Patents by Inventor Phillip QIAN

Phillip QIAN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230353931
    Abstract: This application relates to earbuds configured with one or more biometric sensors. At least one of the biometric sensors is configured to be pressed up against a portion of the tragus for making biometric measurements. In some embodiments, the housing of the earbud can be symmetric so that the earbud can be worn interchangeably in either a left or a right ear of a user. In such an embodiment, the earbud can include a sensor and circuitry configured to determine and alter operation of the earbud in accordance to which ear the earbud is determined to be sitting in.
    Type: Application
    Filed: April 28, 2023
    Publication date: November 2, 2023
    Applicant: APPLE INC.
    Inventors: Phillip Qian, Edward Siahaan, Erik L. Wang, Christopher J. Stringer, Matthew Dean Rohrbach, Daniel Max Strongwater, Jason J. LeBlanc
  • Publication number: 20230328418
    Abstract: This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that include earpad assemblies that improve acoustic isolation are discussed. User convenience features that include automatically detecting the orientation of the headphones on a user's head are also discussed. Various power-saving features, design features, sensor configurations and user comfort features are also discussed.
    Type: Application
    Filed: May 15, 2023
    Publication date: October 12, 2023
    Applicant: APPLE INC.
    Inventors: Edward Siahaan, Daniel R. Bloom, Jason J. LeBlanc, Phillip Qian
  • Publication number: 20230269513
    Abstract: A charging case for a pair of wireless earphones comprising: a housing having a peripheral wall that defines a shell; a frame insert coupled to the housing and extending into the shell, the frame insert having one or more insert walls that define first and second pockets sized and shaped to accept first and second wireless earphones, respectively, wherein the one or more insert walls cooperate with the housing primary wall to define a sealed chamber within the charging case; a lid coupled to the housing and operable between a closed position in which the lid covers the first and second pockets and an open position in which the first and second pockets are exposed; a speaker module disposed within the sealed chamber, the speaker module comprising an audio driver having a diaphragm that separates a front volume of the audio driver from a back volume of the audio driver and a speaker vent disposed within the back volume; one or more first openings formed through the peripheral wall and opening into the front vol
    Type: Application
    Filed: August 24, 2022
    Publication date: August 24, 2023
    Applicant: APPLE INC.
    Inventors: Benjamin A. Cousins, Jarrett Lagler, Dirk Schmelzer, Sebastien D. de Rivaz, Tian Shi Li, Phillip Qian, Rebecca Russell, Jeyakkrishnan Chengleput Srinivasan, Jue Wang, Jerzy S. Guterman, Joel C. Yamasaki
  • Publication number: 20230239605
    Abstract: Headphone eartips with internal support components and methods for making the same are provided. Different support components may provide specific amounts and types of additional rigidity at specific portions of an exterior surface of an outer eartip body that may be expected to interface with specific portions of an ear canal geometry when an eartip subassembly is positioned within the ear canal, such that the eartip subassembly may conform to the various shapes of the ear canal while maintaining an acoustic seal.
    Type: Application
    Filed: March 28, 2023
    Publication date: July 27, 2023
    Applicant: APPLE INC.
    Inventors: Ethan L. Huwe, Brad G. Boozer, Erik L. Wang, Phillip Qian
  • Patent number: 11700471
    Abstract: This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that include earpad assemblies that improve acoustic isolation are discussed. User convenience features that include automatically detecting the orientation of the headphones on a user's head are also discussed. Various power-saving features, design features, sensor configurations and user comfort features are also discussed.
    Type: Grant
    Filed: May 26, 2022
    Date of Patent: July 11, 2023
    Assignee: APPLE INC.
    Inventors: Edward Siahaan, Daniel R. Bloom, Jason J. LeBlanc, Phillip Qian
  • Patent number: 11678106
    Abstract: This application relates to earbuds configured with one or more biometric sensors. At least one of the biometric sensors is configured to be pressed up against a portion of the tragus for making biometric measurements. In some embodiments, the housing of the earbud can be symmetric so that the earbud can be worn interchangeably in either a left or a right ear of a user. In such an embodiment, the earbud can include a sensor and circuitry configured to determine and alter operation of the earbud in accordance to which ear the earbud is determined to be sitting in.
    Type: Grant
    Filed: November 25, 2020
    Date of Patent: June 13, 2023
    Assignee: Apple Inc.
    Inventors: Phillip Qian, Edward Siahaan, Erik L. Wang, Christopher J. Stringer, Matthew Dean Rohrbach, Daniel Max Strongwater, Jason J. LeBlanc
  • Patent number: 11647319
    Abstract: Headphone eartips with internal support components and methods for making the same are provided. Different support components may provide specific amounts and types of additional rigidity at specific portions of an exterior surface of an outer eartip body that may be expected to interface with specific portions of an ear canal geometry when an eartip subassembly is positioned within the ear canal, such that the eartip subassembly may conform to the various shapes of the ear canal while maintaining an acoustic seal.
    Type: Grant
    Filed: March 15, 2021
    Date of Patent: May 9, 2023
    Assignee: APPLE INC.
    Inventors: Ethan L. Huwe, Brad G. Boozer, Erik L. Wang, Phillip Qian
  • Publication number: 20220386009
    Abstract: This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that include earpad assemblies that improve acoustic isolation are discussed. User convenience features that include automatically detecting the orientation of the headphones on a user's head are also discussed. Various power-saving features, design features, sensor configurations and user comfort features are also discussed.
    Type: Application
    Filed: May 26, 2022
    Publication date: December 1, 2022
    Applicant: APPLE INC.
    Inventors: Edward Siahaan, Daniel R. Bloom, Jason J. LeBlanc, Phillip Qian
  • Publication number: 20220369015
    Abstract: This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that include earpad assemblies that improve acoustic isolation are discussed. User convenience features that include automatically detecting the orientation of the headphones on a user's head are also discussed. Various power-saving features, design features, sensor configurations and user comfort features are also discussed.
    Type: Application
    Filed: August 1, 2022
    Publication date: November 17, 2022
    Applicant: APPLE INC.
    Inventors: Edward Siahaan, Daniel R. Bloom, Lee M. Panecki, Phillip Qian, Benjamin A. Shaffer, Christopher J. Stringer, Eugene A. Whang, David H. Narajowski, Scott Y. Oshita, Dustin A. Hatfield, Zachary G. Segraves, Sean J. Docherty
  • Patent number: 11503399
    Abstract: A wireless earphone comprising a housing that defines an interior cavity having an inner surface and an outer surface; an opening extending through the housing from the inner surface to the outer surface; and a mesh assembly disposed over the opening and comprising a permanent assembly coupled to the housing and a replaceable assembly removably coupled to the permanent assembly and comprising a mesh.
    Type: Grant
    Filed: April 27, 2021
    Date of Patent: November 15, 2022
    Assignee: APPLE INC.
    Inventors: Mei Zhang, Benjamin A. Cousins, Mohammad Soroush Ghahri Sarabi, Phillip Qian, Sean T. McIntosh, Michael B. Minerbi, Lee M. Panecki
  • Patent number: 11477558
    Abstract: This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that include earpad assemblies that improve acoustic isolation are discussed. User convenience features that include automatically detecting the orientation of the headphones on a user's head are also discussed. Various power-saving features, design features, sensor configurations and user comfort features are also discussed.
    Type: Grant
    Filed: October 1, 2020
    Date of Patent: October 18, 2022
    Assignee: Apple Inc.
    Inventors: Edward Siahaan, Daniel R. Bloom, Lee M. Panecki, Phillip Qian, Benjamin A. Shaffer, Christopher J. Stringer, Eugene A. Whang, David H. Narajowski, Scott Y. Oshita, Dustin A. Hatfield, Zachary G. Segraves, Sean J. Docherty
  • Publication number: 20220103930
    Abstract: A wireless earphone comprising a housing that defines an interior cavity having an inner surface and an outer surface; an opening extending through the housing from the inner surface to the outer surface; and a mesh assembly disposed over the opening and comprising a permanent assembly coupled to the housing and a replaceable assembly removably coupled to the permanent assembly and comprising a mesh.
    Type: Application
    Filed: April 27, 2021
    Publication date: March 31, 2022
    Inventors: Mei Zhang, Benjamin A. Cousins, Mohammad Soroush Ghahri Sarabi, Phillip Qian, Sean T. McIntosh, Michael B. Minerbi, Lee M. Panecki
  • Patent number: 11134328
    Abstract: This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that include earpad assemblies that improve acoustic isolation are discussed. User convenience features that include automatically detecting the orientation of the headphones on a user's head are also discussed. Various power-saving features, design features, sensor configurations and user comfort features are also discussed.
    Type: Grant
    Filed: May 19, 2020
    Date of Patent: September 28, 2021
    Assignee: Apple Inc.
    Inventors: Jared M. Kole, Daniel R. Bloom, Audrey L. Sheng, Tian Shi Li, Eugene Antony Whang, Edward Siahaan, Phillip Qian, Alex C. Hellwig, Oliver M. Hewitt, Yuta Kuboyama, Christopher S. Erickson, Sneha Kadetotad, Edwin J. Corona Aparicio, Rajesh Anantharaman, Jacob E. Mattingley, Tsu-Hui Lin, Robert D. Zupke, Dustin A. Hatfield, Axit H. Patel
  • Patent number: 11134327
    Abstract: This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that include earpad assemblies that improve acoustic isolation are discussed. User convenience features that include automatically detecting the orientation of the headphones on a user's head are also discussed. Various power-saving features, design features, sensor configurations and user comfort features are also discussed.
    Type: Grant
    Filed: May 19, 2020
    Date of Patent: September 28, 2021
    Assignee: Apple Inc.
    Inventors: Jason J. LeBlanc, Daniel R. Bloom, Edward Siahaan, Phillip Qian, Lee M. Panecki, Eugene Antony Whang, Jared M. Kole, Audrey L. Sheng, Tian Shi Li
  • Publication number: 20210258678
    Abstract: Headphone eartips with internal support components and methods for making the same are provided. Different support components may provide specific amounts and types of additional rigidity at specific portions of an exterior surface of an outer eartip body that may be expected to interface with specific portions of an ear canal geometry when an eartip subassembly is positioned within the ear canal, such that the eartip subassembly may conform to the various shapes of the ear canal while maintaining an acoustic seal.
    Type: Application
    Filed: March 15, 2021
    Publication date: August 19, 2021
    Inventors: Ethan L. Huwe, Brad G. Boozer, Erik L. Wang, Phillip Qian
  • Patent number: 10979795
    Abstract: Headphone eartips with internal support components and methods for making the same are provided. Different support components may provide specific amounts and types of additional rigidity at specific portions of an exterior surface of an outer eartip body that may be expected to interface with specific portions of an ear canal geometry when an eartip subassembly is positioned within the ear canal, such that the eartip subassembly may conform to the various shapes of the ear canal while maintaining an acoustic seal.
    Type: Grant
    Filed: August 3, 2020
    Date of Patent: April 13, 2021
    Assignee: Apple Inc.
    Inventors: Ethan L. Huwe, Brad G. Boozer, Erik L. Wang, Phillip Qian
  • Publication number: 20210105553
    Abstract: This application relates to earbuds configured with one or more biometric sensors. At least one of the biometric sensors is configured to be pressed up against a portion of the tragus for making biometric measurements. In some embodiments, the housing of the earbud can be symmetric so that the earbud can be worn interchangeably in either a left or a right ear of a user. In such an embodiment, the earbud can include a sensor and circuitry configured to determine and alter operation of the earbud in accordance to which ear the earbud is determined to be sitting in.
    Type: Application
    Filed: November 25, 2020
    Publication date: April 8, 2021
    Applicant: Apple Inc.
    Inventors: Phillip Qian, Edward Siahaan, Erik L. Wang, Christopher J. Stringer, Matthew Dean Rohrbach, Daniel Max Strongwater, Jason J. LeBlanc
  • Publication number: 20210029435
    Abstract: This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that include earpad assemblies that improve acoustic isolation are discussed. User convenience features that include automatically detecting the orientation of the headphones on a user's head are also discussed. Various power-saving features, design features, sensor configurations and user comfort features are also discussed.
    Type: Application
    Filed: October 1, 2020
    Publication date: January 28, 2021
    Applicant: Apple Inc.
    Inventors: Edward Siahaan, Daniel R. Bloom, Lee M. Panecki, Phillip Qian, Benjamin A. Shaffer, Christopher J. Stringer, Eugene A. Whang, David H. Narajowski, Scott Y. Oshita, Dustin A. Hatfield, Zachary G. Segraves, Sean J. Docherty
  • Patent number: 10856068
    Abstract: This application relates to earbuds configured with one or more biometric sensors. At least one of the biometric sensors is configured to be pressed up against a portion of the tragus for making biometric measurements. In some embodiments, the housing of the earbud can be symmetric so that the earbud can be worn interchangeably in either a left or a right ear of a user. In such an embodiment, the earbud can include a sensor and circuitry configured to determine and alter operation of the earbud in accordance to which ear the earbud is determined to be sitting in.
    Type: Grant
    Filed: June 18, 2019
    Date of Patent: December 1, 2020
    Assignee: Apple Inc.
    Inventors: Phillip Qian, Edward Siahaan, Erik L. Wang, Christopher J. Stringer, Matthew Dean Rohrbach, Daniel Max Strongwater, Jason J. LeBlanc
  • Publication number: 20200366981
    Abstract: Headphone eartips with internal support components and methods for making the same are provided. Different support components may provide specific amounts and types of additional rigidity at specific portions of an exterior surface of an outer eartip body that may be expected to interface with specific portions of an ear canal geometry when an eartip subassembly is positioned within the ear canal, such that the eartip subassembly may conform to the various shapes of the ear canal while maintaining an acoustic seal.
    Type: Application
    Filed: August 3, 2020
    Publication date: November 19, 2020
    Inventors: Ethan L. Huwe, Brad G. Boozer, Erik L. Wang, Phillip Qian