Patents by Inventor Phillip M. Rayer, II

Phillip M. Rayer, II has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and apparatus for the electrochemical deposition and planarization of a material on a workpiece surface
    Patent number: 7297239
    Abstract: An electrochemical apparatus is provided which deposits material onto or removes material from the surface of a workpiece. The apparatus comprises a polishing pad and a platen which is in turn comprised of a first conductive layer in contact with the polishing pad and coupled to a first potential, a second conductive layer coupled to a second potential, and a first insulating layer disposed between the first and second conductive layers. At least one electrical contact is positioned within the polishing pad and is electrically coupled to the second conductive layer. A reservoir is provided which places an electrolyte solution in contact with the polishing pad and the workpiece. A carrier positions and/or presses the workpiece against the polishing pad.
    Type: Grant
    Filed: August 18, 2004
    Date of Patent: November 20, 2007
    Assignee: Novellus Systems, Inc.
    Inventors: Ismail Emesh, Periya Gopalan, Phillip M. Rayer, II, Bentley J. Palmer
  • Method and apparatus for the electrochemical deposition and planarization of a material on a workpiece surface
    Patent number: 6802955
    Abstract: An electrochemical apparatus is provided which deposits material onto or removes material from the surface of a workpiece. The apparatus comprises a polishing pad and a platen which is in turn comprised of a first conductive layer in contact with the polishing pad and coupled to a first potential, a second conductive layer coupled to a second potential, and a first insulating layer disposed between the first and second conductive layers. At least one electrical contact is positioned within the polishing pad and is electrically coupled to the second conductive layer. A reservoir is provided which places an electrolyte solution in contact with the polishing pad and the workpiece. A carrier positions and/or presses the workpiece against the polishing pad.
    Type: Grant
    Filed: January 11, 2002
    Date of Patent: October 12, 2004
    Assignee: Speedfam-Ipec Corporation
    Inventors: Ismail Emesh, Periya Gopalan, Phillip M. Rayer, II, Bentley J. Palmer
  • Seal for use with a chemical mechanical planarization apparatus
    Patent number: 6406362
    Abstract: The present invention provides a labyrinth seal for use with a workpiece planarization apparatus, such as a chemical mechanical planarization apparatus. In accordance with one aspect of the invention, there is provided a labyrinth seal comprising a member having at least one sloped feature which is configured to inhibit a fluid from traveling into and through the labyrinth.
    Type: Grant
    Filed: January 4, 2001
    Date of Patent: June 18, 2002
    Assignee: SpeedFam-IPEC Corporation
    Inventors: Andrew Yednak, III, Phillip M. Rayer, II