Patents by Inventor Phillip R. Troetschel

Phillip R. Troetschel has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Warp-resistant ultra-thin integrated circuit package
    Patent number: 5581121
    Abstract: The present invention provides a method for fabricating modified integrated circuit packages that are ultra-thin and resist warping. The integrated circuit packages are made thinner by removing some of the casing material uniformly from the upper and lower major surfaces of the integrated circuit package. To prevent the resulting ultra-thin integrated circuit package from warping, a thin layer of material with a coefficient of thermal expansion less than that of silicon is mounted to the upper major surface of the package after some of the casing material has been removed uniformly from the upper major surface. Also, a thin layer of material with a coefficient of thermal expansion greater than that of silicon may be mounted to the lower major surface of the package after some of the casing material has been removed uniformly from the lower major surface. The result is an ultra-thin integrated circuit package that is thermally and mechanically balanced to prevent warping.
    Type: Grant
    Filed: July 27, 1994
    Date of Patent: December 3, 1996
    Assignee: Staktek Corporation
    Inventors: Carmen D. Burns, James W. Cady, Jerry M. Roane, Phillip R. Troetschel
  • Warp-resistent ultra-thin integrated circuit package fabrication method
    Patent number: 5369056
    Abstract: The present invention provides a method for fabricating modified integrated circuit packages that are ultra-thin and resist warping. The integrated circuit packages are made thinner by removing some of the casing material uniformly from the upper and lower major surfaces of the integrated circuit package. To prevent the resulting ultra-thin integrated circuit package from warping, a thin layer of material with a coefficient of thermal expansion less than that of silicon is mounted to the upper major surface of the package after some of the casing material has been removed uniformly from the upper major surface. Also, a thin layer of material with a coefficient of thermal expansion greater than that of silicon may be mounted to the lower major surface of the package after some of the casing material has been removed uniformly from the lower major surface. The result is an ultra-thin integrated circuit package that is thermally and mechanically balanced to prevent warping.
    Type: Grant
    Filed: March 29, 1993
    Date of Patent: November 29, 1994
    Assignee: Staktek Corporation
    Inventors: Carmen D. Burns, James W. Cady, Jerry M. Roane, Phillip R. Troetschel