Abstract: A fixture to facilitate fabrication of a heat sink includes a base plate to support a lower section of the heat sink, and multiple registration pins extending from the base plate. A platen is provided over a heat transfer element (HTE) of the heat sink, with the platen including slip fit regions to slip fit around respective registration pins, and with the lower section and HTE disposed between the base plate and the platen, and forming a fixture stack segment aligned with an active region of the cold plate. A load plate is provided which includes slip fit regions configured to slip fit around corresponding registration pins with the load plate disposed over the fixture stack segment. The load plate includes a single load pin centrally disposed to apply a load to the fixture stack segment and facilitate bonding the lower section and HTE together.

Abstract: An apparatus for traffic control is disclosed. A method and a system also perform the functions of the apparatus. The apparatus includes an alert module that broadcasts an alert signal to a vehicle on a roadway. The alert indicates a presence of an alert zone along the roadway. The apparatus includes an alert zone module that broadcasts a location of the alert zone, where the alert signal has a signal strength sufficient for an autonomous vehicle control system of the vehicle to receive the alert signal a predefined distance before entering the alert zone as the vehicle approaches the alert zone. The apparatus includes an instruction module that broadcasts one or more instructions regarding driving within the alert zone.

Abstract: A fixture to facilitate fabrication of a heat sink includes a base plate to support a lower section of the heat sink, and multiple registration pins extending from the base plate. A platen is provided over a heat transfer element (HTE) of the heat sink, with the platen including slip fit regions to slip fit around respective registration pins, and with the lower section and HTE disposed between the base plate and the platen, and forming a fixture stack segment aligned with an active region of the cold plate. A load plate is provided which includes slip fit regions configured to slip fit around corresponding registration pins with the load plate disposed over the fixture stack segment. The load plate includes a single load pin centrally disposed to apply a load to the fixture stack segment and facilitate bonding the lower section and HTE together.

Abstract: A method, computer system, and a computer program product for dynamic billboard advertisements is provided. The present invention may include determining that a vehicle is approaching a display location. The present invention may then include receiving a plurality of data associated with the approaching vehicle. The present invention may then include resolving an advertisement to be displayed based on the received plurality of data. The present invention may then include establishing the display location based on the received plurality of data. The present invention may finally include projecting the resolved advertisement at the established display location.

Abstract: A method, computer system, and a computer program product for dynamic billboard advertisements is provided. The present invention may include determining that a vehicle is approaching a display location. The present invention may then include receiving a plurality of data associated with the approaching vehicle. The present invention may then include resolving an advertisement to be displayed based on the received plurality of data. The present invention may then include establishing the display location based on the received plurality of data. The present invention may finally include projecting the resolved advertisement at the established display location.

Abstract: A method, computer system, and a computer program product for dynamic billboard advertisements is provided. The present invention may include determining that a vehicle is approaching a display location. The present invention may then include receiving a plurality of data associated with the approaching vehicle. The present invention may then include resolving an advertisement to be displayed based on the received plurality of data. The present invention may then include establishing the display location based on the received plurality of data. The present invention may finally include projecting the resolved advertisement at the established display location.

Abstract: A method, computer system, and a computer program product for dynamic billboard advertisements is provided. The present invention may include determining that a vehicle is approaching a display location. The present invention may then include receiving a plurality of data associated with the approaching vehicle. The present invention may then include resolving an advertisement to be displayed based on the received plurality of data. The present invention may then include establishing the display location based on the received plurality of data. The present invention may finally include projecting the resolved advertisement at the established display location.

Abstract: Manufacturing electronic packages is provided with enhanced heat dissipation capabilities. The method includes providing a plurality of electronic components, and an enclosure in which the electronic components reside. The enclosure includes a thermally conductive cover overlying the electronic components. The method includes providing at least one heat transfer element coupled to, or integrated with, the thermally conductive cover between a main surface of the cover and at least one respective electronic component. Further, the method includes providing a thermal interface material disposed between the heat transfer element(s) and the respective electronic component(s), which facilitates conductive transfer of heat from the electronic component(s) to the thermally conductive cover through the heat transfer element(s).

Abstract: An apparatus includes a printed circuit board. The printed circuit board includes at least one conductive layer on top a first dielectric layer, wherein the at least one conductive layer comprises at least one of a ground plane and a power plane. The printed circuit board includes a second dielectric layer on top of the at least one conductive layer. The printed circuit board includes a thermal pad on top of the second dielectric layer. The printed circuit board is fabricated by forming at least one plated through hole for electrically coupling the thermal pad to the at least one conductive layer. The printed circuit board is fabricated by backdrilling the at least one plated through hole to remove a portion of the conductive material, wherein subsequent to the backdrilling the conductive material remaining in the at least one plated through hole electrically couples one or more of the at least one conductive layer to the thermal pad.

Abstract: Electronic packages are provided with enhanced heat dissipation capabilities. The electronic package includes a plurality of electronic components, and an enclosure in which the electronic components reside. The enclosure includes a thermally conductive cover overlying the electronic components. At least one heat transfer element is coupled to, or integrated with, the thermally conductive cover and resides between a main surface of the cover and at least one respective electronic component of the plurality of electronic components. A thermal interface material is disposed between the heat transfer element(s) and the respective electronic component(s), and facilitates conductive transfer of heat from the electronic component(s) to the thermally conductive cover through the heat transfer element(s). The thermally conductive cover facilitates spreading and dissipating of the transferred heat outwards, for instance, through a surrounding tamper-respondent sensor and/or a surrounding encapsulant.

Abstract: An apparatus includes a printed circuit board. The printed circuit board includes at least one conductive layer on top a first dielectric layer, wherein the at least one conductive layer comprises at least one of a ground plane and a power plane. The printed circuit board includes a second dielectric layer on top of the at least one conductive layer. The printed circuit board includes a thermal pad on top of the second dielectric layer. The printed circuit board is fabricated by forming at least one plated through hole for electrically coupling the thermal pad to the at least one conductive layer. The printed circuit board is fabricated by backdrilling the at least one plated through hole to remove a portion of the conductive material, wherein subsequent to the backdrilling the conductive material remaining in the at least one plated through hole electrically couples one or more of the at least one conductive layer to the thermal pad.

Abstract: A method includes fabricating a printed circuit board. The fabricating includes forming at least one conductive layer on top a first dielectric layer, wherein the at least one conductive layer comprises at least one of a ground plane and a power plane. The fabricating includes forming a second dielectric layer on top of the at least one conductive layer. The fabricating includes forming a thermal pad on top of the second dielectric layer. The fabricating includes forming at least one plated through hole for electrically coupling the thermal pad to the at least one conductive layer. The fabricating includes backdrilling the at least one plated through hole to remove a portion of the conductive material, wherein subsequent to the backdrilling the conductive material remaining in the at least one plated through hole electrically couples one or more of the at least one conductive layer to the thermal pad.

Abstract: A method includes fabricating a printed circuit board. The fabricating includes forming at least one conductive layer on top a first dielectric layer. The fabricating includes forming a second dielectric layer on top of the at least one conductive layer. The fabricating includes forming a thermal pad on top of the second dielectric layer. The fabricating includes forming a first through hole through the thermal pad, the second dielectric layer, the at least one conductive layer, and the first dielectric layer. The fabricating includes filling the first through hole with a conductive material to form a plated through hole. The fabricating includes topdrilling the plated through hole to remove a top portion of the conductive material from a top of the plated through hole, wherein a bottom portion of the conductive material remains in the plated through hole after removal of the top portion.

Abstract: A method includes fabricating a printed circuit board. The fabricating includes forming at least one conductive layer on top a first dielectric layer. The fabricating includes forming a second dielectric layer on top of the at least one conductive layer. The fabricating includes forming a thermal pad on top of the second dielectric layer. The fabricating includes forming a first through hole through the thermal pad, the second dielectric layer, the at least one conductive layer, and the first dielectric layer. The fabricating includes filling the first through hole with a conductive material to form a plated through hole. The fabricating includes topdrilling the plated through hole to remove a top portion of the conductive material from a top of the plated through hole, wherein a bottom portion of the conductive material remains in the plated through hole after removal of the top portion.

Abstract: A method includes fabricating a printed circuit board. The fabricating includes forming at least one conductive layer on top a first dielectric layer, wherein the at least one conductive layer comprises at least one of a ground plane and a power plane. The fabricating includes forming a second dielectric layer on top of the at least one conductive layer. The fabricating includes forming a thermal pad on top of the second dielectric layer. The fabricating includes forming at least one plated through hole for electrically coupling the thermal pad to the at least one conductive layer. The fabricating includes backdrilling the at least one plated through hole to remove a portion of the conductive material, wherein subsequent to the backdrilling the conductive material remaining in the at least one plated through hole electrically couples one or more of the at least one conductive layer to the thermal pad.

Abstract: An optical subassembly (OSA), in accordance with the present invention, includes a housing, which may be substantially rectangular, the OSA includes a first end portion and a second end portion oppositely disposed from the first end portion. The first end portion forms a bore configured and dimensioned to receive a ferrule having an optical fiber therein. The bore is adjacent to a ferrule stop which is integrally formed in the housing. A lens is integrally formed with the housing. The lens has a planar surface and a convex surface opposite the planar surface. The planar surface of the lens is substantially parallel to and set in from the ferrule stop to prevent contact between the ferrule and the planar surface. The optical device, the lens, and the bore which accepts the ferrule are all in optical alignment.

Abstract: An apparatus for dissipating heat generated by an electronic device and a method for mounting the apparatus to an electronic device are disclosed. The apparatus includes a heat transfer body which is mounted in proximity to an electronic device. In addition, the apparatus includes an adhesive distributed on the heat transfer body, which affixes the heat transfer body in proximity to the electronic device. The adhesive is distributed on the heat transfer body such that heat transfer from the electronic device to the heat transfer body occurs substantially independently from the adhesive. The apparatus further includes a thermally conductive material disposed between the electronic device and the heat transfer body. The thermally conductive material is selected to maximize heat transfer from the electronic device to the heat transfer body.

Abstract: An apparatus for dissipating heat generated by an electronic device and a method for mounting the apparatus to an electronic device are disclosed. The apparatus includes a heat transfer body which is mounted in proximity to an electronic device. In addition, the apparatus includes an adhesive distributed on the heat transfer body, which affixes the heat transfer body in proximity to the electronic device. The adhesive is distributed on the heat transfer body such that heat transfer from the electronic device to the heat transfer body occurs substantially independently from the adhesive. The apparatus further includes a thermally conductive material disposed between the electronic device and the heat transfer body. The thermally conductive material is selected to maximize heat transfer from the electronic device to the heat transfer body.

Abstract: An apparatus for dissipating heat generated by an electronic device and a method for mounting the apparatus to an electronic device are disclosed. The apparatus includes a heat transfer body which is mounted in proximity to an electronic device. In addition, the apparatus includes an adhesive distributed on the heat transfer body, which affixes the heat transfer body in proximity to the electronic device. The adhesive is distributed on the heat transfer body such that heat transfer from the electronic device to the heat transfer body occurs substantially independently from the adhesive. The apparatus further includes a thermally conductive material disposed between the electronic device and the heat transfer body. The thermally conductive material is selected to maximize heat transfer from the electronic device to the heat transfer body.

Abstract: A method for analyzing solder joint assemblies in devices such as solder bumped silicon chips, ball grid arrays or land grid arrays is disclosed. The method includes applying a dye solution to a device under test and then causing that dye solution to penetrate any interstices between any solder interconnect and the device under test, which also includes penetrating any fractures in any joints or joint failures. Next, the dye is dried or cured so as to provide ready analysis upon the analysis portion of the method. The device under test is then caused to be separated or fractured in such a way that a seam or border of a solder joint or an attachment border may be analyzed to identify any structural failure by visually analyzing where any dye has penetrated such structural failures.