Patents by Inventor Phillip D. Krotz

Phillip D. Krotz has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • High strength gold wire for microelectronics miniaturization and method of making the same
    Patent number: 5915160
    Abstract: High strength gold wire for use in microelectronics and a method of producing the same are disclosed. In the methods of the present invention, a gold alloy having gold and a dilute rare earth (RE) element is produced. Next, the gold alloy is atomized into a powder. The dilute RE element is at least partially oxidized during atomization. Then, the powder is consolidated into an oxide dispersion strengthened gold billet. Finally, gold wire is formed from the oxide dispersion strengthened gold billet. The high strength gold wire can be drawn to a diameter less than conventional gold wire, while still maintaining mechanical and electrical properties, thereby facilitating microelectronics miniaturization.
    Type: Grant
    Filed: February 17, 1998
    Date of Patent: June 22, 1999
    Assignee: Rockwell International
    Inventors: Phillip D. Krotz, David D. Hillman, Nicole L. DeBlieck Cavanah