Abstract: A user-interface is provided for facilitating the achievement of goals. The goals that are facilitated using the interface may vary from implementation to implementation. The interface includes an event timeline that has a chronologically-ordered series of event entries. The event entries indicate tasks associated with a plan for achieving one or more goals specified by the user. The plan is automatically determined by an automated service based on the user's specified goals, the timing/priority specified for those goals, and information about the user obtained from sources other than the user. The automated service periodically collects information from those sources to determine whether the user performs the specified tasks in compliance with the timings specified in the plan. In response to determining non-compliance, the service automatically revises the plan and generates a revised event timeline with event entries for tasks in the revised plan.

Abstract: A stiffener apparatus for reducing warpage of an integrated circuit package during heating and cooling are provided. The stiffener apparatus includes an IC substrate configured to receive an IC die on a top side of the IC substrate. The stiffener apparatus includes a primary stiffener ring adhered to the top side of the IC substrate and defining an opening in a region of the IC die such that the primary stiffener ring surrounds the region of the IC die. The primary stiffener ring defines a plurality of grooves. The stiffener apparatus includes a secondary stiffener ring having a plurality of catches configured to engage with the plurality of grooves to removably attach the secondary stiffener ring to the primary stiffener ring on a side of the primary stiffener ring opposite the IC substrate. A method of using a stiffener apparatus during a manufacturing operation is also provided.

Abstract: A stiffener apparatus for reducing warpage of an integrated circuit package during heating and cooling are provided. The stiffener apparatus includes an IC substrate configured to receive an IC die on a top side of the IC substrate. The stiffener apparatus includes a primary stiffener ring adhered to the top side of the IC substrate and defining an opening in a region of the IC die such that the primary stiffener ring surrounds the region of the IC die. The primary stiffener ring defines a plurality of grooves. The stiffener apparatus includes a secondary stiffener ring having a plurality of catches configured to engage with the plurality of grooves to removably attach the secondary stiffener ring to the primary stiffener ring on a side of the primary stiffener ring opposite the IC substrate. A method of using a stiffener apparatus during a manufacturing operation is also provided.