Abstract: Embodiments of the present invention provide a system for distributing a thermal interface material. The system includes: an integrated circuit chip; a heat sink; and a compliant thermal interface material (TIM) between the integrated circuit chip and the heat sink. During assembly of the system, a mating surface of the heat sink and a mating surface of the integrated circuit chip are shaped to distribute the TIM in the predetermined pattern as the TIM is pressed between the mating surface of heat sink and a corresponding mating surface of the integrated circuit chip.

Abstract: An internal optical coating includes multiple layers of different materials and thicknesses and is disposed between a transparent display cover and a visual display unit for an electronic device display. The optical coating transmits most visible light, reflects most non-visible light and substantially absorbs blackbody radiation generated from within the electronic device. The multiple layers comprise two or more materials having alternating low and high indices of refraction, and can include 36 or more layers, each having a thickness ranging from 10 to 400 nanometers. The arrangement and thicknesses of the layers are designed based upon the thickness and optical properties of the transparent display cover. The internal optical coating can also be specially formulated to replace a typical internal anti-reflective coating proximate the visual display unit.

Abstract: An optical coating includes multiple layers of different materials and thicknesses and is disposed proximate a transparent display cover for an electronic device display. The optical coating transmits most visible light, reflects most non-visible light and substantially absorbs blackbody radiation generated from within the electronic device. The optical coating can be readily removable from the electronic device display either alone or in combination with a removable transparent display cover. The multiple layers comprise two or more materials having alternating low and high indices of refraction, and can include 36 or more layers, each having a thickness ranging from 10 to 400 nanometers. The arrangement and thicknesses of the layers are designed based upon the thickness and optical properties of the transparent display cover.

Abstract: Embodiments of the present invention provide a system for distributing a thermal interface material. The system includes: an integrated circuit chip; a heat sink; and a compliant thermal interface material (TIM) between the integrated circuit chip and the heat sink. During assembly of the system, a mating surface of the heat sink and a mating surface of the integrated circuit chip are shaped to distribute the TIM in the predetermined pattern as the TIM is pressed between the mating surface of heat sink and a corresponding mating surface of the integrated circuit chip.

Abstract: Embodiments of the present invention provide a system for distributing a thermal interface material. The system includes: an integrated circuit chip; a heat sink; and a compliant thermal interface material (TIM) between the integrated circuit chip and the heat sink. During assembly of the system, a mating surface of the heat sink and a mating surface of the integrated circuit chip are shaped to distribute the TIM in the predetermined pattern as the TIM is pressed between the mating surface of heat sink and a corresponding mating surface of the integrated circuit chip.

Abstract: Embodiments of the present invention provide a system for distributing a thermal interface material. The system includes: an integrated circuit chip; a heat sink; and a compliant thermal interface material (TIM) between the integrated circuit chip and the heat sink. During assembly of the system, a mating surface of the heat sink and a mating surface of the integrated circuit chip are shaped to distribute the TIM in the predetermined pattern as the TIM is pressed between the mating surface of heat sink and a corresponding mating surface of the integrated circuit chip.