Patents by Inventor Phillip H. Scruggs

Phillip H. Scruggs has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220151438
    Abstract: A heat retentive server includes a chamber defined between an upper shell and a lower shell that are connected to one another. An induction-heatable member is positioned in the chamber, and the induction-heatable member may be heated by electromagnetic induction to a first temperature that is greater than the heat deflection temperature of the upper shell. Buffering material is positioned in the chamber between the induction-heatable member and the upper shell, and the buffering material is adapted for providing predetermined conductive heat transfer from the induction-heatable member to the upper shell so that at least a portion of the upper shell is heated to a second temperature that is greater than the heat deflection temperature of the upper shell. The second temperature is less than the first temperature.
    Type: Application
    Filed: January 31, 2022
    Publication date: May 19, 2022
    Applicant: Aladdin Temp-Rite, LLC
    Inventors: Rodger D. Crocker, David R. Gordon, R. Kevin Ray, Timothy D. Altizer, Matthew J. McCartney, Martin A. Rothschild, Phillip H. Scruggs
  • Patent number: 11241117
    Abstract: A heat retentive server includes a chamber defined between an upper shell and a lower shell that are connected to one another. An induction-heatable member is positioned in the chamber, and the induction-heatable member may be heated by electromagnetic induction to a first temperature that is greater than the heat deflection temperature of the upper shell. Buffering material comprising an inhibitively conductive hydrophobic material is positioned in the chamber between the induction-heatable member and the upper shell, and the buffering material is adapted for providing predetermined conductive heat transfer from the induction-heatable member to the upper shell so that at least a portion of the upper shell is heated to a second temperature that is greater than the heat deflection temperature of the upper shell. The second temperature is less than the first temperature.
    Type: Grant
    Filed: November 30, 2017
    Date of Patent: February 8, 2022
    Assignee: Aladdin Temp-Rite LLC
    Inventors: Rodger D Crocker, David R Gordon, R Kevin Ray, Timothy D Altizer, Matthew J McCartney, Martin A Rothschild, Phillip H Scruggs
  • Publication number: 20210401226
    Abstract: A heat retentive server includes a chamber defined between an upper shell and a lower shell that are connected to one another. An induction-heatable member is positioned in the chamber, and the induction-heatable member may be heated by electromagnetic induction to a first temperature that is greater than the heat deflection temperature of the upper shell. Buffering material comprising an inhibitively conductive hydrophobic material is positioned in the chamber between the induction-heatable member and the upper shell, and the buffering material is adapted for providing predetermined conductive heat transfer from the induction-heatable member to the upper shell so that at least a portion of the upper shell is heated to a second temperature that is greater than the heat deflection temperature of the upper shell. The second temperature is less than the first temperature.
    Type: Application
    Filed: November 30, 2017
    Publication date: December 30, 2021
    Inventors: Rodger D. Crocker, David R. Gordon, R. Kevin Ray, Timothy D. Altizer, Matthew J. McCartney, Martin A. Rothschild, Phillip H. Scruggs
  • Publication number: 20180084950
    Abstract: A heat retentive server includes a chamber defined between an upper shell and a lower shell that are connected to one another. An induction-heatable member is positioned in the chamber, and the induction-heatable member may be heated by electromagnetic induction to a first temperature that is greater than the heat deflection temperature of the upper shell. Buffering material comprising an inhibitively conductive hydrophobic material is positioned in the chamber between the induction-heatable member and the upper shell, and the buffering material is adapted for providing predetermined conductive heat transfer from the induction-heatable member to the upper shell so that at least a portion of the upper shell is heated to a second temperature that is greater than the heat deflection temperature of the upper shell. The second temperature is less than the first temperature.
    Type: Application
    Filed: November 30, 2017
    Publication date: March 29, 2018
    Inventors: Rodger D. Crocker, David R. Gordon, R. Kevin Ray, Timothy D. Altizer, Matthew J. McCartney, Martin A. Rothschild, Phillip H. Scruggs