Patents by Inventor Phillip Hua-Kuan Wang

Phillip Hua-Kuan Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6918269
    Abstract: A method and device for aligning and connecting an optical fiber (or device) with another optical device, are disclosed. The method rotates the optical fiber about three axes that intersect at the end surface of the fiber core so that rotation of the fiber does not cause a translation of the end of the fiber. This allows the alignment to be done quickly and accurately. Further, by making one of the axes co-linear with the longitudinal axis of the fiber, variations or defects in the end surface (or a lens mounted thereon) can be accounted for in the alignment procedure. Once aligned the housings of the optical devices are soldered together using a hot air nozzle. The nozzle can then direct cool air toward the housings to rapidly cool the solder, or the temperature of the air can be slowly ramped down to provide for controlled cooling of the solder.
    Type: Grant
    Filed: October 22, 2001
    Date of Patent: July 19, 2005
    Inventor: Phillip Hua-Kuan Wang
  • Publication number: 20020162362
    Abstract: A method and device for aligning and connecting an optical fiber (or device) with another optical device, are disclosed. The method rotates the optical fiber about three axes that intersect at the end surface of the fiber core so that rotation of the fiber does not cause a translation of the end of the fiber. This allows the alignment to be done quickly and accurately. Further, by making one of the axes co-linear with the longitudinal axis of the fiber, variations or defects in the end surface (or a lens mounted thereon) can be accounted for in the alignment procedure. Once aligned the housings of the optical devices are soldered together using a hot air nozzle. The nozzle can then direct cool air toward the housings to rapidly cool the solder, or the temperature of the air can be slowly ramped down to provide for controlled cooling of the solder.
    Type: Application
    Filed: October 22, 2001
    Publication date: November 7, 2002
    Inventor: Phillip Hua-Kuan Wang