Abstract: An air moving device (AMD) includes a housing that dampens noise and routes airflow. The AMD housing includes a focal-bearing surface that has an associated focal point. The focal-bearing surface routes airflow through the AMD housing and reflects and concentrates noise to the focal point. The AMD housing further includes a noise dampening structure at the focal point to reduce, absorb, and/or dampen the concentrated noise. Because the noise is concentrated, a relatively smaller size noise dampening structure may effectively or adequately reduce or dampen AMD noise. The smaller size noise dampening structure relatively reduces airflow impedance. As such, AMD housing may provide for both reduced AMD noise and relatively reduced airflow impedance therein and/or therefrom.

Abstract: An electronic board assembly comprises a board comprising an electronic component and a connector mounted to the board and electrically connected to the electronic component. The connector is configured to receive an electronic card assembly, and the connector comprises an electrical contact and a friction contact. The electrical contact is configured to exert a first amount of force on the electronic card assembly when the electronic card assembly is being seated in the connector. The friction contact is configured to exert a second amount of force on the electronic card assembly when the electronic card assembly is being seated in the connector. The second amount of force is greater than the first amount of force.

Abstract: Systems for optimizing mounting points for coaxial RF connectors, including a printed circuit board (PCB) comprising a coaxial radio frequency (RF) connector; a faceplate comprising an opening adapted to receive the coaxial RF connector; and a bushing positioned within the opening, wherein the coaxial RF connector is positioned within the bushing.

Abstract: A system, an article of manufacture, and a method are disclosed. The system includes a set of components in an enclosure. The set of components includes electronic devices and airflow moving components configured to maintain airflow across the electronic devices from a front plenum of the enclosure to a rear plenum of the enclosure and direct air from the rear plenum through the first heat exchanger. The set of components also includes a first heat exchanger configured to circulate a cooling liquid and a second heat exchanger configured to maintain a constant temperature of the cooling liquid, wherein the constant temperature is a temperature of the cooling liquid within a threshold distance from a selected temperature.

Abstract: To provide for high-performance communicational throughput between electronic systems, a high-performance connector pair is disclosed. The connector pair includes a pin receptacle and card edge (PRCE) connector that may be seated or connected to a pin and card edge receptacle (PCER) connector. The PRCE connector includes an edge connector, with a plurality of edge connector pads and a pin receptacle connector with a mount region connected to the printed circuit board and a receptacle portion with a plurality of conductive pin receptacles. The PRCE connector further includes a clearance between the edge connector and the receptacle portion. The PCER connector includes a pin and card edge receptacle connector with an edge socket that receives the edge connector and includes a plurality of socket pads. The PCER connector includes further includes a pin socket that receives the receptacle portion with a plurality of pins.

Abstract: A thermal interface material (TIM) structure for directing heat in a three-dimensional space including a TIM sheet. The TIM sheet includes a lower portion along a lower plane; a first side portion along a first side plane; a first upper portion along an upper plane; a first fold between the lower portion and the first side portion positioning the first side portion substantially perpendicular to the lower portion; and a second fold between the first side portion and the first upper portion positioning the first upper portion substantially perpendicular to the first side portion and substantially parallel to the lower portion.

Abstract: An electronic component system includes a chassis that includes a body, an electrically isolated portion, and an insulator disposed between the electrically isolated portion and the body, wherein the insulator is comprised of a first electrically insulating material. The electronic component system further includes a first electronic component mounted to the electrically isolated portion, and a second electronic component mounted to the body and electrically connected to the first electronic component.

Abstract: A system, an article of manufacture, and a method are disclosed. The system includes a set of components in an enclosure. The set of components includes electronic devices and airflow moving components configured to maintain airflow across the electronic devices from a front plenum of the enclosure to a rear plenum of the enclosure and direct air from the rear plenum through the first heat exchanger. The set of components also includes a first heat exchanger configured to circulate a cooling liquid and a second heat exchanger configured to maintain a constant temperature of the cooling liquid, wherein the constant temperature is a temperature of the cooling liquid within a threshold distance from a selected temperature.

Abstract: A thermal interface material (TIM) structure for directing heat in a three-dimensional space including a TIM sheet. The TIM sheet includes a lower portion along a lower plane; a first side portion along a first side plane; a first upper portion along an upper plane; a first fold between the lower portion and the first side portion positioning the first side portion substantially perpendicular to the lower portion; and a second fold between the first side portion and the first upper portion positioning the first upper portion substantially perpendicular to the first side portion and substantially parallel to the lower portion.

Abstract: A thermal interface material (TIM) structure for directing heat in a three-dimensional space including a TIM sheet. The TIM sheet includes a lower portion along a lower plane; a first side portion along a first side plane; a first upper portion along an upper plane; a first fold between the lower portion and the first side portion positioning the first side portion substantially perpendicular to the lower portion; and a second fold between the first side portion and the first upper portion positioning the first upper portion substantially perpendicular to the first side portion and substantially parallel to the lower portion.

Abstract: Vibration shock mitigation for components in a server rack includes a server rack comprising: a first server component chassis and a second server component chassis installed in adjacent locations within the server rack; and a chassis gap filler comprising: an elastic dampening sheet configured for placement between the first server component chassis and the second server component chassis, wherein the elastic dampening sheet is further configured to cover a portion of one side of the first server component chassis; and at least two attachment points configured to secure the elastic dampening sheet to the server rack.

Abstract: An apparatus for cooling warm air, including a rack containing one or more ventilation slots; a reservoir connected to the rack that contains a cooling solution; and a plurality of components, located within the rack, that receive and distribute the cooling solution from the reservoir. The plurality of components consist of at least one of the following structures: one or more hollow vertical louvers, one or more hollow horizontal louvers, one or more hollow diagonal louvers, and one or more hollow cylindrical louvers. Additionally, the plurality of components may comprise a flexible material that descends from a top portion of the rack, directly below the reservoir, at the same time that an activation component causes the cooling solution to flow from the reservoir into the flexible material.

Abstract: An electronic board assembly comprises a board comprising an electronic component and a connector mounted to the board and electrically connected to the electronic component. The connector is configured to receive an electronic card assembly, and the connector comprises an electrical contact and a friction contact. The electrical contact is configured to exert a first amount of force on the electronic card assembly when the electronic card assembly is being seated in the connector. The friction contact is configured to exert a second amount of force on the electronic card assembly when the electronic card assembly is being seated in the connector. The second amount of force is greater than the first amount of force.

Abstract: An electronic component assembly includes a board having an electronic component, a connector mounted to the board and electrically connected to the electronic component and having an anchoring feature positioned on an exterior of the connector, and a card having another electronic component and a securing feature. The electronic component assembly also includes a movable member positioned on one of the connector or the card. The movable member is positioned in the securing feature and contacts the anchoring feature to secure the card in a seated position in the connector, or the anchoring feature includes the movable member and contacts the securing feature to secure the card in the seated position in the connector.

Abstract: Methods and structures are provided for implementing electronic enclosure cooling containment for concurrent maintenance actions with a top cover of the electronic enclosure removed. The structure includes a moveable airflow baffle being attached to the associated electronic enclosure. During concurrent maintenance actions, the moveable airflow baffle is moved to an open position over at least a partial length of a replaceable component, without being detached or removed from the associated electronic enclosure. During normal operations, the moveable airflow baffle hangs down over at least a partial length of a replaceable component.

Abstract: A thermal interface material (TIM) structure for directing heat in a three-dimensional space including a TIM sheet. The TIM sheet includes a lower portion along a lower plane; a first side portion along a first side plane; a first upper portion along an upper plane; a first fold between the lower portion and the first side portion positioning the first side portion substantially perpendicular to the lower portion; and a second fold between the first side portion and the first upper portion positioning the first upper portion substantially perpendicular to the first side portion and substantially parallel to the lower portion.

Abstract: A heat exchange apparatus, and method of forming the apparatus, are disclosed. The apparatus includes a thermally conductive substrate with a metal microlattice structure adhered to the thermally conductive substrate and in thermal communication with the thermally conductive substrate, the metal microlattice structure comprising a region containing an electroless metal. A method of making the apparatus includes forming a polymer lattice, applying the polymer lattice to a thermally conductive substrate, forming an electroless plated metal layer on the polymer lattice, forming an electroplated metal layer on the electroless metal layer, and forming a metal microlattice of the electroless metal layer and the electroplated metal layer.

Abstract: A multi-layer thermal interface material including two or more thermal interface materials laminated together, where each of the two or more thermal interface materials comprise different mechanical properties.

Abstract: In an example, a thermal interface material (TIM) structure is disclosed. The TIM structure includes a first thermal interface material layer comprising a gap filler material and a second thermal interface material layer comprising a solid thermal pad. The TIM structure has one or more overlapping regions associated with partial overlap of a surface of the gap filler material by the solid thermal pad such that a portion of the surface is exposed.

Abstract: A heat pipe includes one or more reservoirs of liquid that are closed at lower temperatures and open at higher temperatures. The opening of the reservoirs at higher temperatures caused by higher power levels dynamically increases the amount of liquid in the heat pipe, which increases performance of the heat pipe at higher power levels. As the heat pipe cools, the liquid condenses and flows back into the reservoirs. As the heat pipe continues to cool, the reservoirs close. The result is a heat pipe that is more efficient at lower power levels and still maintains high efficiency at higher power levels due to the demand-based charging of the liquid based on temperature.