Patents by Inventor Phillip H. Madison, IV

Phillip H. Madison, IV has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Epoxy Compositions and Methods of Use
    Publication number: 20190390079
    Abstract: This disclosure relates to epoxy compositions and more particularly to two-part epoxy compositions that are useful for marking substrates, such as roadway and airport runway surfaces. The compositions and methods described herein can reduce build-up on applicator pump seals. Such build-up can lead to pump failure. In some cases, the compositions can reduce down-time due to pump failure. However, the compositions retain the necessary properties for substrate marking, such as curing within a short period of time.
    Type: Application
    Filed: June 21, 2019
    Publication date: December 26, 2019
    Inventors: Tao Zhang, Gerald Vandezande, Phillip H. Madison, IV