrication of a heat sink includes a base plate to support a lower section of the heat sink, and multiple registration pins extending from the base plate. A platen is provided over a heat transfer element (HTE) of the heat sink, with the platen including slip fit regions to slip fit around respective registration pins, and with the lower section and HTE disposed between the base plate and the platen, and forming a fixture stack segment aligned with an active region of the cold plate. A load plate is provided which includes slip fit regions configured to slip fit around corresponding registration pins with the load plate disposed over the fixture stack segment. The load plate includes a single load pin centrally disposed to apply a load to the fixture stack segment and facilitate bonding the lower section and HTE together.Type: GrantFiled: February 20, 2018Date of Patent: April 13, 2021Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Phillip D. Isaacs, Christopher M. Marroquin, Daren Simmons, Frank L. Pompeo, Jason R. Eagle, Mark K. Hoffmeyer, Michael J. Ellsworth, Jr., Prabjit Singh, Steve Ostrander
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Patent number: 10956941Abstract: A method, computer system, and a computer program product for dynamic billboard advertisements is provided. The present invention may include determining that a vehicle is approaching a display location. The present invention may then include receiving a plurality of data associated with the approaching vehicle. The present invention may then include resolving an advertisement to be displayed based on the received plurality of data. The present invention may then include establishing the display location based on the received plurality of data. The present invention may finally include projecting the resolved advertisement at the established display location.Type: GrantFiled: September 15, 2017Date of Patent: March 23, 2021Assignee: International Business Machines CorporationInventors: Phillip D. Isaacs, Eric V. Kline, Sarbajit K. Rakshit
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Patent number: 10825051Abstract: A method, computer system, and a computer program product for dynamic billboard advertisements is provided. The present invention may include determining that a vehicle is approaching a display location. The present invention may then include receiving a plurality of data associated with the approaching vehicle. The present invention may then include resolving an advertisement to be displayed based on the received plurality of data. The present invention may then include establishing the display location based on the received plurality of data. The present invention may finally include projecting the resolved advertisement at the established display location.Type: GrantFiled: December 7, 2017Date of Patent: November 3, 2020Assignee: International Business Machines CorporationInventors: Phillip D. Isaacs, Eric V. Kline, Sarbajit K. Rakshit
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Publication number: 20190259632Abstract: A fixture to facilitate fabrication of a heat sink includes a base plate to support a lower section of the heat sink, and multiple registration pins extending from the base plate. A platen is provided over a heat transfer element (HTE) of the heat sink, with the platen including slip fit regions to slip fit around respective registration pins, and with the lower section and HTE disposed between the base plate and the platen, and forming a fixture stack segment aligned with an active region of the cold plate. A load plate is provided which includes slip fit regions configured to slip fit around corresponding registration pins with the load plate disposed over the fixture stack segment. The load plate includes a single load pin centrally disposed to apply a load to the fixture stack segment and facilitate bonding the lower section and HTE together.Type: ApplicationFiled: February 20, 2018Publication date: August 22, 2019Inventors: Phillip D. ISAACS, Christopher M. MARROQUIN, Daren SIMMONS, Frank L. POMPEO, Jason R. EAGLE, Mark K. HOFFMEYER, Michael J. ELLSWORTH, JR., Prabjit SINGH, Steve OSTRANDER
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Publication number: 20190088176Abstract: A method, computer system, and a computer program product for dynamic billboard advertisements is provided. The present invention may include determining that a vehicle is approaching a display location. The present invention may then include receiving a plurality of data associated with the approaching vehicle. The present invention may then include resolving an advertisement to be displayed based on the received plurality of data. The present invention may then include establishing the display location based on the received plurality of data. The present invention may finally include projecting the resolved advertisement at the established display location.Type: ApplicationFiled: December 7, 2017Publication date: March 21, 2019Inventors: Phillip D. Isaacs, Eric V. Kline, Sarbajit K. Rakshit
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Publication number: 20190088175Abstract: A method, computer system, and a computer program product for dynamic billboard advertisements is provided. The present invention may include determining that a vehicle is approaching a display location. The present invention may then include receiving a plurality of data associated with the approaching vehicle. The present invention may then include resolving an advertisement to be displayed based on the received plurality of data. The present invention may then include establishing the display location based on the received plurality of data. The present invention may finally include projecting the resolved advertisement at the established display location.Type: ApplicationFiled: September 15, 2017Publication date: March 21, 2019Inventors: Phillip D. Isaacs, Eric V. Kline, Sarbajit K. Rakshit
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Patent number: 10237964Abstract: Manufacturing electronic packages is provided with enhanced heat dissipation capabilities. The method includes providing a plurality of electronic components, and an enclosure in which the electronic components reside. The enclosure includes a thermally conductive cover overlying the electronic components. The method includes providing at least one heat transfer element coupled to, or integrated with, the thermally conductive cover between a main surface of the cover and at least one respective electronic component. Further, the method includes providing a thermal interface material disposed between the heat transfer element(s) and the respective electronic component(s), which facilitates conductive transfer of heat from the electronic component(s) to the thermally conductive cover through the heat transfer element(s).Type: GrantFiled: September 7, 2015Date of Patent: March 19, 2019Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Phillip D. Isaacs, Michael T. Peets, Xiaojin Wei
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Publication number: 20180157264Abstract: An apparatus for traffic control is disclosed. A method and a system also perform the functions of the apparatus. The apparatus includes an alert module that broadcasts an alert signal to a vehicle on a roadway. The alert indicates a presence of an alert zone along the roadway. The apparatus includes an alert zone module that broadcasts a location of the alert zone, where the alert signal has a signal strength sufficient for an autonomous vehicle control system of the vehicle to receive the alert signal a predefined distance before entering the alert zone as the vehicle approaches the alert zone. The apparatus includes an instruction module that broadcasts one or more instructions regarding driving within the alert zone.Type: ApplicationFiled: December 2, 2016Publication date: June 7, 2018Inventors: PHILLIP D. ISAACS, ERIC V. KLINE, SARBAJIT K. RAKSHIT
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Patent number: 9839128Abstract: An apparatus includes a printed circuit board. The printed circuit board includes at least one conductive layer on top a first dielectric layer, wherein the at least one conductive layer comprises at least one of a ground plane and a power plane. The printed circuit board includes a second dielectric layer on top of the at least one conductive layer. The printed circuit board includes a thermal pad on top of the second dielectric layer. The printed circuit board is fabricated by forming at least one plated through hole for electrically coupling the thermal pad to the at least one conductive layer. The printed circuit board is fabricated by backdrilling the at least one plated through hole to remove a portion of the conductive material, wherein subsequent to the backdrilling the conductive material remaining in the at least one plated through hole electrically couples one or more of the at least one conductive layer to the thermal pad.Type: GrantFiled: July 27, 2016Date of Patent: December 5, 2017Assignee: International Business Machines CorporationInventor: Phillip D. Isaacs
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Patent number: 9560737Abstract: Electronic packages are provided with enhanced heat dissipation capabilities. The electronic package includes a plurality of electronic components, and an enclosure in which the electronic components reside. The enclosure includes a thermally conductive cover overlying the electronic components. At least one heat transfer element is coupled to, or integrated with, the thermally conductive cover and resides between a main surface of the cover and at least one respective electronic component of the plurality of electronic components. A thermal interface material is disposed between the heat transfer element(s) and the respective electronic component(s), and facilitates conductive transfer of heat from the electronic component(s) to the thermally conductive cover through the heat transfer element(s). The thermally conductive cover facilitates spreading and dissipating of the transferred heat outwards, for instance, through a surrounding tamper-respondent sensor and/or a surrounding encapsulant.Type: GrantFiled: March 4, 2015Date of Patent: January 31, 2017Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Phillip D. Isaacs, Michael T. Peets, Xiaojin Wei
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Publication number: 20160338200Abstract: An apparatus includes a printed circuit board. The printed circuit board includes at least one conductive layer on top a first dielectric layer, wherein the at least one conductive layer comprises at least one of a ground plane and a power plane. The printed circuit board includes a second dielectric layer on top of the at least one conductive layer. The printed circuit board includes a thermal pad on top of the second dielectric layer. The printed circuit board is fabricated by forming at least one plated through hole for electrically coupling the thermal pad to the at least one conductive layer. The printed circuit board is fabricated by backdrilling the at least one plated through hole to remove a portion of the conductive material, wherein subsequent to the backdrilling the conductive material remaining in the at least one plated through hole electrically couples one or more of the at least one conductive layer to the thermal pad.Type: ApplicationFiled: July 27, 2016Publication date: November 17, 2016Inventor: Phillip D. Isaacs
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Patent number: 9462703Abstract: A method includes fabricating a printed circuit board. The fabricating includes forming at least one conductive layer on top a first dielectric layer, wherein the at least one conductive layer comprises at least one of a ground plane and a power plane. The fabricating includes forming a second dielectric layer on top of the at least one conductive layer. The fabricating includes forming a thermal pad on top of the second dielectric layer. The fabricating includes forming at least one plated through hole for electrically coupling the thermal pad to the at least one conductive layer. The fabricating includes backdrilling the at least one plated through hole to remove a portion of the conductive material, wherein subsequent to the backdrilling the conductive material remaining in the at least one plated through hole electrically couples one or more of the at least one conductive layer to the thermal pad.Type: GrantFiled: October 2, 2013Date of Patent: October 4, 2016Assignee: International Business Machines CorporationInventor: Phillip D. Isaacs
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Publication number: 20160262270Abstract: Electronic packages are provided with enhanced heat dissipation capabilities. The electronic package includes a plurality of electronic components, and an enclosure in which the electronic components reside. The enclosure includes a thermally conductive cover overlying the electronic components. At least one heat transfer element is coupled to, or integrated with, the thermally conductive cover and resides between a main surface of the cover and at least one respective electronic component of the plurality of electronic components. A thermal interface material is disposed between the heat transfer element(s) and the respective electronic component(s), and facilitates conductive transfer of heat from the electronic component(s) to the thermally conductive cover through the heat transfer element(s). The thermally conductive cover facilitates spreading and dissipating of the transferred heat outwards, for instance, through a surrounding tamper-respondent sensor and/or a surrounding encapsulant.Type: ApplicationFiled: September 7, 2015Publication date: September 8, 2016Inventors: Phillip D. ISAACS, Michael T. PEETS, Xiaojin WEI
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Publication number: 20160262253Abstract: Electronic packages are provided with enhanced heat dissipation capabilities. The electronic package includes a plurality of electronic components, and an enclosure in which the electronic components reside. The enclosure includes a thermally conductive cover overlying the electronic components. At least one heat transfer element is coupled to, or integrated with, the thermally conductive cover and resides between a main surface of the cover and at least one respective electronic component of the plurality of electronic components. A thermal interface material is disposed between the heat transfer element(s) and the respective electronic component(s), and facilitates conductive transfer of heat from the electronic component(s) to the thermally conductive cover through the heat transfer element(s). The thermally conductive cover facilitates spreading and dissipating of the transferred heat outwards, for instance, through a surrounding tamper-respondent sensor and/or a surrounding encapsulant.Type: ApplicationFiled: March 4, 2015Publication date: September 8, 2016Inventors: Phillip D. ISAACS, Michael T. PEETS, Xiaojin WEI
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Patent number: 9426900Abstract: A method includes fabricating a printed circuit board. The fabricating includes forming at least one conductive layer on top a first dielectric layer. The fabricating includes forming a second dielectric layer on top of the at least one conductive layer. The fabricating includes forming a thermal pad on top of the second dielectric layer. The fabricating includes forming a first through hole through the thermal pad, the second dielectric layer, the at least one conductive layer, and the first dielectric layer. The fabricating includes filling the first through hole with a conductive material to form a plated through hole. The fabricating includes topdrilling the plated through hole to remove a top portion of the conductive material from a top of the plated through hole, wherein a bottom portion of the conductive material remains in the plated through hole after removal of the top portion.Type: GrantFiled: November 13, 2013Date of Patent: August 23, 2016Assignee: GLOBALFOUNDRIES, Inc.Inventor: Phillip D. Isaacs
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Publication number: 20150131250Abstract: A method includes fabricating a printed circuit board. The fabricating includes forming at least one conductive layer on top a first dielectric layer. The fabricating includes forming a second dielectric layer on top of the at least one conductive layer. The fabricating includes forming a thermal pad on top of the second dielectric layer. The fabricating includes forming a first through hole through the thermal pad, the second dielectric layer, the at least one conductive layer, and the first dielectric layer. The fabricating includes filling the first through hole with a conductive material to form a plated through hole. The fabricating includes topdrilling the plated through hole to remove a top portion of the conductive material from a top of the plated through hole, wherein a bottom portion of the conductive material remains in the plated through hole after removal of the top portion.Type: ApplicationFiled: November 13, 2013Publication date: May 14, 2015Applicant: International Business Machines CorporationInventor: Phillip D. Isaacs
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Publication number: 20150092374Abstract: A method includes fabricating a printed circuit board. The fabricating includes forming at least one conductive layer on top a first dielectric layer, wherein the at least one conductive layer comprises at least one of a ground plane and a power plane. The fabricating includes forming a second dielectric layer on top of the at least one conductive layer. The fabricating includes forming a thermal pad on top of the second dielectric layer. The fabricating includes forming at least one plated through hole for electrically coupling the thermal pad to the at least one conductive layer. The fabricating includes backdrilling the at least one plated through hole to remove a portion of the conductive material, wherein subsequent to the backdrilling the conductive material remaining in the at least one plated through hole electrically couples one or more of the at least one conductive layer to the thermal pad.Type: ApplicationFiled: October 2, 2013Publication date: April 2, 2015Applicant: International Business Machines CorporationInventor: Phillip D. Isaacs