Abstract: Systems and methods for providing input component assemblies with anti-rotational buttons in electronic devices are provided. The input component assembly includes a switch, a button positioned over the switch, where the button is operative to close at least one circuit of the switch when the button is depressed towards the switch, and at least one pin positioned underneath the button, where the at least one pin is operative to engage with a surface to assist in preventing rotation of the button, when the button is depressed towards the switch.

Abstract: Systems and methods for routing cables in an electronic device are provided. In some embodiments, the electronic device may include a touch sensor having a number of traces, a display component, and a mechanical button, each of which may be coupled to a circuit board via a single flexible circuit cable. This may save valuable space within the electronic device.

Abstract: Headsets with non-occluding earbuds are disclosed. The earbud includes a non-occluding housing having a directional sound port offset with respect to a center axis of the earbud. The housing can have an asymmetric shape amenable to in-the-ear retention. Additionally, the housing can have a seamless or nearly seamless construction even though two or more parts are joined together to form the housing. Front and back volumes can exist for a driver of the earbud, and embodiments of this invention use mid-mold and rear-mold structures to achieve desired performance from the earbud. For example, the mid-mold structure can be used to tune the front volume while the rear-mold structure can be used to tune the back volume. Apertures may also be included in the housing to further improve the performance of the earbud.

Abstract: Methods and apparatus for using an insert molding process to form a tactilely seamless overall part from component parts that are made from different materials are disclosed. According to one aspect of the present invention, a housing includes a first part formed from a first material and a second part formed from a second material that is of a different type than the first material. The first part includes a first external surface and a first bonding surface, and the second part includes a second external surface and a second bonding surface. The second bonding surface can be integrally bonded to the first bonding surface so that the first external surface and the second external surface form a gap-free overall surface.

Abstract: Methods and apparatus for using an insert molding process to form a tactilely seamless overall part from component parts that are made from different materials are disclosed. According to one aspect of the present invention, a housing includes a first part formed from a first material and a second part formed from a second material that is of a different type than the first material. The first part includes a first external surface and a first bonding surface, and the second part includes a second external surface and a second bonding surface. The second bonding surface can be integrally bonded to the first bonding surface so that the first external surface and the second external surface form a gap-free overall surface.

Abstract: Methods and apparatus for using an insert molding process to form a tactilely seamless overall part from component parts that are made from different materials are disclosed. According to one aspect of the present invention, a housing includes a first part formed from a first material and a second part formed from a second material that is of a different type than the first material. The first part includes a first external surface and a first bonding surface, and the second part includes a second external surface and a second bonding surface. The second bonding surface can be integrally bonded to the first bonding surface so that the first external surface and the second external surface form a gap-free overall surface.

Abstract: Electronic devices are provided with switch assembly input components that can have adhesives adhered to the side and/or bottom surfaces of support plates for retaining switches between the adhesives and the tops of the support plates. The switch assembly input components can include buttons with one or more absorption elements for receiving impact energy, reducing the impact energy, and transferring the reduced impact energy onto the switches.

Abstract: Electronic devices are provided with switch assembly input components that can have adhesives adhered to the side and/or bottom surfaces of support plates for retaining switches between the adhesives and the tops of the support plates. The switch assembly input components can include buttons with one or more absorption elements for receiving impact energy, reducing the impact energy, and transferring the reduced impact energy onto the switches.

Abstract: Systems and methods are provided for media devices including a housing, a frame disposed adjacent to the housing, a support panel that is integrated with the frame, and a flexible circuit that is disposed adjacent to the support panel such that the support panel provides support for the flexible circuit.

Abstract: Methods and apparatus for using an insert molding process to form a tactilely seamless overall part from component parts that are made from different materials are disclosed. According to one aspect of the present invention, a housing includes a first part formed from a first material and a second part formed from a second material that is of a different type than the first material. The first part includes a first external surface and a first bonding surface, and the second part includes a second external surface and a second bonding surface. The second bonding surface can be integrally bonded to the first bonding surface so that the first external surface and the second external surface form a gap-free overall surface.

Abstract: Electronic devices are provided with a protective housing having one or more housing components. A housing component can be formed from a single sheet of material to appear as if the housing component had been formed from a hollowed out solid block of material. The sheet of material may be deep drawn, forged, and machined to form the housing component. One or more holes may be formed through a portion of the housing component to provide an I/O interface.