Patents by Inventor Phillip Hartmann

Phillip Hartmann has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • METHOD FOR CATHODIC CORROSION PROTECTION OF CHROMIUM SURFACES
    Publication number: 20160168725
    Abstract: The present invention concerns a method for cathodic corrosion protection of a substrate having a chromium surface and at least one intermediate layer between the substrate and the chromium surface, selected from the group comprising nickel, nickel alloys, copper and copper alloys and wherein said chromium surface is contacted with an aqueous solution comprising at least one compound containing phosphorous while passing an electrical current through said substrate, at least one anode and the aqueous solution wherein said substrate serves as the cathode.
    Type: Application
    Filed: June 17, 2014
    Publication date: June 16, 2016
    Applicant: Atotech Deutschland GmbH
    Inventors: Christina PFIRRMANN, Phillip HARTMANN, Philipp WACHTER, Stefan KRETSCHMER
  • Thermoformable, heat-sealable and heat-shrinkable multilayer film and method of using the film for producing packaging trays and packages
    Patent number: 8424273
    Abstract: Sealable, thermoformable, heat-shrinkable multi-layer film having a symmetrical construction around a two-ply inner layer, and having a heat shrinkability in machine direction and in cross direction of in each case at least 20% at 93° C., the heat-shrinkability being substantially unaffected by thermoforming, and use thereof with specially equipped packaging machines.
    Type: Grant
    Filed: August 28, 2007
    Date of Patent: April 23, 2013
    Assignee: CFS Kempten GmbH
    Inventors: Walter Bernig, Phillip Hartmann, Bernard Dujardin
  • THERMOFOMABLE PACKAGING MATERIAL WITH SHRINK PROPERTIES
    Publication number: 20090301035
    Abstract: Sealable, thermoformable, heat-shrinkable multi-layer film having a symmetrical construction around a two-ply inner layer, and having a heat shrinkability in machine direction and in cross direction of in each case at least 20% at 93° C., the heat-shrinkability being substantially unaffected by thermoforming, and use thereof with specially equipped packaging machines.
    Type: Application
    Filed: August 28, 2007
    Publication date: December 10, 2009
    Applicant: CFS KEMPTEN GMBH
    Inventors: Walter Bernig, Phillip Hartmann, Bernard Dujardin