Patents by Inventor Phillip Ekkels

Phillip Ekkels has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9637379
    Abstract: A method can be used for producing a microelectromechanical transducer. A plurality of microelectromechanical transducers are produced on a single wafer. Each transducer includes a diaphragm. The wafer is divided into at least a first and a second region. The mechanical tensions of a random sample of diaphragms of the first region are established and the values are compared with a predetermined desired value. The mechanical tensions of a random sample of diaphragms of the second region are established and the values are compared with the predetermined desired value. The tensions of the diaphragms in the first region are adjusted to the predetermined desired value, and the tensions of the diaphragms in the second region are adjusted to the predetermined desired value.
    Type: Grant
    Filed: July 2, 2014
    Date of Patent: May 2, 2017
    Assignee: TDK Corporation
    Inventors: Marcel Giesen, Thomas Metzger, Phillip Ekkels, Ansgar Schäufele
  • Publication number: 20160167960
    Abstract: A method can be used for producing a microelectromechanical transducer. A plurality of microelectromechanical transducers are produced on a single wafer. Each transducer includes a diaphragm. The wafer is divided into at least a first and a second region. The mechanical tensions of a random sample of diaphragms of the first region are established and the values are compared with a predetermined desired value. The mechanical tensions of a random sample of diaphragms of the second region are established and the values are compared with the predetermined desired value. The tensions of the diaphragms in the first region are adjusted to the predetermined desired value, and the tensions of the diaphragms in the second region are adjusted to the predetermined desired value.
    Type: Application
    Filed: July 2, 2014
    Publication date: June 16, 2016
    Inventors: Marcel GIESEN, Thomas METZGER, Phillip EKKELS, Ansgar SCHÄUFELE
  • Patent number: 8003537
    Abstract: A method for the production of a planar structure is disclosed. The method comprises producing on a substrate a plurality of structures of substantially equal height, and there being a space in between the plurality of structures. The method further comprises providing a fill layer of electromagnetic radiation curable material substantially filling the space between the structures. The method further comprises illuminating a portion of the fill layer with electromagnetic radiation, hereby producing a exposed portion and an unexposed portion, the portions being separated by an interface substantially parallel with the first main surface of the substrate. The method further comprises removing the portion above the interface.
    Type: Grant
    Filed: July 18, 2007
    Date of Patent: August 23, 2011
    Assignees: IMEC, Katholieke Universiteit Leuven
    Inventors: Xavier Rottenberg, Phillip Ekkels, Hendrikus Tilmans, Walter De Raedt
  • Publication number: 20080038916
    Abstract: A method for the production of a planar structure is disclosed. The method comprises producing on a substrate a plurality of structures of substantially equal height, and there being a space in between the plurality of structures. The method further comprises providing a fill layer of electromagnetic radiation curable material substantially filling the space between the structures. The method further comprises illuminating a portion of the fill layer with electromagnetic radiation, hereby producing a exposed portion and an unexposed portion, the portions being separated by an interface substantially parallel with the first main surface of the substrate. The method further comprises removing the portion above the interface.
    Type: Application
    Filed: July 18, 2007
    Publication date: February 14, 2008
    Applicants: Interuniversitair Microelektronica Centrum (MEC) vzw, Katholieke Unversiteit Leuven
    Inventors: Xavier Rottenberg, Phillip Ekkels, Hendrikus Tilmans, Walter De Raedt