Patents by Inventor Phillip Geissbühler

Phillip Geissbühler has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250116512
    Abstract: A light source directs an incident beam at a surface of the workpiece on a stage at an oblique angle. A detector images a diffraction pattern of the incident beam reflected off the workpiece. At least one of a twist angle and a tilt angle of the workpiece on the stage is determined based on the diffraction pattern. The workpiece may be a semiconductor wafer and the stage may be, for example, part of an ion implanter.
    Type: Application
    Filed: September 22, 2024
    Publication date: April 10, 2025
    Inventors: Phillip Geissbühler, FHM Faridur Rahman, Neil Bassom
  • Publication number: 20130248113
    Abstract: Non-oxidizing plasma treatment devices for treating a semiconductor workpiece generally include a substantially non-oxidizing gas source; a plasma generating component in fluid communication with the non-oxidizing gas source; a process chamber in fluid communication with the plasma generating component, and an exhaust conduit centrally located in a bottom wall of the process chamber. In one embodiment, the process chamber is formed of an aluminum alloy containing less than 0.15% copper by weight; In other embodiments, the process chamber includes a coating of a non-copper containing material to prevent formation of copper hydride during processing with substantially non-oxidizing plasma. In still other embodiments, the process chamber walls are configured to be heated during plasma processing. Also disclosed are non-oxidizing plasma processes.
    Type: Application
    Filed: May 13, 2013
    Publication date: September 26, 2013
    Applicant: Lam Research Corporation
    Inventors: Phillip Geissbûhler, Ivan Berry, Armin Huseinovic, Shijian Luo, Aseem Kumar Srivastava, Carlo Waldfried
  • Publication number: 20110136346
    Abstract: Non-oxidizing plasma treatment devices for treating a semiconductor workpiece generally include a substantially non-oxidizing gas source; a plasma generating component in fluid communication with the non-oxidizing gas source; a process chamber in fluid communication with the plasma generating component, and an exhaust conduit centrally located in a bottom wall of the process chamber. In one embodiment, the process chamber is formed of an aluminum alloy containing less than 0.15% copper by weight; In other embodiments, the process chamber includes a coating of a non-copper containing material to prevent formation of copper hydride during processing with substantially non-oxidizing plasma. In still other embodiments, the process chamber walls are configured to be heated during plasma processing. Also disclosed are non-oxidizing plasma processes.
    Type: Application
    Filed: December 4, 2009
    Publication date: June 9, 2011
    Applicant: AXCELIS TECHNOLOGIES, INC.
    Inventors: Phillip Geissbühler, Ivan Berry, Armin Huseinovic, Shijian Luo, Aseem Kumar Srivastava, Carlo Waldfried