Patents by Inventor Phillip D. Smith

Phillip D. Smith has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Minimally invasive implantable neurostimulation system
    Patent number: 11957893
    Abstract: A neuromodulation therapy is delivered via at least one electrode implanted subcutaneously and superficially to a fascia layer superficial to a nerve of a patient. In one example, an implantable medical device is deployed along a superficial surface of a deep fascia tissue layer superficial to a nerve of a patient. Electrical stimulation energy is delivered to the nerve through the deep fascia tissue layer via implantable medical device electrodes.
    Type: Grant
    Filed: August 25, 2020
    Date of Patent: April 16, 2024
    Assignee: Medtronic, Inc.
    Inventors: Brad C. Tischendorf, John E. Kast, Thomas P. Miltich, Gordon O. Munns, Randy S. Roles, Craig L. Schmidt, Joseph J. Viavattine, Christian S. Nielsen, Prabhakar A. Tamirisa, Anthony M. Chasensky, Markus W. Reiterer, Chris J. Paidosh, Reginald D. Robinson, Bernard Q. Li, Erik R. Scott, Phillip C. Falkner, Xuan K. Wei, Eric H. Bonde, David A. Dinsmoor, Duane L. Bourget, Forrest C M Pape, Gabriela C. Molnar, Joel A. Anderson, Michael J. Ebert, Richard T. Stone, Shawn C. Kelley, Stephen J. Roddy, Timothy J. Denison, Todd V. Smith
  • Minimally invasive implantable neurostimulation system
    Patent number: 11957894
    Abstract: A neuromodulation therapy is delivered via at least one electrode implanted subcutaneously and superficially to a fascia layer superficial to a nerve of a patient. In one example, an implantable medical device is deployed along a superficial surface of a deep fascia tissue layer superficial to a nerve of a patient. Electrical stimulation energy is delivered to the nerve through the deep fascia tissue layer via implantable medical device electrodes.
    Type: Grant
    Filed: August 25, 2020
    Date of Patent: April 16, 2024
    Assignee: Medtronic, Inc.
    Inventors: Anthony M. Chasensky, Bernard Q. Li, Brad C. Tischendorf, Chris J. Paidosh, Christian S. Nielsen, Craig L. Schmidt, David A. Dinsmoor, Duane L. Bourget, Eric H. Bonde, Erik R. Scott, Forrest C M Pape, Gabriela C. Molnar, Gordon O. Munns, Joel A. Anderson, John E. Kast, Joseph J. Viavattine, Markus W. Reiterer, Michael J. Ebert, Phillip C. Falkner, Prabhakar A. Tamirisa, Randy S. Roles, Reginald D. Robinson, Richard T. Stone, Shawn C. Kelley, Stephen J. Roddy, Thomas P. Miltich, Timothy J. Denison, Todd V. Smith, Xuan K. Wei
  • Multiple configurable I/O common mezzanine cards
    Patent number: 7082487
    Abstract: CMC boards have standardized dimensions for an “I/O envelope” (to accommodate components for I/O functions) and a “component envelope” (to accommodate components for core board functions). Daughter cards are developed (mainly to perform I/O functions but also to perform core board functions, if desired) that fit within the standardized dimensions of the I/O envelope.
    Type: Grant
    Filed: February 20, 2002
    Date of Patent: July 25, 2006
    Assignee: Spectrum Signal Processing, Inc.
    Inventors: Mohammad Darwish, Leonard G. Pucker, Phillip D. Smith, Roy Gee Leong Woo
  • Multiple configurable I/O common mezzanine cards
    Publication number: 20030158989
    Abstract: CMC boards have standardized dimensions for an “I/O envelope” (to accommodate components for I/O functions) and a “component envelope” (to accommodate components for core board functions). Daughter cards are developed (mainly to perform I/O functions but also to perform core board functions, if desired) that fit within the standardized dimensions of the I/O envelope.
    Type: Application
    Filed: February 20, 2002
    Publication date: August 21, 2003
    Inventors: Mohammad Darwish, Leonard G. Pucker, Phillip D. Smith, Roy Gee Leong Woo