Abstract: A structural drive assembly is provided. The structural drive assemble includes a storage device and a carrier. The storage device has a first mounting feature on one side of the storage device and a second mounting feature on another side of the storage device. The carrier includes a top portion and a bottom portion. The top portion attaches to one side of the storage device using the first mounting feature. The bottom portion attaches to the other side of the storage device using the second mounting feature.

Abstract: A heat pipe system, method, and heat sink system to enhance heat transfer from a heat-generating component. The method includes generating heat with the heat-generating component. The method also includes transferring at least a portion of the heat to at least a portion of a volatile fluid within one or more heat pipes. The method further includes modifying, dynamically, an active heat transfer region of the one or more heat pipes, thereby dynamically modulating heat transfer from the heat-generating component through the one or more heat pipes.

Abstract: A connection system comprises a printed circuit board. The printed circuit board comprises a top face and a bottom face. The printed circuit board also comprises a first edge that is normal to the top face and bottom face. The printed circuit board also comprises a second edge that is normal to the top face and bottom face. The first edge face and second edge face intersect at an angle that is not a straight angle. The connection system also comprises a coplanar card-edge socket on the printed circuit board. The socket comprises a top section that interfaces with the top face of the printed circuit board along the first and second edge faces of the printed circuit board. The socked also comprises a bottom section that interfaces with the bottom face of the printed circuit board along the first and second edge faces of the printed circuit board.

Abstract: Embodiments of the disclosure provide cooling systems and cooling methods for isolating temperature fluctuation in an electronics enclosure. Embodiments of the disclosure provide effective cooling of high power temperature fluctuating components and a stable reference temperature for temperature sensitive components included in a single electronics enclosure. A disclosed multiple path cooling system includes a first path for cooling power variable components and a second path to maintain stable temperature cooling for temperature sensitive components.

Abstract: An air moving device (AMD) includes a housing that dampens noise and routes airflow. The AMD housing includes a focal-bearing surface that has an associated focal point. The focal-bearing surface routes airflow through the AMD housing and reflects and concentrates noise to the focal point. The AMD housing further includes a noise dampening structure at the focal point to reduce, absorb, and/or dampen the concentrated noise. Because the noise is concentrated, a relatively smaller size noise dampening structure may effectively or adequately reduce or dampen AMD noise. The smaller size noise dampening structure relatively reduces airflow impedance. As such, AMD housing may provide for both reduced AMD noise and relatively reduced airflow impedance therein and/or therefrom.

Abstract: A heat pipe system, method, and heat sink system to enhance heat transfer from a heat-generating component. The method includes generating heat with the heat-generating component. The method also includes transferring at least a portion of the heat to at least a portion of a volatile fluid within one or more heat pipes. The method further includes modifying, dynamically, an active heat transfer region of the one or more heat pipes, thereby dynamically modulating heat transfer from the heat-generating component through the one or more heat pipes.

Abstract: Systems for optimizing mounting points for coaxial RF connectors, including a printed circuit board (PCB) comprising a coaxial radio frequency (RF) connector; a faceplate comprising an opening adapted to receive the coaxial RF connector; and a bushing positioned within the opening, wherein the coaxial RF connector is positioned within the bushing.

Abstract: Embodiments of the disclosure provide cooling systems and cooling methods for isolating temperature fluctuation in an electronics enclosure. Embodiments of the disclosure provide effective cooling of high power temperature fluctuating components and a stable reference temperature for temperature sensitive components included in a single electronics enclosure. A disclosed multiple path cooling system includes a first path for cooling power variable components and a second path to maintain stable temperature cooling for temperature sensitive components.

Abstract: An electronic component system includes a chassis that includes a body, an electrically isolated portion, and an insulator disposed between the electrically isolated portion and the body, wherein the insulator is comprised of a first electrically insulating material. The electronic component system further includes a first electronic component mounted to the electrically isolated portion, and a second electronic component mounted to the body and electrically connected to the first electronic component.

Abstract: A connection system comprises a printed circuit board. The printed circuit board comprises a top face and a bottom face. The printed circuit board also comprises a first edge that is normal to the top face and bottom face. The printed circuit board also comprises a second edge that is normal to the top face and bottom face. The first edge face and second edge face intersect at an angle that is not a straight angle. The connection system also comprises a coplanar card-edge socket on the printed circuit board. The socket comprises a top section that interfaces with the top face of the printed circuit board along the first and second edge faces of the printed circuit board. The socked also comprises a bottom section that interfaces with the bottom face of the printed circuit board along the first and second edge faces of the printed circuit board.

Abstract: An electronic component assembly includes a board having an electronic component, a connector mounted to the board and electrically connected to the electronic component and having an anchoring feature positioned on an exterior of the connector, and a card having another electronic component and a securing feature. The electronic component assembly also includes a movable member positioned on one of the connector or the card. The movable member is positioned in the securing feature and contacts the anchoring feature to secure the card in a seated position in the connector, or the anchoring feature includes the movable member and contacts the securing feature to secure the card in the seated position in the connector.

Abstract: An air moving device (AMD) includes a housing that dampens noise and routes airflow. The AMD housing includes a focal-bearing surface that has an associated focal point. The focal-bearing surface routes airflow through the AMD housing and reflects and concentrates noise to the focal point. The AMD housing further includes a noise dampening structure at the focal point to reduce, absorb, and/or dampen the concentrated noise. Because the noise is concentrated, a relatively smaller size noise dampening structure may effectively or adequately reduce or dampen AMD noise. The smaller size noise dampening structure relatively reduces airflow impedance. As such, AMD housing may provide for both reduced AMD noise and relatively reduced airflow impedance therein and/or therefrom.

Abstract: An electronic board assembly comprises a board comprising an electronic component and a connector mounted to the board and electrically connected to the electronic component. The connector is configured to receive an electronic card assembly, and the connector comprises an electrical contact and a friction contact. The electrical contact is configured to exert a first amount of force on the electronic card assembly when the electronic card assembly is being seated in the connector. The friction contact is configured to exert a second amount of force on the electronic card assembly when the electronic card assembly is being seated in the connector. The second amount of force is greater than the first amount of force.

Abstract: Systems for optimizing mounting points for coaxial RF connectors, including a printed circuit board (PCB) comprising a coaxial radio frequency (RF) connector; a faceplate comprising an opening adapted to receive the coaxial RF connector; and a bushing positioned within the opening, wherein the coaxial RF connector is positioned within the bushing.

Abstract: A system, an article of manufacture, and a method are disclosed. The system includes a set of components in an enclosure. The set of components includes electronic devices and airflow moving components configured to maintain airflow across the electronic devices from a front plenum of the enclosure to a rear plenum of the enclosure and direct air from the rear plenum through the first heat exchanger. The set of components also includes a first heat exchanger configured to circulate a cooling liquid and a second heat exchanger configured to maintain a constant temperature of the cooling liquid, wherein the constant temperature is a temperature of the cooling liquid within a threshold distance from a selected temperature.

Abstract: To provide for high-performance communicational throughput between electronic systems, a high-performance connector pair is disclosed. The connector pair includes a pin receptacle and card edge (PRCE) connector that may be seated or connected to a pin and card edge receptacle (PCER) connector. The PRCE connector includes an edge connector, with a plurality of edge connector pads and a pin receptacle connector with a mount region connected to the printed circuit board and a receptacle portion with a plurality of conductive pin receptacles. The PRCE connector further includes a clearance between the edge connector and the receptacle portion. The PCER connector includes a pin and card edge receptacle connector with an edge socket that receives the edge connector and includes a plurality of socket pads. The PCER connector includes further includes a pin socket that receives the receptacle portion with a plurality of pins.

Abstract: A thermal interface material (TIM) structure for directing heat in a three-dimensional space including a TIM sheet. The TIM sheet includes a lower portion along a lower plane; a first side portion along a first side plane; a first upper portion along an upper plane; a first fold between the lower portion and the first side portion positioning the first side portion substantially perpendicular to the lower portion; and a second fold between the first side portion and the first upper portion positioning the first upper portion substantially perpendicular to the first side portion and substantially parallel to the lower portion.

Abstract: An electronic component system includes a chassis that includes a body, an electrically isolated portion, and an insulator disposed between the electrically isolated portion and the body, wherein the insulator is comprised of a first electrically insulating material. The electronic component system further includes a first electronic component mounted to the electrically isolated portion, and a second electronic component mounted to the body and electrically connected to the first electronic component.

Abstract: A system, an article of manufacture, and a method are disclosed. The system includes a set of components in an enclosure. The set of components includes electronic devices and airflow moving components configured to maintain airflow across the electronic devices from a front plenum of the enclosure to a rear plenum of the enclosure and direct air from the rear plenum through the first heat exchanger. The set of components also includes a first heat exchanger configured to circulate a cooling liquid and a second heat exchanger configured to maintain a constant temperature of the cooling liquid, wherein the constant temperature is a temperature of the cooling liquid within a threshold distance from a selected temperature.

Abstract: A thermal interface material (TIM) structure for directing heat in a three-dimensional space including a TIM sheet. The TIM sheet includes a lower portion along a lower plane; a first side portion along a first side plane; a first upper portion along an upper plane; a first fold between the lower portion and the first side portion positioning the first side portion substantially perpendicular to the lower portion; and a second fold between the first side portion and the first upper portion positioning the first upper portion substantially perpendicular to the first side portion and substantially parallel to the lower portion.