Patents by Inventor Phillip QIAN
Phillip QIAN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230353931Abstract: This application relates to earbuds configured with one or more biometric sensors. At least one of the biometric sensors is configured to be pressed up against a portion of the tragus for making biometric measurements. In some embodiments, the housing of the earbud can be symmetric so that the earbud can be worn interchangeably in either a left or a right ear of a user. In such an embodiment, the earbud can include a sensor and circuitry configured to determine and alter operation of the earbud in accordance to which ear the earbud is determined to be sitting in.Type: ApplicationFiled: April 28, 2023Publication date: November 2, 2023Applicant: APPLE INC.Inventors: Phillip Qian, Edward Siahaan, Erik L. Wang, Christopher J. Stringer, Matthew Dean Rohrbach, Daniel Max Strongwater, Jason J. LeBlanc
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Publication number: 20230328418Abstract: This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that include earpad assemblies that improve acoustic isolation are discussed. User convenience features that include automatically detecting the orientation of the headphones on a user's head are also discussed. Various power-saving features, design features, sensor configurations and user comfort features are also discussed.Type: ApplicationFiled: May 15, 2023Publication date: October 12, 2023Applicant: APPLE INC.Inventors: Edward Siahaan, Daniel R. Bloom, Jason J. LeBlanc, Phillip Qian
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Publication number: 20230269513Abstract: A charging case for a pair of wireless earphones comprising: a housing having a peripheral wall that defines a shell; a frame insert coupled to the housing and extending into the shell, the frame insert having one or more insert walls that define first and second pockets sized and shaped to accept first and second wireless earphones, respectively, wherein the one or more insert walls cooperate with the housing primary wall to define a sealed chamber within the charging case; a lid coupled to the housing and operable between a closed position in which the lid covers the first and second pockets and an open position in which the first and second pockets are exposed; a speaker module disposed within the sealed chamber, the speaker module comprising an audio driver having a diaphragm that separates a front volume of the audio driver from a back volume of the audio driver and a speaker vent disposed within the back volume; one or more first openings formed through the peripheral wall and opening into the front volType: ApplicationFiled: August 24, 2022Publication date: August 24, 2023Applicant: APPLE INC.Inventors: Benjamin A. Cousins, Jarrett Lagler, Dirk Schmelzer, Sebastien D. de Rivaz, Tian Shi Li, Phillip Qian, Rebecca Russell, Jeyakkrishnan Chengleput Srinivasan, Jue Wang, Jerzy S. Guterman, Joel C. Yamasaki
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Publication number: 20230239605Abstract: Headphone eartips with internal support components and methods for making the same are provided. Different support components may provide specific amounts and types of additional rigidity at specific portions of an exterior surface of an outer eartip body that may be expected to interface with specific portions of an ear canal geometry when an eartip subassembly is positioned within the ear canal, such that the eartip subassembly may conform to the various shapes of the ear canal while maintaining an acoustic seal.Type: ApplicationFiled: March 28, 2023Publication date: July 27, 2023Applicant: APPLE INC.Inventors: Ethan L. Huwe, Brad G. Boozer, Erik L. Wang, Phillip Qian
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Patent number: 11700471Abstract: This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that include earpad assemblies that improve acoustic isolation are discussed. User convenience features that include automatically detecting the orientation of the headphones on a user's head are also discussed. Various power-saving features, design features, sensor configurations and user comfort features are also discussed.Type: GrantFiled: May 26, 2022Date of Patent: July 11, 2023Assignee: APPLE INC.Inventors: Edward Siahaan, Daniel R. Bloom, Jason J. LeBlanc, Phillip Qian
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Patent number: 11678106Abstract: This application relates to earbuds configured with one or more biometric sensors. At least one of the biometric sensors is configured to be pressed up against a portion of the tragus for making biometric measurements. In some embodiments, the housing of the earbud can be symmetric so that the earbud can be worn interchangeably in either a left or a right ear of a user. In such an embodiment, the earbud can include a sensor and circuitry configured to determine and alter operation of the earbud in accordance to which ear the earbud is determined to be sitting in.Type: GrantFiled: November 25, 2020Date of Patent: June 13, 2023Assignee: Apple Inc.Inventors: Phillip Qian, Edward Siahaan, Erik L. Wang, Christopher J. Stringer, Matthew Dean Rohrbach, Daniel Max Strongwater, Jason J. LeBlanc
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Patent number: 11647319Abstract: Headphone eartips with internal support components and methods for making the same are provided. Different support components may provide specific amounts and types of additional rigidity at specific portions of an exterior surface of an outer eartip body that may be expected to interface with specific portions of an ear canal geometry when an eartip subassembly is positioned within the ear canal, such that the eartip subassembly may conform to the various shapes of the ear canal while maintaining an acoustic seal.Type: GrantFiled: March 15, 2021Date of Patent: May 9, 2023Assignee: APPLE INC.Inventors: Ethan L. Huwe, Brad G. Boozer, Erik L. Wang, Phillip Qian
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Publication number: 20220386009Abstract: This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that include earpad assemblies that improve acoustic isolation are discussed. User convenience features that include automatically detecting the orientation of the headphones on a user's head are also discussed. Various power-saving features, design features, sensor configurations and user comfort features are also discussed.Type: ApplicationFiled: May 26, 2022Publication date: December 1, 2022Applicant: APPLE INC.Inventors: Edward Siahaan, Daniel R. Bloom, Jason J. LeBlanc, Phillip Qian
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Publication number: 20220369015Abstract: This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that include earpad assemblies that improve acoustic isolation are discussed. User convenience features that include automatically detecting the orientation of the headphones on a user's head are also discussed. Various power-saving features, design features, sensor configurations and user comfort features are also discussed.Type: ApplicationFiled: August 1, 2022Publication date: November 17, 2022Applicant: APPLE INC.Inventors: Edward Siahaan, Daniel R. Bloom, Lee M. Panecki, Phillip Qian, Benjamin A. Shaffer, Christopher J. Stringer, Eugene A. Whang, David H. Narajowski, Scott Y. Oshita, Dustin A. Hatfield, Zachary G. Segraves, Sean J. Docherty
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Patent number: 11503399Abstract: A wireless earphone comprising a housing that defines an interior cavity having an inner surface and an outer surface; an opening extending through the housing from the inner surface to the outer surface; and a mesh assembly disposed over the opening and comprising a permanent assembly coupled to the housing and a replaceable assembly removably coupled to the permanent assembly and comprising a mesh.Type: GrantFiled: April 27, 2021Date of Patent: November 15, 2022Assignee: APPLE INC.Inventors: Mei Zhang, Benjamin A. Cousins, Mohammad Soroush Ghahri Sarabi, Phillip Qian, Sean T. McIntosh, Michael B. Minerbi, Lee M. Panecki
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Patent number: 11477558Abstract: This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that include earpad assemblies that improve acoustic isolation are discussed. User convenience features that include automatically detecting the orientation of the headphones on a user's head are also discussed. Various power-saving features, design features, sensor configurations and user comfort features are also discussed.Type: GrantFiled: October 1, 2020Date of Patent: October 18, 2022Assignee: Apple Inc.Inventors: Edward Siahaan, Daniel R. Bloom, Lee M. Panecki, Phillip Qian, Benjamin A. Shaffer, Christopher J. Stringer, Eugene A. Whang, David H. Narajowski, Scott Y. Oshita, Dustin A. Hatfield, Zachary G. Segraves, Sean J. Docherty
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Publication number: 20220103930Abstract: A wireless earphone comprising a housing that defines an interior cavity having an inner surface and an outer surface; an opening extending through the housing from the inner surface to the outer surface; and a mesh assembly disposed over the opening and comprising a permanent assembly coupled to the housing and a replaceable assembly removably coupled to the permanent assembly and comprising a mesh.Type: ApplicationFiled: April 27, 2021Publication date: March 31, 2022Inventors: Mei Zhang, Benjamin A. Cousins, Mohammad Soroush Ghahri Sarabi, Phillip Qian, Sean T. McIntosh, Michael B. Minerbi, Lee M. Panecki
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Patent number: 11134328Abstract: This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that include earpad assemblies that improve acoustic isolation are discussed. User convenience features that include automatically detecting the orientation of the headphones on a user's head are also discussed. Various power-saving features, design features, sensor configurations and user comfort features are also discussed.Type: GrantFiled: May 19, 2020Date of Patent: September 28, 2021Assignee: Apple Inc.Inventors: Jared M. Kole, Daniel R. Bloom, Audrey L. Sheng, Tian Shi Li, Eugene Antony Whang, Edward Siahaan, Phillip Qian, Alex C. Hellwig, Oliver M. Hewitt, Yuta Kuboyama, Christopher S. Erickson, Sneha Kadetotad, Edwin J. Corona Aparicio, Rajesh Anantharaman, Jacob E. Mattingley, Tsu-Hui Lin, Robert D. Zupke, Dustin A. Hatfield, Axit H. Patel
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Patent number: 11134327Abstract: This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that include earpad assemblies that improve acoustic isolation are discussed. User convenience features that include automatically detecting the orientation of the headphones on a user's head are also discussed. Various power-saving features, design features, sensor configurations and user comfort features are also discussed.Type: GrantFiled: May 19, 2020Date of Patent: September 28, 2021Assignee: Apple Inc.Inventors: Jason J. LeBlanc, Daniel R. Bloom, Edward Siahaan, Phillip Qian, Lee M. Panecki, Eugene Antony Whang, Jared M. Kole, Audrey L. Sheng, Tian Shi Li
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Publication number: 20210258678Abstract: Headphone eartips with internal support components and methods for making the same are provided. Different support components may provide specific amounts and types of additional rigidity at specific portions of an exterior surface of an outer eartip body that may be expected to interface with specific portions of an ear canal geometry when an eartip subassembly is positioned within the ear canal, such that the eartip subassembly may conform to the various shapes of the ear canal while maintaining an acoustic seal.Type: ApplicationFiled: March 15, 2021Publication date: August 19, 2021Inventors: Ethan L. Huwe, Brad G. Boozer, Erik L. Wang, Phillip Qian
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Patent number: 10979795Abstract: Headphone eartips with internal support components and methods for making the same are provided. Different support components may provide specific amounts and types of additional rigidity at specific portions of an exterior surface of an outer eartip body that may be expected to interface with specific portions of an ear canal geometry when an eartip subassembly is positioned within the ear canal, such that the eartip subassembly may conform to the various shapes of the ear canal while maintaining an acoustic seal.Type: GrantFiled: August 3, 2020Date of Patent: April 13, 2021Assignee: Apple Inc.Inventors: Ethan L. Huwe, Brad G. Boozer, Erik L. Wang, Phillip Qian
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Publication number: 20210105553Abstract: This application relates to earbuds configured with one or more biometric sensors. At least one of the biometric sensors is configured to be pressed up against a portion of the tragus for making biometric measurements. In some embodiments, the housing of the earbud can be symmetric so that the earbud can be worn interchangeably in either a left or a right ear of a user. In such an embodiment, the earbud can include a sensor and circuitry configured to determine and alter operation of the earbud in accordance to which ear the earbud is determined to be sitting in.Type: ApplicationFiled: November 25, 2020Publication date: April 8, 2021Applicant: Apple Inc.Inventors: Phillip Qian, Edward Siahaan, Erik L. Wang, Christopher J. Stringer, Matthew Dean Rohrbach, Daniel Max Strongwater, Jason J. LeBlanc
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Publication number: 20210029435Abstract: This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that include earpad assemblies that improve acoustic isolation are discussed. User convenience features that include automatically detecting the orientation of the headphones on a user's head are also discussed. Various power-saving features, design features, sensor configurations and user comfort features are also discussed.Type: ApplicationFiled: October 1, 2020Publication date: January 28, 2021Applicant: Apple Inc.Inventors: Edward Siahaan, Daniel R. Bloom, Lee M. Panecki, Phillip Qian, Benjamin A. Shaffer, Christopher J. Stringer, Eugene A. Whang, David H. Narajowski, Scott Y. Oshita, Dustin A. Hatfield, Zachary G. Segraves, Sean J. Docherty
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Patent number: 10856068Abstract: This application relates to earbuds configured with one or more biometric sensors. At least one of the biometric sensors is configured to be pressed up against a portion of the tragus for making biometric measurements. In some embodiments, the housing of the earbud can be symmetric so that the earbud can be worn interchangeably in either a left or a right ear of a user. In such an embodiment, the earbud can include a sensor and circuitry configured to determine and alter operation of the earbud in accordance to which ear the earbud is determined to be sitting in.Type: GrantFiled: June 18, 2019Date of Patent: December 1, 2020Assignee: Apple Inc.Inventors: Phillip Qian, Edward Siahaan, Erik L. Wang, Christopher J. Stringer, Matthew Dean Rohrbach, Daniel Max Strongwater, Jason J. LeBlanc
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Publication number: 20200366981Abstract: Headphone eartips with internal support components and methods for making the same are provided. Different support components may provide specific amounts and types of additional rigidity at specific portions of an exterior surface of an outer eartip body that may be expected to interface with specific portions of an ear canal geometry when an eartip subassembly is positioned within the ear canal, such that the eartip subassembly may conform to the various shapes of the ear canal while maintaining an acoustic seal.Type: ApplicationFiled: August 3, 2020Publication date: November 19, 2020Inventors: Ethan L. Huwe, Brad G. Boozer, Erik L. Wang, Phillip Qian