Abstract: A new physical computer architecture that combines elements in a virtuous cycle to eliminate performance killing inefficiencies in compute systems and need never be physically repaired during its lifetime is described. The system comprises a three dimensional rectangular cube structure with integrated liquid cooling and a multi-dimensional direct network laced through it. The network comprises a distributed, dynamically adaptive, multiply-fault-tolerant routing protocol that can logically replace failed components.

Abstract: A new physical computer architecture that combines elements in a virtuous cycle to eliminate performance killing inefficiencies in compute systems and need never be physically repaired during its lifetime is described. The system comprises a three dimensional rectangular cube structure with integrated liquid cooling and a multi-dimensional direct network laced through it. The network comprises a distributed, dynamically adaptive, multiply-fault-tolerant routing protocol that can logically replace failed components.

Abstract: A cold plate compatible with the Open Compute Project Rack specification is disclosed. The cold plate is mounted in a compatible rack with removable trays mounted on support and coupling rails affixed to the underside of the cold plate thus supporting the trays during insertion and operation.

Abstract: A system and an method to provide cooling of electronic components mounted in a tray by means of a cold plate, is disclosed. The system comprises a cold plate that is mounted in a rack with removable trays mounted on rails affixed to the underside of the cold plate. In one embodiment, compatibility with Open Rack specifications developed by the Open Compute Project is disclosed.

Abstract: A cold plate compatible with the Open Compute Project Rack specification is disclosed. The cold plate is mounted in a compatible rack with removable trays mounted on support and coupling rails affixed to the underside of the cold plate thus supporting the trays during insertion and operation.

Abstract: A system and an method to provide cooling of electronic components mounted in a tray by means of a cold plate, is disclosed. The system comprises a cold plate that is mounted in a rack with removable trays mounted on rails affixed to the underside of the cold plate. In one embodiment, compatibility with Open Rack specifications developed by the Open Compute Project is disclosed.

Abstract: Various embodiments disclose a system and an associated method to provide cooling to a plurality of electronic components mounted proximately to one another in an electronic enclosure is disclosed. The system comprises a cold plate that is mounted on the electronic enclosure to conduct heat thermally. The cold plate has a first surface to mount proximate to the plurality of electronic components and a second surface to mount distal from the plurality of electronic components. One or more heat risers are configured to be thermally coupled between the first surface of the cold plate and at least one of the plurality of electronic components.

Abstract: Various embodiments disclose a system and an associated method to provide cooling to a plurality of electronic components mounted proximately to one another in an electronic enclosure is disclosed. The system comprises a cold plate that is mounted on the electronic enclosure to conduct heat thermally. The cold plate has a first surface to mount proximate to the plurality of electronic components and a second surface to mount distal from the plurality of electronic components. One or more heat risers are configured to be thermally coupled between the first surface of the cold plate and at least one of the plurality of electronic components.