Abstract: A method of delivering safe, suitable, and repeatable dosages to a subject for topical, oral, nasal, or pulmonary use and a device for droplet ejection includes a fluid delivery system capable of delivering a defined volume of the fluid in the form of droplets having properties that afford adequate and repeatable high percentage deposition upon application. The method and device include a housing, a reservoir disposed within the housing for receiving a volume of fluid, an ejector mechanism configured to eject a stream of droplets having an average ejected droplet diameter greater than 15 microns, the stream of droplets having low entrained airflow such that the stream of droplets deposit on the eye of the subject during use.

Abstract: A method of delivering safe, suitable, and repeatable dosages to a subject for topical, oral, nasal, or pulmonary use and a device for droplet ejection includes a fluid delivery system capable of delivering a defined volume of the fluid in the form of droplets having properties that afford adequate and repeatable high percentage deposition upon application. The method and device include a housing, a reservoir disposed within the housing for receiving a volume of fluid, an ejector mechanism configured to eject a stream of droplets having an average ejected droplet diameter greater than 15 microns, the stream of droplets having low entrained airflow such that the stream of droplets deposit on the eye of the subject during use.

Abstract: A method of delivering safe, suitable, and repeatable dosages to a subject for topical, oral, nasal, or pulmonary use and a device for droplet ejection includes a fluid delivery system capable of delivering a defined volume of the fluid in the form of droplets having properties that afford adequate and repeatable high percentage deposition upon application. The method and device include a housing, a reservoir disposed within the housing for receiving a volume of fluid, an ejector mechanism configured to eject a stream of droplets having an average ejected droplet diameter greater than 15 microns, the stream of droplets having low entrained airflow such that the stream of droplets deposit on the eye of the subject during use.

Abstract: A method of delivering safe, suitable, and repeatable dosages to a subject for topical, oral, nasal, or pulmonary use and a device for droplet ejection includes a fluid delivery system capable of delivering a defined volume of the fluid in the form of droplets having properties that afford adequate and repeatable high percentage deposition upon application. The method and device include a housing, a reservoir disposed within the housing for receiving a volume of fluid, an ejector mechanism configured to eject a stream of droplets having an average ejected droplet diameter greater than 15 microns, the stream of droplets having low entrained airflow such that the stream of droplets deposit on the eye of the subject during use.

Abstract: A method of delivering safe, suitable, and repeatable dosages to a subject for topical, oral, nasal, or pulmonary use and a device for droplet ejection includes a fluid delivery system capable of delivering a defined volume of the fluid in the form of droplets having properties that afford adequate and repeatable high percentage deposition upon application. The method and device include a housing, a reservoir disposed within the housing for receiving a volume of fluid, an ejector mechanism configured to eject a stream of droplets having an average ejected droplet diameter greater than 15 microns, the stream of droplets having low entrained airflow such that the stream of droplets deposit on the eye of the subject during use.

Abstract: A method of delivering safe, suitable, and repeatable dosages to a subject for topical, oral, nasal, or pulmonary use and a device for droplet ejection includes a fluid delivery system capable of delivering a defined volume of the fluid in the form of droplets having properties that afford adequate and repeatable high percentage deposition upon application. The method and device include a housing, a reservoir disposed within the housing for receiving a volume of fluid, an ejector mechanism configured to eject a stream of droplets having an average ejected droplet diameter greater than 15 microns, the stream of droplets having low entrained airflow such that the stream of droplets deposit on the eye of the subject during use.

Abstract: In a satellite control system, a liquid is ejected by thermal ejection from holes in a substrate structure to create a reactive force on the satellite allowing the position, such as the attitude, of the satellite to be adjusted.

Abstract: A method of micromachining a copper layer on a substrate is carried out by maintaining the substrate in a vacuum, bombarding a portion of the substrate with a focused particle beam from a particle source, and exposing the substrate to a supply of organic chloride or hydroxide during particle bombardment. The organic chloride or hydroxide concentration at the substrate is an amount sufficient to enhance the relative removal of the copper layer by decreasing the removal of the dielectric or increasing the removal of the copper or a combination of both.

Abstract: A method of micromachining a copper layer on a substrate is carried out by maintaining the substrate in a vacuum, bombarding a portion of the substrate with a focused particle beam from a particle source, and exposing the substrate to a supply of organic chloride or hydroxide during particle bombardment. The organic chloride or hydroxide concentration at the substrate is an amount sufficient to enhance the relative removal of the copper layer by decreasing the removal of the dielectric or increasing the removal of the copper or a combination of both.

Abstract: A method of micromachining a copper layer on a substrate is carried out by maintaining the substrate in a vacuum, bombarding a portion of the substrate with a focused particle beam from a particle source, and exposing the substrate to a supply of organic chloride or hydroxide during particle bombardment. The organic chloride or hydroxide concentration at the substrate is an amount sufficient to enhance the relative removal of the copper layer by,decreasing the removal of the dielectric or increasing the removal of the copper or a combination of both.

Abstract: A method of micromachining a copper layer on a substrate is carried out by maintaining the substrate in a vacuum, bombarding a portion of the substrate with a focused particle beam from a particle source, and exposing the substrate to a supply of organic chloride or hydroxide during particle bombardment. The organic chloride or hydroxide concentration at the substrate is an amount sufficient to enhance the relative removal of the copper layer by decreasing the removal of the dielectric or increasing the removal of the copper or a combination of both.

Abstract: A method of micromachining a copper layer on a substrate is carried out by maintaining the substrate in a vacuum, bombarding a portion of the substrate with a focused particle beam from a particle source, and exposing the substrate to a supply of organic chloride or hydroxide during particle bombardment. The organic chloride or hydroxide concentration at the substrate is an amount sufficient to enhance the relative removal of the copper layer by decreasing the removal of the dielectric or increasing the removal of the copper or a combination of both.

Abstract: Water vapor enhanced focused particle beam machining speeds up the removal of polymer-based dielectric materials from areas surrounding metallic interconnects on integrated circuits while at the same time decreasing the rate of removal of aluminum. Selective material removal protects metal interconnects from machining damage and greatly reduces the time that protective material is exposed to the particle beam.

Abstract: Water vapor enhanced focused particle beam machining speeds up the removal of polymer-based dielectric materials from areas surrounding metallic interconnects on integrated circuits while at the same time decreasing the rate of removal of aluminum. Selective material removal protects metal interconnects from machining damage and greatly reduces the time that protective material is exposed to the particle beam.

Abstract: A method of fabricating a double-tapered scanning tunneling microscope comprises (a) immersing one end of the tip in a bath of an acidic aqueous etchant solution containing an alkaline earth salt, with the wire positioned substantially perpendicularly to the surface of the solution; and (b) etching the wire at about 25 volts root mean squared (rms) alternating current (ac) until a double-tapered tip is formed thereon. The etching step is preferably followed by a polishing step which comprises (c) providing a thin film of a second acidic aqueous etchant solution containing an alkaline earth salt; then (d) contacting said electrode tip to the thin film: and then (e) etching the tip at about 2 volts rms ac to thereby polish the tip.Also disclosed is a method of inhibiting the formation of carbon on a scanning tunneling microscope tip which comprises (a) positioning a wire in an etchant solution and then (b) etching the wire while excluding carbon dioxide therefrom.

Abstract: A method of fabricating a double-tapered scanning tunneling microscope comprises (a) immersing one end of the tip in a bath of an acidic aqueous etchant solution containing an alkaline earth salt, with the wire positioned substantially perpendicularly to the surface of the solution; and (b) etching the wire at about 25 volts root mean squared (rms) alternating current (ac) until a double-tapered tip is formed thereon. The etching step is preferably followed by a polishing step which comprises (c) providing a thin film of a second acidic aqueous etchant solution containing an alkaline earth salt; then (d) contacting said electrode tip to the thin film: and then (e) etching the tip at about 2 volts rms ac to thereby polish the tip.Also disclosed is a method inhibiting the formation of carbon on a scanning tunneling microscope tip which comprises (a) positioning a wire in an etchant solution and then (b) etching the wire while excluding carbon dioxide therefrom.