Patents by Inventor Phillip T. Robinson

Phillip T. Robinson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11957893
    Abstract: A neuromodulation therapy is delivered via at least one electrode implanted subcutaneously and superficially to a fascia layer superficial to a nerve of a patient. In one example, an implantable medical device is deployed along a superficial surface of a deep fascia tissue layer superficial to a nerve of a patient. Electrical stimulation energy is delivered to the nerve through the deep fascia tissue layer via implantable medical device electrodes.
    Type: Grant
    Filed: August 25, 2020
    Date of Patent: April 16, 2024
    Assignee: Medtronic, Inc.
    Inventors: Brad C. Tischendorf, John E. Kast, Thomas P. Miltich, Gordon O. Munns, Randy S. Roles, Craig L. Schmidt, Joseph J. Viavattine, Christian S. Nielsen, Prabhakar A. Tamirisa, Anthony M. Chasensky, Markus W. Reiterer, Chris J. Paidosh, Reginald D. Robinson, Bernard Q. Li, Erik R. Scott, Phillip C. Falkner, Xuan K. Wei, Eric H. Bonde, David A. Dinsmoor, Duane L. Bourget, Forrest C M Pape, Gabriela C. Molnar, Joel A. Anderson, Michael J. Ebert, Richard T. Stone, Shawn C. Kelley, Stephen J. Roddy, Timothy J. Denison, Todd V. Smith
  • Patent number: 11957894
    Abstract: A neuromodulation therapy is delivered via at least one electrode implanted subcutaneously and superficially to a fascia layer superficial to a nerve of a patient. In one example, an implantable medical device is deployed along a superficial surface of a deep fascia tissue layer superficial to a nerve of a patient. Electrical stimulation energy is delivered to the nerve through the deep fascia tissue layer via implantable medical device electrodes.
    Type: Grant
    Filed: August 25, 2020
    Date of Patent: April 16, 2024
    Assignee: Medtronic, Inc.
    Inventors: Anthony M. Chasensky, Bernard Q. Li, Brad C. Tischendorf, Chris J. Paidosh, Christian S. Nielsen, Craig L. Schmidt, David A. Dinsmoor, Duane L. Bourget, Eric H. Bonde, Erik R. Scott, Forrest C M Pape, Gabriela C. Molnar, Gordon O. Munns, Joel A. Anderson, John E. Kast, Joseph J. Viavattine, Markus W. Reiterer, Michael J. Ebert, Phillip C. Falkner, Prabhakar A. Tamirisa, Randy S. Roles, Reginald D. Robinson, Richard T. Stone, Shawn C. Kelley, Stephen J. Roddy, Thomas P. Miltich, Timothy J. Denison, Todd V. Smith, Xuan K. Wei
  • Patent number: 6553568
    Abstract: Methods and system for service level agreement enforcement on a data-over-cable system. One or more service level agreements are created including one or more class-of-service or quality-of-service parameters. A pool of Internet Protocol addresses is allocated for the one or more service level agreements. Configuration files including service level agreement parameters are used to initialize cable modems or customer premise equipment. When a cable modem or customer premise equipment requests use of a service level agreement, an Internet Protocol address from the pool of Internet Addresses associated with a desired service level agreement is assigned. The service level agreements are enforced using the Internet Protocol address from a cable modem termination system including an integral switch cable access router and a bandwidth manager.
    Type: Grant
    Filed: September 29, 1999
    Date of Patent: April 22, 2003
    Assignee: 3Com Corporation
    Inventors: John G. Fijolek, Phillip T. Robinson, Irene M. Gilbert, Daniel M. Budinger, Narij Jain