Patents by Inventor Phillip S. Eggerling

Phillip S. Eggerling has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • High flow high efficiency EGR cooler
    Patent number: 12687142
    Abstract: The subject matter of this specification can be embodied in, among other things, a heat exchanger apparatus that includes a first fluid conduit defining a first fluid flow path for a first fluid and comprising a fluid diode that is at least partly fluidically diodic and formed of a thermally conductive material, the fluid diode having a first fluid inlet, a first fluid outlet, a first sub-conduit extending from the fluid inlet to the fluid outlet, and a second sub-conduit extending from the first sub-conduit proximal the fluid inlet to the first sub-conduit proximal the fluid outlet as a partial loop defining a cavity extending through the partial loop, and a second fluid conduit in thermal communication with the first fluid conduit and defining a second fluid flow path through the partial loop, fluidically isolated from the first fluid flow path, for a second fluid.
    Type: Grant
    Filed: July 24, 2023
    Date of Patent: July 21, 2026
    Assignee: Woodward, Inc.
    Inventors: Yi Han, Jessica K. DeBlois, Phillip S. Eggerling, Dave O. Richards, Adithya Baburaj
  • High Flow High Efficiency EGR Cooler
    Publication number: 20250035074
    Abstract: The subject matter of this specification can be embodied in, among other things, a heat exchanger apparatus that includes a first fluid conduit defining a first fluid flow path for a first fluid and comprising a fluid diode that is at least partly fluidically diodic and formed of a thermally conductive material, the fluid diode having a first fluid inlet, a first fluid outlet, a first sub-conduit extending from the fluid inlet to the fluid outlet, and a second sub-conduit extending from the first sub-conduit proximal the fluid inlet to the first sub-conduit proximal the fluid outlet as a partial loop defining a cavity extending through the partial loop, and a second fluid conduit in thermal communication with the first fluid conduit and defining a second fluid flow path through the partial loop, fluidically isolated from the first fluid flow path, for a second fluid.
    Type: Application
    Filed: July 24, 2023
    Publication date: January 30, 2025
    Inventors: Yi Han, Jessica K. DeBlois, Phillip S. Eggerling, Dave O. Richards, Adithya Baburaj