Patents by Inventor Phillip Tamchina

Phillip Tamchina has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9762997
    Abstract: A mobile communication device having an acoustic divider for minimizing acoustic coupling is disclosed. The mobile communication device includes a housing having an outer surface and internal sidewalls. The outer surface and internal sidewalls define a void disposed at and below the outer surface of the housing. The mobile communication device includes a receiver disposed within the housing and below a first portion of the void, and a microphone disposed within the housing and below a second portion of the void. An acoustic divider is disposed within the void and laterally disposed between the receiver and the microphone. The acoustic divider acoustically isolates the first and second portions of the void, thereby minimizing acoustic coupling between the receiver and the microphone.
    Type: Grant
    Filed: December 18, 2015
    Date of Patent: September 12, 2017
    Assignee: Apple Inc.
    Inventors: Melissa A. Wah, Stoyan P. Hristov, Phillip Tamchina
  • Publication number: 20170070813
    Abstract: A mobile communication device having an acoustic divider for minimizing acoustic coupling is disclosed. The mobile communication device includes a housing having an outer surface and internal sidewalls. The outer surface and internal sidewalls define a void disposed at and below the outer surface of the housing. The mobile communication device includes a receiver disposed within the housing and below a first portion of the void, and a microphone disposed within the housing and below a second portion of the void. An acoustic divider is disposed within the void and laterally disposed between the receiver and the microphone. The acoustic divider acoustically isolates the first and second portions of the void, thereby minimizing acoustic coupling between the receiver and the microphone.
    Type: Application
    Filed: December 18, 2015
    Publication date: March 9, 2017
    Applicant: Apple Inc.
    Inventors: Melissa A. Wah, Stoyan P. Hristov, Phillip Tamchina